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STUSB4710Q1TR

STMicroelectronics

STUSB4710Q1TR by STMicroelectronics

STUSB4710Q1TR from STMicroelectronics is a versatile power management IC with a 5V nominal voltage, supporting up to 22V. It features a compact square package with 16 terminals and operates in extreme temperatures from -40 °C to 105 °C. Ideal for industrial applications, it offers adjustable thresholds and three channels for efficient power supply support.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,363 parts In-Stock

1+ parts

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2,363

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Digiode

USA . 1,161 parts In-Stock

1+ parts

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1,161

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Anansix

USA . 958 parts In-Stock

1+ parts

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958

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 742 parts In-Stock

1+ parts

$2.297

100+ parts

-

1k+ parts

$2.068

10k+ parts

-

742

$2.297

-

$2.068

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MKK Technologies

India . 180 parts In-Stock

1+ parts

$4.320

100+ parts

-

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180

$4.320

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DigiPath Technology Company

USA . 180 parts In-Stock

1+ parts

$4.320

100+ parts

-

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180

$4.320

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Corphita

USA . 4,991 parts In-Stock

1+ parts

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4,991

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Parana Technologies

USA . 1,680 parts In-Stock

1+ parts

-

100+ parts

$2.747

1k+ parts

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1,680

-

$2.747

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Overview

Elevate your design with the STUSB4710Q1TR from STMicroelectronics, a leader in innovative power management solutions. This compact, high-performance IC ensures reliable operation across diverse applications—from automotive to industrial devices—while maintaining exceptional quality and durability. With its advanced thermal characteristics and adjustable thresholds, it empowers engineers to optimize efficiency and extend product life, delivering unmatched value for your projects.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient use of board space and simplifies the manufacturing process, making it ideal for compact applications.

Package Shape: SQUARE

A square package shape facilitates uniform heat distribution and simplifies PCB layout, which enhances the reliability of the product.

Nominal Supply Voltage (Vsup): 5 V

With a nominal supply voltage of 5 V, this IC is well-suited for a wide range of standard power supply applications.

No. of Terminals: 16

The 16 terminals provide multiple connection points for flexible integration into various system designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style allows for effective thermal management and is suitable for systems with space constraints.

Maximum Operating Temperature: 105 °C

An operational range up to 105 °C ensures reliability in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is ideal for extreme conditions, ensuring functionality in a wide range of applications.

Terminal Position: QUAD

The quad terminal position allows for better signal integrity and ease of routing on the PCB, optimizing performance.

Maximum Seated Height: 0.65 mm

A low seated height minimizes the overall profile of the assembly, allowing for compact designs in space-restricted applications.

Width: 3 mm

The narrow width makes it an ideal candidate for densely populated circuit boards, maximizing design efficiency.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, it enhances power management, ensuring stable operation of downstream components.

Minimum Supply Voltage (Vsup): 4.1 V

With a minimum supply voltage of 4.1 V, this IC can operate effectively in low-voltage applications, increasing its versatility.

Length: 3 mm

The compact length allows it to fit easily into tight spaces, making it suitable for miniature design applications.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this temperature grade ensures durability and reliability in demanding environments.

No. of Channels: 3

Having three channels enables efficient power management for multiple devices, simplifying circuit design for complex systems.

Terminal Form: NO LEAD

The no-lead terminal form enhances the surface mount capability and allows for a smaller footprint on the PCB.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5 mm provides a compact layout option and helps in designs that require high density.

Maximum Supply Voltage (Vsup): 22 V

The capability to support up to 22 V allows the IC to operate in high-voltage circuits, enhancing its application range.

Adjustable Threshold: YES

With an adjustable threshold feature, this IC offers customization for specific applications, providing greater flexibility in design.

Technical Specifications

Power Management ICs STUSB4710Q1TR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.2SQ,32

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.65 mm

Maximum Supply Voltage (Vsup):

22 V

Minimum Supply Voltage (Vsup):

4.1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

STUSB4710Q1TR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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