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STP08CL596M

STMicroelectronics

STP08CL596M by STMicroelectronics

STP08CL596M from STMicroelectronics is a CMOS LED display driver designed for automotive applications. It operates at 3-3.6V, supports serial data input, and features a max temp of 125 °C. Ideal for driving 7-segment displays with a compact SO package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,766 parts In-Stock

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6,766

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Digiode

USA . 2,967 parts In-Stock

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2,967

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Anansix

USA . 2,118 parts In-Stock

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2,118

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 18 parts In-Stock

1+ parts

$9.716

100+ parts

$8.842

1k+ parts

$7.967

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-

18

$9.716

$8.842

$7.967

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Microchip USA

USA . 279 parts In-Stock

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$10.923

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279

$10.923

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IDEA Electronic Components Group

UK . 1,442 parts In-Stock

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$12.963

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$11.667

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1,442

$12.963

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$11.667

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AZTECH Wire

Italy . 1,038 parts In-Stock

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$13.070

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1,038

$13.070

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MKK Technologies

India . 366 parts In-Stock

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$24.376

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366

$24.376

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DigiPath Technology Company

USA . 366 parts In-Stock

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$24.376

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366

$24.376

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Component Stockers USA

USA . 797 parts In-Stock

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$99.990

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797

$99.990

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Corphita

USA . 4,943 parts In-Stock

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4,943

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Parana Technologies

USA . 1,938 parts In-Stock

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$15.499

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1,938

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$15.499

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Overview

Elevate your designs with the STP08CL596M from STMicroelectronics—a powerhouse in graphics display drivers. Renowned for exceptional quality and reliability, STMicroelectronics brings you a compact solution perfect for automotive applications, delivering vibrant visuals with minimal power consumption. Enjoy seamless integration and enhanced performance that cater to various display needs, ensuring your projects shine brightly while staying energy-efficient. Unlock innovation today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material enhances durability and reduces the overall weight, making the product suitable for automotive applications.

Display Mode: SEGMENT

The segment display mode allows for clear readability and efficient representation of numeric data, which is essential for many automotive and consumer display applications.

Data Input Mode: SERIAL

Serial data input mode simplifies the connection and communication with microcontrollers, optimizing performance and reducing complexity in design.

Surface Mount: YES

Surface mount technology contributes to decreased board space and allows for automated assembly, leading to more compact product designs.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6V ensures compatibility with a variety of low-power systems, making it versatile for different applications.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used, ensuring easier integration into printed circuit boards (PCBs) and standardizing manufacturing processes.

Power Supplies (V): 3.3

Operating at a nominal power supply of 3.3V is ideal for modern electronic devices, allowing efficient energy consumption and prolonged battery life.

No. of Terminals: 16

With 16 terminals, the product provides sufficient connectivity options while maintaining compactness, beneficial for various designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style aids in minimizing real estate on PCBs, facilitating more compact and efficient electronic designs.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3V provides flexibility in power supply choices, accommodating a range of applications with different power requirements.

Maximum Operating Temperature: 125 °C

Rated for high temperatures up to 125 °C, this product is suitable for automotive and industrial environments where thermal stability is crucial.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C ensures reliability in extreme conditions, suitable for outdoor and harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances solderability and corrosion resistance, ensuring long-lasting connections for reliable performance.

Terminal Position: DUAL

The dual terminal position design offers flexibility in PCB design and layout, enabling efficient use of space.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm contributes to a slim profile that fits in tightly packed electronic devices.

Width: 3.9 mm

At 3.9 mm wide, the component is compact, facilitating integration into space-constrained designs.

Length: 9.9 mm

The length of 9.9 mm keeps the component small and manageable, allowing for efficient layout on PCBs.

Temperature Grade: AUTOMOTIVE

With a temperature grade designated for automotive use, this product meets strict industry standards for reliability and performance.

Technology: CMOS

Using CMOS technology contributes to low power consumption and high performance, leading to energy-efficient designs.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and excellent mechanical stability, making assembly straightforward.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3V allows for compatibility with a wide range of logic levels, enhancing its versatility in different applications.

No. of Segments: 7

Having 7 segments is ideal for displaying numerical values clearly, making it suitable for applications like digital clocks and meters.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard in many applications, ensuring ease of integration into existing designs.

Minimum fmax: 25 MHz

A minimum fmax of 25 MHz provides sufficient speed for high-frequency applications, ensuring responsiveness and performance.

Interface IC Type: LED DISPLAY DRIVER

Being an LED display driver IC makes this product specifically optimized for driving LED displays, ensuring efficient operations and clear visuals.

Technical Specifications

Graphics Display Drivers STP08CL596M attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

7

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Minimum fmax:

25 MHz

Trade Compliance

STP08CL596M Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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