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STP6NB90

STMicroelectronics

STP6NB90 by STMicroelectronics

STP6NB90 by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 900V breakdown voltage, 5.8A max drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,702 parts In-Stock

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4,702

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Zilex Electronics Inc.

Canada . 3,900 parts In-Stock

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3,900

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Digiode

USA . 2,558 parts In-Stock

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Anansix

USA . 398 parts In-Stock

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398

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GES GmbH

Germany . 43 parts In-Stock

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Electronics Depot

USA . 11 parts In-Stock

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Prism Electronics

USA . 10 parts In-Stock

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IDEA Electronic Components Group

UK . 2,067 parts In-Stock

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$1.113

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$1.002

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$1.113

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$1.002

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MKK Technologies

India . 1,728 parts In-Stock

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$2.093

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DigiPath Technology Company

USA . 1,728 parts In-Stock

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$2.093

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$2.093

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AZTECH Wire

Italy . 537 parts In-Stock

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$12.100

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537

$12.100

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Alle Elektronik GmbH

Germany . 4,951 parts In-Stock

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Corphita

USA . 1,068 parts In-Stock

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Parana Technologies

USA . 369 parts In-Stock

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$1.331

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Perfect Parts

USA . 67 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Unlock the power of innovation with the STP6NB90 from STMicroelectronics, a leader in semiconductor technology. This high-quality N-channel Power FET excels in demanding applications, delivering exceptional efficiency and reliability for your switching needs. With robust performance and superior thermal management, it’s designed to enhance your systems while reducing energy costs. Trust in STMicroelectronics for solutions that empower your projects and drive success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and thermal stability, making this FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance in terms of switching speed and efficiency, making them ideal for high-speed applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode offers added protection and improves the reliability of the circuit design, reducing component count.

Transistor Application: SWITCHING

Optimized for switching applications, this FET provides fast response times, essential for modern electronic devices.

Minimum DS Breakdown Voltage: 900 V

This high breakdown voltage enhances robustness, allowing the FET to be used in high-voltage applications.

Package Shape: RECTANGULAR

Rectangular packaging allows for efficient layout in PCBs, facilitating easier integration and improved space management.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and better thermal contact, making this FET reliable in demanding environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode offers higher switch speeds and lower on-resistance, optimizing efficiency in power applications.

Maximum Pulsed Drain Current (IDM): 23 A

The capability to handle high pulsed drain currents makes this FET suitable for dynamic load conditions and transient applications.

Avalanche Energy Rating (EAS): 250 mJ

This rating indicates the ability to withstand energy peaks, enhancing the FET's reliability under fault conditions.

Maximum Drain Current (Abs) (ID): 5.8 A

With a maximum drain current rating of 5.8 A, this FET is robust for power applications, allowing for efficient operation.

No. of Terminals: 3

The three-terminal design provides a simple interface for circuit connections and is standard for many applications.

Maximum Power Dissipation (Abs): 135 W

A high power dissipation rating enables the FET to operate efficiently in high-power applications without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mounting ensures stability and effective heat dissipation, making it suitable for environments where robustness is essential.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides low gate drive power and high scalability, making this FET ideal for efficient circuit designs.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C allows the FET to function reliably in high-temperature environments.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material that ensures good performance and availability.

Terminal Finish: TIN LEAD

Tin lead finish enhances solderability and improves long-term reliability in electronic assemblies.

Maximum Drain Current (ID): 5.8 A

This repeated rating confirms the FET's capability to handle substantial currents, enhancing design flexibility.

Maximum Drain-Source On Resistance: 2 ohm

Low on-resistance contributes to reduced power loss during operation, making the FET efficient in power applications.

Terminal Position: SINGLE

Single terminal position simplifies the layout and design process, making it versatile for various applications.

Technical Specifications

Power Field Effect Transistors (FET) STP6NB90 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH VOLTAGE

Avalanche Energy Rating (EAS):

250 mJ

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (Abs) (ID):

5.8 A

Maximum Drain Current (ID):

5.8 A

Maximum Drain-Source On Resistance:

2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

23 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP6NB90 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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