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TDA8505

NXP Semiconductors

TDA8505 by NXP Semiconductors

COLOR SIGNAL ENCODER; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 32; Package Code: SDIP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,678 parts In-Stock

1+ parts

-

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3,678

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Anansix

USA . 2,634 parts In-Stock

1+ parts

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1k+ parts

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2,634

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Vyrian

USA . 263 parts In-Stock

1+ parts

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263

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ECAB

Sweden . 16 parts In-Stock

1+ parts

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16

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LittleDiode

UK . 4 parts In-Stock

1+ parts

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 797 parts In-Stock

1+ parts

$18.800

100+ parts

-

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10k+ parts

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797

$18.800

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Corphita

USA . 3,196 parts In-Stock

1+ parts

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3,196

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Assy Fe

Spain . 1,112 parts In-Stock

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1,112

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UNI Independent Distributors

Spain . 785 parts In-Stock

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785

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Perfect Parts

USA . 356 parts In-Stock

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356

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Cyclops Electronics Ltd (Excess)

UK . 159 parts In-Stock

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159

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Technical Specifications

Color Signal Converters TDA8505 attributes and parameters. Explore more Color Signal Converters devices from NXP Semiconductors

Specs

Additional Features:

INPUT TYPE CAN ALSO ACCEPTS -(R-Y); -(B-Y); Y

General IC Type:

Input Type:

RGB

JESD-30 Code:

R-PDIP-T32

JESD-609 Code:

e3/e4

Length:

28.95 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP32,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Sub-Category:

Color Signal Converters

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Video Standard:

SECAM

Width:

10.16 mm

Trade Compliance

TDA8505 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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