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TVP5150AM1PBSG4

Texas Instruments

TVP5150AM1PBSG4 by Texas Instruments

TVP5150AM1PBSG4 by Texas Instruments is a color signal decoder with 32 terminals, operating at temperatures from 0 to 70°C. It supports video standards PAL, NTSC, and SECAM, with input types R-Y, B-Y, Y. Ideal for applications requiring precise color signal conversion in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 18,060 parts In-Stock

1+ parts

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18,060

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Vyrian

USA . 8,174 parts In-Stock

1+ parts

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8,174

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Digiode

USA . 545 parts In-Stock

1+ parts

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545

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Prism Electronics

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 750 parts In-Stock

1+ parts

$2.270

100+ parts

-

1k+ parts

$2.771

10k+ parts

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750

$2.270

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$2.771

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ChromeModa Solutions

Germany . 4,087 parts In-Stock

1+ parts

$2.550

100+ parts

$2.091

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4,087

$2.550

$2.091

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IDEA Electronic Components Group

UK . 191 parts In-Stock

1+ parts

$2.550

100+ parts

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$2.295

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191

$2.550

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$2.295

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AZTECH Wire

Italy . 871 parts In-Stock

1+ parts

$13.635

100+ parts

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871

$13.635

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One Stop Electronics

USA . 1,449 parts In-Stock

1+ parts

$21.800

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1,449

$21.800

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DigiPath Technology Company

USA . 1,588 parts In-Stock

1+ parts

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$2.299

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1,588

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$2.299

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Corphita

USA . 1,350 parts In-Stock

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1,350

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Perfect Parts

USA . 4 parts In-Stock

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4

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Overview

Experience vibrant and crystal-clear color signals with the TVP5150AM1PBSG4 by Texas Instruments. With a reputation for quality and innovation, Texas Instruments delivers top-notch products like this color signal converter that is perfect for a wide range of applications. Whether you're in need of decoding PAL, NTSC, or SECAM video standards, this versatile IC type offers superior performance and reliability. Trust Texas Instruments to provide cutting-edge technology that brings value and benefits to your projects. Elevate your design with the TVP5150AM1PBSG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

General IC Type: COLOR SIGNAL DECODER

As a color signal decoder, this product is designed specifically for processing and decoding color signals accurately, ensuring high-quality video output.

Power Supplies (V): 1.8,3.3

Offering multiple power supply options makes the product versatile and compatible with different voltage requirements, enhancing its usability in various setups.

Video Standard: PAL;NTSC;SECAM

Supporting multiple video standards allows for compatibility with different signal formats, making this color signal converter a versatile solution for different regions and systems.

Technical Specifications

Color Signal Converters TVP5150AM1PBSG4 attributes and parameters. Explore more Color Signal Converters devices from Texas Instruments

Specs

General IC Type:

Input Type:

R-Y; B-Y; Y

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP32,.28SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Color Signal Converters

Maximum Supply Current:

32.9 mA

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Video Standard:

PAL;NTSC;SECAM

Width:

5 mm

Trade Compliance

TVP5150AM1PBSG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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