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TFP6022

Texas Instruments

TFP6022 by Texas Instruments

TFP6022 by Texas Instruments is a Color Signal Encoder IC with 64 terminals in a rectangular flatpack package. It supports video standards PAL and NTSC, with input types RGB, R-Y, B-Y, Y. Operating at 3.3V, it is ideal for applications requiring color signal conversion in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,526 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,526

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-

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Digiode

USA . 199 parts In-Stock

1+ parts

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100+ parts

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199

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 192 parts In-Stock

1+ parts

$2.788

100+ parts

-

1k+ parts

$3.274

10k+ parts

-

192

$2.788

-

$3.274

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ChromeModa Solutions

Germany . 6,552 parts In-Stock

1+ parts

$3.133

100+ parts

$2.569

1k+ parts

-

10k+ parts

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6,552

$3.133

$2.569

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IDEA Electronic Components Group

UK . 1,814 parts In-Stock

1+ parts

$3.133

100+ parts

-

1k+ parts

$2.820

10k+ parts

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1,814

$3.133

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$2.820

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One Stop Electronics

USA . 1,415 parts In-Stock

1+ parts

$8.800

100+ parts

-

1k+ parts

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1,415

$8.800

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AZTECH Wire

Italy . 390 parts In-Stock

1+ parts

$12.255

100+ parts

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390

$12.255

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Corphita

USA . 4,384 parts In-Stock

1+ parts

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4,384

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DigiPath Technology Company

USA . 850 parts In-Stock

1+ parts

-

100+ parts

$2.825

1k+ parts

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850

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$2.825

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Overview

Enhance your video processing experience with the TFP6022 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Color Signal Converters that are ideal for various applications. The TFP6022 offers unparalleled value, providing customers with reliable performance and seamless integration. Whether you're working with PAL or NTSC video standards, this color signal encoder is designed to meet your needs. Trust Texas Instruments to deliver innovative solutions that elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to external elements, making the product long-lasting.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design, ideal for space-constrained applications and efficient PCB layout.

General IC Type: COLOR SIGNAL ENCODER

The color signal encoder ensures accurate encoding of color signals, resulting in high-quality video output.

No. of Terminals: 64

Having 64 terminals allows for multiple input and output connections, enabling versatile compatibility with various devices and systems.

Package Style (Meter): FLATPACK

The flatpack package style offers easy integration and installation, contributing to a streamlined and organized setup.

Terminal Position: QUAD

The quad terminal position provides stability and secure connections, reducing the risk of signal loss or interference.

Video Standard: PAL; NTSC

Supporting PAL and NTSC video standards ensures compatibility with a wide range of video devices and systems, enhancing flexibility.

Minimum Supply Voltage (Vsup): 3.3 V

The low minimum supply voltage requirement of 3.3 V helps in efficient power consumption and compatibility with various power sources.

Technology: CMOS

The CMOS technology used in the product offers low power consumption, high noise immunity, and reliable performance, making it energy-efficient and durable.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering onto PCBs, ensuring secure connections and robust assembly.

Maximum Supply Voltage (Vsup): 3.3 V

The maximum supply voltage of 3.3 V provides a safe operating range for the product, preventing damage from voltage spikes or fluctuations.

Input Type: RGB; R-Y; B-Y; Y

Supporting various input types such as RGB, R-Y, B-Y, and Y allows for versatile signal processing and compatibility with different color formats.

Technical Specifications

Color Signal Converters TFP6022 attributes and parameters. Explore more Color Signal Converters devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 1.8V FOR DIGITAL CORE

General IC Type:

Input Type:

RGB; R-Y; B-Y; Y

JESD-30 Code:

R-PQFP-G64

No. of Functions:

1

No. of Terminals:

64

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

QUAD

Video Standard:

PAL; NTSC

Trade Compliance

TFP6022 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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