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TEA5640B

STMicroelectronics

TEA5640B by STMicroelectronics

TEA5640B by STMicroelectronics is a color signal decoder IC with 12V power supply, 28 terminals, and max operating temp of 70 °C. It is used in applications requiring color signal conversion, featuring a plastic/epoxy package body and through-hole terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,037 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

4,037

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-

-

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Digiode

USA . 2,208 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,208

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-

-

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Anansix

USA . 1,725 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,725

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,292 parts In-Stock

1+ parts

$3.617

100+ parts

-

1k+ parts

$3.256

10k+ parts

-

1,292

$3.617

-

$3.256

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MKK Technologies

India . 519 parts In-Stock

1+ parts

$6.802

100+ parts

-

1k+ parts

-

10k+ parts

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519

$6.802

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-

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DigiPath Technology Company

USA . 519 parts In-Stock

1+ parts

$6.802

100+ parts

-

1k+ parts

-

10k+ parts

-

519

$6.802

-

-

-

Corphita

USA . 4,528 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,528

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Parana Technologies

USA . 254 parts In-Stock

1+ parts

-

100+ parts

$4.325

1k+ parts

-

10k+ parts

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254

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$4.325

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Overview

Unlock the vibrant world of color with the TEA5640B by STMicroelectronics. Crafted with precision and expertise, this color signal converter offers unparalleled quality and reliability. Whether you're designing a television, monitor, or multimedia system, this versatile decoder is your go-to solution. With its advanced technology and commercial-grade temperature tolerance, the TEA5640B ensures seamless performance in any application. Elevate your projects with the value and benefits that only STMicroelectronics can deliver. Explore endless possibilities and create captivating visual experiences with the TEA5640B.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring a longer lifespan for the product.

Package Shape: RECTANGULAR

The rectangular shape allows for easy installation and integration into existing systems or setups.

General IC Type: COLOR SIGNAL DECODER

Being a color signal decoder, this product is designed specifically to accurately interpret and decode color signals, ensuring precise and high-quality video output.

Power Supplies (V): 12

Operating at 12V, this product is compatible with standard power supplies commonly found in various setups and environments.

No. of Terminals: 28

With 28 terminals, this product offers flexibility in connectivity and compatibility with a wide range of devices and systems.

Package Style (Meter): IN-LINE

The in-line package style makes installation and wiring neat and organized, simplifying the setup process.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures reliable performance even in demanding conditions or environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0 °C allows for reliable operation in a wide range of temperature conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good solderability and ensures a secure electrical connection.

Terminal Position: DUAL

Dual terminal position offers redundancy and ensures reliable connectivity, reducing the risk of signal loss or disruption.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets industry standards for temperature performance and reliability.

Technology: BIPOLAR

The bipolar technology used in this product ensures stable and accurate signal processing, resulting in high-quality video output.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides reliable mechanical support and secure connections, ideal for applications where vibration or movement is a concern.

Maximum Supply Current: 120 mA

With a maximum supply current of 120 mA, this product operates efficiently without drawing excessive power, making it cost-effective to use.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy and precise connections, facilitating quick and hassle-free installation.

Technical Specifications

Color Signal Converters TEA5640B attributes and parameters. Explore more Color Signal Converters devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e0

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Color Signal Converters

Maximum Supply Current:

120 mA

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TEA5640B General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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