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STUSB4710DTR

STMicroelectronics

STUSB4710DTR by STMicroelectronics

STUSB4710DTR from STMicroelectronics is a versatile power management IC with a nominal voltage of 5V and operates in temperatures from -40 °C to 105 °C. It features 3 channels, adjustable thresholds, and comes in a compact 16-terminal package. Ideal for industrial applications requiring reliable power supply support.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,094 parts In-Stock

1+ parts

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3,094

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Anansix

USA . 1,338 parts In-Stock

1+ parts

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1k+ parts

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1,338

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Digiode

USA . 1,274 parts In-Stock

1+ parts

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1,274

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,057 parts In-Stock

1+ parts

$18.111

100+ parts

-

1k+ parts

$16.300

10k+ parts

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2,057

$18.111

-

$16.300

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MKK Technologies

India . 622 parts In-Stock

1+ parts

$34.057

100+ parts

-

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622

$34.057

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DigiPath Technology Company

USA . 622 parts In-Stock

1+ parts

$34.057

100+ parts

-

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10k+ parts

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622

$34.057

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Corphita

USA . 3,268 parts In-Stock

1+ parts

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3,268

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Parana Technologies

USA . 1,362 parts In-Stock

1+ parts

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100+ parts

$21.655

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1,362

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$21.655

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Overview

Elevate your designs with the STUSB4710DTR from STMicroelectronics, a leading innovator in power management solutions. This robust IC delivers unparalleled performance for diverse applications, ensuring reliability across industrial environments with temperatures ranging from -40 °C to 105 °C. With its compact size and advanced features, it seamlessly integrates into your projects, enhancing efficiency and stability while delivering outstanding value for your investment. Experience the difference in quality and innovation that only STMicroelectronics can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and lightweight design, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern circuit boards.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient use of PCB space and optimal RF performance.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5 V is standard for many electronic devices, making it versatile for various applications.

No. of Terminals: 16

With 16 terminals, this IC provides ample connectivity options for a range of configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces footprint, ideal for space-constrained designs.

Maximum Operating Temperature: 105 °C

A maximum operating temperature of 105 °C ensures reliability in high-temperature environments.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C allows this IC to perform in extreme cold conditions.

Terminal Position: DUAL

Dual terminal positioning helps in enhancing the layout flexibility for circuit design.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm contributes to a sleek and low-profile design.

Width: 3.9 mm

A narrow width of 3.9 mm enhances compactness and integration into tight spaces.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power supply support, this IC is ideal for various power management tasks.

Minimum Supply Voltage (Vsup): 4.1 V

A minimum supply voltage of 4.1 V allows for flexible power source options.

Length: 9.9 mm

A moderate length of 9.9 mm strikes a balance between performance and size.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature, this IC is suitable for harsh environmental conditions.

No. of Channels: 3

With 3 channels, this IC can manage multiple outputs efficiently.

Terminal Form: GULL WING

Gull wing terminals provide strong soldering contact and reliable electrical connections.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for easy handling and placement in automated processes.

Maximum Supply Voltage (Vsup): 22 V

The capacity to handle up to 22 V makes this IC suitable for a wide range of high-performance applications.

Adjustable Threshold: YES

The adjustable threshold feature offers flexibility in the design, allowing the user to tailor performance parameters.

Technical Specifications

Power Management ICs STUSB4710DTR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

22 V

Minimum Supply Voltage (Vsup):

4.1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

STUSB4710DTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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