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STV2118A

STMicroelectronics

STV2118A by STMicroelectronics

STV2118A by STMicroelectronics is a color signal decoder designed for commercial applications. It operates at 9V with a max temp of 70 °C and features 42 terminals in an in-line, shrink pitch package. Ideal for converting color signals in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,898 parts In-Stock

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Digiode

USA . 3,309 parts In-Stock

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3,309

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Anansix

USA . 1,149 parts In-Stock

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1,149

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Q Components

USA . 640 parts In-Stock

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640

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ACDS - Activité Composants Distribution Service

France . 455 parts In-Stock

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455

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ECAB

Sweden . 297 parts In-Stock

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297

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ComSIT Distribution GmbH

Germany . 208 parts In-Stock

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LittleDiode

UK . 3 parts In-Stock

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IDEA Electronic Components Group

UK . 1,141 parts In-Stock

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$0.547

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$0.493

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MKK Technologies

India . 1,755 parts In-Stock

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$1.029

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DigiPath Technology Company

USA . 1,755 parts In-Stock

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$1.029

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Perfect Parts

USA . 2,733 parts In-Stock

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Kepictronics

USA . 1,380 parts In-Stock

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Parana Technologies

USA . 1,376 parts In-Stock

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$0.654

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Corphita

USA . 1,362 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,337 parts In-Stock

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Glotronic Ltd.

UK . 186 parts In-Stock

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Assy Fe

Spain . 1 parts In-Stock

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Overview

Elevate your projects with the STV2118A from STMicroelectronics, a trusted leader in high-performance electronics. This advanced color signal decoder enhances image quality for diverse applications, ensuring vibrant visuals and seamless integration. With its robust design and reliable operation, the STV2118A is perfect for consumer electronics, broadcasting, and automotive displays. Experience unmatched performance and durability that adds value to your innovations!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making the product reliable for various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization in designs, making it easier to integrate into different systems.

General IC Type: COLOR SIGNAL DECODER

As a color signal decoder, this IC is specifically designed to handle color signal processing, making it ideal for audio-visual applications.

Power Supplies (V): 9

Operating at 9V provides a balanced performance and is compatible with a variety of existing power supplies, simplifying integration.

No. of Terminals: 42

With 42 terminals, this IC supports complex circuitry and connections, allowing for greater versatility and functionality in designs.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line shrink pitch package style allows for compact designs and saves PCB space, which is crucial for modern electronics.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability in warm operating environments, suitable for a variety of settings.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this IC can function in cooler environments, broadening its range of applications.

Terminal Position: DUAL

The dual terminal position enhances connectivity options, allowing easier routing and better design flexibility.

Temperature Grade: COMMERCIAL

Commercial grade temperature specifications make this IC suitable for use in non-industrial applications where standard conditions apply.

Technology: BIPOLAR

Bipolar technology provides excellent performance characteristics, including faster switching speeds and better linearity, ideal for signal handling.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and are easier to handle in larger PCB designs, enhancing durability.

Terminal Pitch: 1.78 mm

The 1.78 mm terminal pitch facilitates stronger connections and accommodates a wide range of PCB layouts, improving manufacturing flexibility.

Technical Specifications

Color Signal Converters STV2118A attributes and parameters. Explore more Color Signal Converters devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T42

No. of Terminals:

42

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP42,.6

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

9

Qualification:

Not Qualified

Sub-Category:

Color Signal Converters

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Trade Compliance

STV2118A General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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