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TFP6024

Texas Instruments

TFP6024 by Texas Instruments

TFP6024 by Texas Instruments is a Color Signal Encoder IC with 64 terminals, supporting PAL and NTSC video standards. Operating at 3.3V, it accepts RGB, R-Y, B-Y, Y inputs for color signal conversion. This CMOS technology device comes in a rectangular flatpack package ideal for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,799 parts In-Stock

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5,799

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Digiode

USA . 1,235 parts In-Stock

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1,235

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 963 parts In-Stock

1+ parts

$2.394

100+ parts

-

1k+ parts

$2.892

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963

$2.394

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$2.892

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DigiPath Technology Company

USA . 1,737 parts In-Stock

1+ parts

$2.636

100+ parts

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1,737

$2.636

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ChromeModa Solutions

Germany . 3,688 parts In-Stock

1+ parts

$2.690

100+ parts

$2.206

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3,688

$2.690

$2.206

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IDEA Electronic Components Group

UK . 1,409 parts In-Stock

1+ parts

$2.690

100+ parts

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$2.421

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1,409

$2.690

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$2.421

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One Stop Electronics

USA . 467 parts In-Stock

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$7.800

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467

$7.800

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AZTECH Wire

Italy . 745 parts In-Stock

1+ parts

$12.299

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745

$12.299

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Corphita

USA . 4,544 parts In-Stock

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Overview

Upgrade your video signal processing with the TFP6024 by Texas Instruments. Known for their top-quality products, Texas Instruments delivers reliable color signal converters that are perfect for a variety of applications. Whether you're looking to enhance your home entertainment system or improve the visual quality of your professional presentations, the TFP6024 is the solution you need. With its advanced technology and user-friendly design, this color signal encoder offers unmatched value and performance. Trust Texas Instruments to provide the tools you need to take your video experience to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the converter, making it long-lasting and reliable.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into various electronic devices and systems.

Package Shape: RECTANGULAR

Rectangular package shape makes it easy to fit into compact spaces or circuit designs.

General IC Type: COLOR SIGNAL ENCODER

Color signal encoder ensures accurate and high-quality conversion of color signals for optimal display output.

No. of Terminals: 64

64 terminals provide multiple connection points for versatile input and output options.

Package Style (Meter): FLATPACK

Flatpack design allows for efficient heat dissipation and space-saving installation.

Terminal Position: QUAD

Quad terminal position offers stable and secure connections for long-term performance.

Video Standard: PAL; NTSC

Support for PAL and NTSC video standards ensures compatibility with various devices and systems.

Minimum Supply Voltage (Vsup): 3.3 V

Low minimum supply voltage requirement allows for energy-efficient operation and reduces power consumption.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliable performance for efficient signal processing.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support and easy soldering for secure connections.

Maximum Supply Voltage (Vsup): 3.3 V

Maximum supply voltage of 3.3 V ensures safe operation and protects the internal components from potential damage.

Input Type: RGB; R-Y; B-Y; Y

Support for various input types allows for versatile signal conversion and compatibility with different color signal sources.

Technical Specifications

Color Signal Converters TFP6024 attributes and parameters. Explore more Color Signal Converters devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 1.8V FOR DIGITAL CORE

General IC Type:

Input Type:

RGB; R-Y; B-Y; Y

JESD-30 Code:

R-PQFP-G64

No. of Functions:

1

No. of Terminals:

64

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

QUAD

Video Standard:

PAL; NTSC

Trade Compliance

TFP6024 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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