Loading...

STP04C596XTTR

STMicroelectronics

STP04C596XTTR by STMicroelectronics

STP04C596XTTR from STMicroelectronics is a compact LED display driver designed for automotive applications. It operates b/w 3.3V and 5.5V, supports serial data input, and functions effectively in temperatures ranging from -40 °C to 125°C. With a small outline package and 16 terminals, it ensures efficient space utilization in graphics displays.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,485 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,485

-

-

-

-

Digiode

USA . 297 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

297

-

-

-

-

Anansix

USA . 87 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

87

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 42 parts In-Stock

1+ parts

$12.012

100+ parts

-

1k+ parts

$10.810

10k+ parts

-

42

$12.012

-

$10.810

-

MKK Technologies

India . 526 parts In-Stock

1+ parts

$22.587

100+ parts

-

1k+ parts

-

10k+ parts

-

526

$22.587

-

-

-

DigiPath Technology Company

USA . 526 parts In-Stock

1+ parts

$22.587

100+ parts

-

1k+ parts

-

10k+ parts

-

526

$22.587

-

-

-

Corphita

USA . 4,544 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,544

-

-

-

-

Parana Technologies

USA . 1,267 parts In-Stock

1+ parts

-

100+ parts

$14.362

1k+ parts

-

10k+ parts

-

1,267

-

$14.362

-

-

Overview

Elevate your graphic display projects with the STP04C596XTTR from STMicroelectronics. Renowned for its commitment to quality and innovation, STMicroelectronics delivers a robust solution tailored for automotive applications, ensuring reliability even in extreme temperatures. With efficient serial data input and a compact design, this driver maximizes performance while saving space, empowering customers to create stunning displays with ease and confidence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy materials ensures durability and resistance to environmental factors, making the product suitable for a variety of applications.

Data Input Mode: SERIAL

The serial data input mode allows for simplified connections and reduces the number of required pins, facilitating easier integration into designs.

Surface Mount: YES

As a surface mount device, it enables compact design layouts and space-saving in modern electronics, optimizing PCB real estate.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5 V ensures compatibility with a wide range of power sources while providing a safety margin for reliable operation.

Package Shape: RECTANGULAR

The rectangular package shape contributes to efficient space utilization on circuit boards, allowing for a more organized and compact design.

No. of Terminals: 16

Having 16 terminals allows for versatility in circuit design, facilitating more functions or connections within a limited space.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

This package style offers high thermal performance and a smaller footprint, making it ideal for applications where space and heat dissipation are critical.

Minimum Supply Voltage: 3.3 V

A minimum supply voltage of 3.3 V allows for operation in low-power applications, making it suitable for battery-powered devices.

Maximum Operating Temperature: 125 °C

The ability to operate at temperatures up to 125 °C ensures reliability in high-temperature environments, particularly in automotive and industrial applications.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C makes this product an excellent choice for harsh environments, such as outdoor or extreme temperature applications.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in PCB layout design, allowing for various configurations and ease of assembly.

Maximum Seated Height: 1.2 mm

A low maximum seated height of 1.2 mm supports thin profile applications, making it compatible with modern, slim electronic devices.

Width: 4.4 mm

Compact width allows for easy fitting in densely populated PCBs, enhancing the design's overall efficiency.

Length: 5 mm

Short length contributes to a reduced footprint on the PCB, promoting a neat and tidy layout.

Temperature Grade: AUTOMOTIVE

With an automotive temperature grade, this component is specifically designed to withstand the rigorous conditions of automotive applications, ensuring durability and reliability.

Terminal Form: GULL WING

Gull wing terminals provide stable and reliable solder joints, ensuring good connectivity and conductivity in high-performance circuits.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is a standard across many applications, simplifying power supply design and enhancing compatibility.

No. of Segments: 4

Having 4 segments enables the driver to support multiple digits or indicators, making it versatile for various display applications.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch is ideal for high-density PCB layouts, allowing for more components to be integrated within the same area.

Minimum fmax: 25 MHz

A minimum fmax of 25 MHz allows for fast data processing, essential for high-speed applications such as real-time displays and responsive interfaces.

Interface IC Type: LED DISPLAY DRIVER

As an LED display driver, this IC is optimized for driving LEDs efficiently, ensuring bright and clear displays while managing power consumption effectively.

Technical Specifications

Graphics Display Drivers STP04C596XTTR attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Minimum fmax:

25 MHz

Trade Compliance

STP04C596XTTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19