Loading...

STP23NM60N

STMicroelectronics

STP23NM60N by STMicroelectronics

STP23NM60N by STMicroelectronics is an N-channel MOSFET ideal for switching applications, featuring a 600V breakdown voltage and a max drain current of 19A. It offers a low on-resistance of 0.18Ω and operates at up to 150 °C. This robust FET is suitable for high-power circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,815 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,815

-

-

-

-

Digiode

USA . 3,965 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,965

-

-

-

-

Anansix

USA . 2,024 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,024

-

-

-

-

Zilex Electronics Inc.

Canada . 13 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 616 parts In-Stock

1+ parts

$1.670

100+ parts

-

1k+ parts

$1.503

10k+ parts

-

616

$1.670

-

$1.503

-

MKK Technologies

India . 1,413 parts In-Stock

1+ parts

$3.140

100+ parts

-

1k+ parts

-

10k+ parts

-

1,413

$3.140

-

-

-

DigiPath Technology Company

USA . 1,413 parts In-Stock

1+ parts

$3.140

100+ parts

-

1k+ parts

-

10k+ parts

-

1,413

$3.140

-

-

-

AZTECH Wire

Italy . 84 parts In-Stock

1+ parts

$17.850

100+ parts

-

1k+ parts

-

10k+ parts

-

84

$17.850

-

-

-

Kepictronics

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,705 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,705

-

-

-

-

Alle Elektronik GmbH

Germany . 3,458 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,458

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Parana Technologies

USA . 1,466 parts In-Stock

1+ parts

-

100+ parts

$1.996

1k+ parts

-

10k+ parts

-

1,466

-

$1.996

-

-

Corphita

USA . 1,089 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,089

-

-

-

-

Perfect Parts

USA . 725 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

725

-

-

-

-

Overview

Experience unparalleled performance with the STP23NM60N from STMicroelectronics, a leader in innovative semiconductor solutions. This exceptional N-channel power FET is engineered for efficient switching applications, delivering reliability and long-lasting durability that professionals trust. Ideal for high-voltage projects, it enhances system efficiency while minimizing heat output. Choose STMicroelectronics for superior quality and unmatched value in your designs—where innovation meets excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material offers excellent protection and insulation, making the product reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs provide higher efficiency and speed, ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and improves reliability in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching operations, this FET enhances performance in power management systems.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage ensures reliability in high-voltage applications, protecting against voltage spikes.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on PCBs, facilitating easier integration.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and reliability in various mounting environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for low power consumption and efficient switching characteristics.

Maximum Pulsed Drain Current (IDM): 76 A

The high pulsed drain current indicates the capability to handle significant power surges, making it ideal for demanding applications.

Avalanche Energy Rating (EAS): 700 mJ

A high avalanche energy rating allows the device to safely handle inductive loads without failure.

Maximum Drain Current (Abs) (ID): 19 A

The maximum drain current rating is suitable for various power applications, ensuring efficient performance.

No. of Terminals: 3

With three terminals, this FET is versatile for a range of circuit configurations and designs.

Maximum Power Dissipation (Abs): 150 W

A high power dissipation capability allows the FET to operate under demanding thermal conditions.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides added stability and ease of attachment in various applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables low gate drive power, improving circuit efficiency and responsiveness.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures reliability in extreme environments, suitable for industrial applications.

Transistor Element Material: SILICON

Silicon is widely used for its excellent electrical properties, providing consistent performance.

Terminal Finish: TIN

Tin finish provides good conductivity and corrosion resistance, enhancing reliability over time.

Maximum Drain Current (ID): 19 A (repeated)

With a maximum drain current rating of 19 A, this FET is efficient for various medium power applications.

Maximum Drain-Source On Resistance: 0.18 ohm

Low on-resistance indicates minimal energy loss during operation, improving overall efficiency.

Terminal Position: SINGLE

The single terminal position simplifies circuit layout and design, making it user-friendly.

Technical Specifications

Power Field Effect Transistors (FET) STP23NM60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

700 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

19 A

Maximum Drain Current (ID):

19 A

Maximum Drain-Source On Resistance:

.18 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

76 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP23NM60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20