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STUSBCD01BJR

STMicroelectronics

STUSBCD01BJR by STMicroelectronics

STUSBCD01BJR from STMicroelectronics is a compact power management IC designed for industrial applications. It operates b/w -40 °C to 85 °C, with a nominal voltage of 4.2V and supports up to 1mA current. Its rectangular grid array package ensures efficient surface mounting.

Median Price

$2.970

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,886 parts In-Stock

1+ parts

$2.970

100+ parts

$1.780

1k+ parts

$1.660

10k+ parts

$1.090

4,886

$2.970

$1.780

$1.660

$1.090

DigiKey

USA . 802 parts In-Stock

1+ parts

$2.970

100+ parts

$1.828

1k+ parts

$1.622

10k+ parts

$1.095

802

$2.970

$1.828

$1.622

$1.095

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 962 parts In-Stock

1+ parts

$2.907

100+ parts

-

1k+ parts

-

10k+ parts

-

962

$2.907

-

-

-

Vyrian

USA . 3,090 parts In-Stock

1+ parts

$3.060

100+ parts

-

1k+ parts

-

10k+ parts

-

3,090

$3.060

-

-

-

Sensible Micro Corp

USA . 88,520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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88,520

-

-

-

-

ComSIT Distribution GmbH

Germany . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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8,000

-

-

-

-

Anansix

USA . 2,881 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,881

-

-

-

-

Cyclops Electronics Ltd

UK . 1,294 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,294

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 514 parts In-Stock

1+ parts

$2.754

100+ parts

-

1k+ parts

-

10k+ parts

-

514

$2.754

-

-

-

IDEA Electronic Components Group

UK . 1,500 parts In-Stock

1+ parts

$8.813

100+ parts

-

1k+ parts

$7.931

10k+ parts

-

1,500

$8.813

-

$7.931

-

Microchip USA

USA . 6,369 parts In-Stock

1+ parts

$11.716

100+ parts

-

1k+ parts

-

10k+ parts

-

6,369

$11.716

-

-

-

MKK Technologies

India . 79 parts In-Stock

1+ parts

$16.572

100+ parts

-

1k+ parts

-

10k+ parts

-

79

$16.572

-

-

-

DigiPath Technology Company

USA . 79 parts In-Stock

1+ parts

$16.572

100+ parts

-

1k+ parts

-

10k+ parts

-

79

$16.572

-

-

-

Perfect Parts

USA . 22,366 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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22,366

-

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Kepictronics

USA . 5,470 parts In-Stock

1+ parts

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5,470

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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5,000

-

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Parana Technologies

USA . 138 parts In-Stock

1+ parts

-

100+ parts

$10.537

1k+ parts

-

10k+ parts

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138

-

$10.537

-

-

Overview

Unlock the potential of your designs with the STUSBCD01BJR from STMicroelectronics, a leader in innovative power management solutions. This compact, robust IC is engineered for reliability across diverse applications, ensuring optimal performance even in challenging environments. With its superior thermal range and efficient power handling, you'll enjoy enhanced system stability and energy savings. Elevate your projects with STMicroelectronics' commitment to quality and cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and reliability under various environmental conditions, making this IC suitable for long-lasting applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient assembly, ideal for modern electronic devices where space is at a premium.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, allowing for better layout configurations and improved performance.

Nominal Supply Voltage (Vsup): 4.2 V

A nominal supply voltage of 4.2 V fits perfectly within various standard applications, ensuring compatibility with a wide range of devices.

Power Supplies (V): 4.2

Having a specified power supply voltage of 4.2 V indicates stable performance across different operating conditions.

No. of Terminals: 12

With 12 terminals, this IC offers flexibility in connectivity and functionality, allowing for integration into various applications.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates better thermal performance and electrical connections, enhancing overall efficiency.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C makes this IC suitable for industrial environments where heat dissipation is critical.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is capable of functioning in extreme cold, making it ideal for diverse applications.

Terminal Position: BOTTOM

Bottom terminal position allows for advantageous PCB layout and assembly processes, contributing to overall design efficiency.

Maximum Seated Height: 0.6 mm

A low maximum seated height of 0.6 mm ensures a compact form factor, essential for today's miniaturized electronic designs.

Width: 1.202 mm

A narrow width of 1.202 mm helps in saving space on the PCB, enabling more components to be increased on the board.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit means this IC is specifically designed to enhance power management, improving overall system efficiency.

Minimum Supply Voltage (Vsup): 2.2 V

The minimum supply voltage of 2.2 V ensures compatibility with lower voltage systems, widening the scope of potential applications.

Length: 1.593 mm

A compact length of 1.593 mm makes it suitable for high-density circuit designs, facilitating the trend towards smaller electronic devices.

Nominal Threshold Voltage (V): +1V

A nominal threshold voltage of +1V allows for effective signal detection and processing, enhancing the IC's performance characteristics.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates reliability and robustness in harsh operating conditions, suitable for a variety of demanding applications.

Maximum Supply Current (Isup): 1 mA

With a maximum supply current of just 1 mA, this IC is energy-efficient, helping to extend battery life in portable applications.

Terminal Form: BALL

Ball terminal form provides excellent solder joint reliability and thermal performance, ensuring long-term stability in electronic assemblies.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4 mm is conducive to high-density layouts, allowing for more components to be placed closer together on the PCB.

Maximum Supply Voltage (Vsup): 4.5 V

A maximum supply voltage of 4.5 V ensures flexibility and compatibility with various power source configurations, broadening application potential.

Technical Specifications

Power Management ICs STUSBCD01BJR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

DETECTOR THRESHOLD VOLTAGE IS 1V

Adjustable Threshold:

NO

JESD-30 Code:

R-PBGA-B12

Length:

1.593 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA12,3X4,16

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

4.2

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1 mA

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage (Vsup):

4.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+1V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.202 mm

Trade Compliance

STUSBCD01BJR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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