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TEA5640C

STMicroelectronics

TEA5640C by STMicroelectronics

TEA5640C by STMicroelectronics is a COLOR SIGNAL DECODER IC with 12V power supply, 28 terminals, and max operating temp of 70 °C. It is used in commercial applications for color signal conversion due to its bipolar technology and through-hole terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Vyrian

USA . 4,124 parts In-Stock

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Digiode

USA . 3,722 parts In-Stock

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ECAB

Sweden . 1,087 parts In-Stock

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Anansix

USA . 776 parts In-Stock

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Q Components

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Fibra_Brandt Electronic GMBH

Germany . 10 parts In-Stock

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LittleDiode

UK . 6 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 5 parts In-Stock

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IDEA Electronic Components Group

UK . 2,004 parts In-Stock

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$3.124

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$2.812

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MKK Technologies

India . 2,086 parts In-Stock

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$5.875

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DigiPath Technology Company

USA . 2,086 parts In-Stock

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$5.875

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A-Z Elektronik GmbH

Germany . 5,856 parts In-Stock

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Corphita

USA . 2,161 parts In-Stock

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Parana Technologies

USA . 1,347 parts In-Stock

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Assy Fe

Spain . 56 parts In-Stock

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Overview

Enhance your viewing experience with the TEA5640C by STMicroelectronics, a top-of-the-line Color Signal Decoder that delivers unparalleled quality and performance. Manufactured by the trusted brand STMicroelectronics, this product offers a wide range of applications in the electronics industry. With its innovative technology and reliable components, the TEA5640C provides customers with exceptional value, benefits, and advantages. Upgrade your entertainment system today with this cutting-edge solution that promises to exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications while ensuring longevity.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient packaging and easy integration into existing systems.

General IC Type: COLOR SIGNAL DECODER

The color signal decoder ensures accurate decoding of color signals, providing high-quality output.

Power Supplies (V): 12

Operating at 12V provides a reliable power source for the converter, ensuring stable performance.

No. of Terminals: 28

Having 28 terminals allows for versatile connectivity options, making it compatible with a wide range of devices.

Package Style (Meter): IN-LINE

The in-line package style offers easy installation and space-saving design, making it convenient for various setups.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the converter can function effectively in different environmental conditions.

Minimum Operating Temperature: 0 °C

The converter can still operate at temperatures as low as 0 °C, ensuring reliable performance even in colder environments.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good solderability and ensures secure connections for stable operation.

Terminal Position: DUAL

Dual terminal position allows for better stability and reliability in connection, reducing the risk of disconnection or signal loss.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the converter is suitable for standard commercial use with consistent performance.

Technology: BIPOLAR

Bipolar technology offers excellent signal processing capabilities, ensuring accurate decoding and output of color signals.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides strong mechanical support and ease of soldering, ensuring reliable connections in the long run.

Maximum Supply Current: 120 mA

The converter can handle a maximum supply current of 120 mA, ensuring stable operation and preventing overload issues.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy PCB mounting and connection, making installation and maintenance hassle-free.

Technical Specifications

Color Signal Converters TEA5640C attributes and parameters. Explore more Color Signal Converters devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e0

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Color Signal Converters

Maximum Supply Current:

120 mA

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TEA5640C General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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