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STP08C596TTR

STMicroelectronics

STP08C596TTR by STMicroelectronics

STP08C596TTR from STMicroelectronics is a CMOS LED display driver designed for automotive applications. It operates with a supply voltage of 4.5-5.5V, supports serial data input, and features 8 segments for efficient graphics display. Its compact size and high temp range (-40 °C to 125 °C) make it ideal for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,424 parts In-Stock

1+ parts

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3,424

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Vyrian

USA . 2,916 parts In-Stock

1+ parts

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2,916

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Anansix

USA . 1,202 parts In-Stock

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1,202

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,556 parts In-Stock

1+ parts

$3.403

100+ parts

-

1k+ parts

$3.063

10k+ parts

-

1,556

$3.403

-

$3.063

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Microchip USA

USA . 463 parts In-Stock

1+ parts

$5.140

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-

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463

$5.140

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MKK Technologies

India . 2,047 parts In-Stock

1+ parts

$6.399

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2,047

$6.399

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DigiPath Technology Company

USA . 2,047 parts In-Stock

1+ parts

$6.399

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2,047

$6.399

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AZTECH Wire

Italy . 130 parts In-Stock

1+ parts

$19.730

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130

$19.730

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Component Stockers USA

USA . 227 parts In-Stock

1+ parts

$99.990

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227

$99.990

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 4,007 parts In-Stock

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4,007

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Parana Technologies

USA . 854 parts In-Stock

1+ parts

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$4.069

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854

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$4.069

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Perfect Parts

USA . 243 parts In-Stock

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243

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Overview

Elevate your display designs with the STP08C596TTR from STMicroelectronics, where quality meets innovation. This robust graphics display driver excels in diverse applications, ensuring reliability even in extreme conditions. With its compact size and efficient power management, it simplifies integration while maximizing performance. Trust in STMicroelectronics’ reputation for excellence to deliver outstanding value and benefits that drive your projects forward effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy construction ensures reliability and longevity in various applications.

Display Mode: SEGMENT

Segment display mode provides clear and easy-to-read output, ideal for user interfaces.

Data Input Mode: SERIAL

Serial data input allows for simplified communication with microcontrollers and reduces pin count.

Surface Mount: YES

Surface mount technology facilitates compact designs and improves manufacturing efficiency.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage offers flexibility in power supply options.

Package Shape: RECTANGULAR

Rectangular package shape is space-efficient and optimizes PCB layout.

Power Supplies (V): 3.3

Low power supply requirement (3.3V) helps to reduce power consumption and heat generation.

No. of Terminals: 16

16 terminals provide sufficient I/O capabilities for a variety of applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Thin profile and small outline design are ideal for space-constrained applications.

Minimum Supply Voltage: 4.5 V

Minimum voltage requirement allows for compatibility with a wide range of power sources.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance makes it suitable for harsh environments, especially in automotive applications.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable operation in extreme conditions.

Terminal Position: DUAL

Dual terminal position enhances mechanical stability and easier soldering.

Maximum Seated Height: 1.2 mm

Low seated height ensures that the component doesn't interfere with other components on the PCB.

Width: 4.4 mm

Compact width allows for placement in tight spaces on PCBs.

Length: 5 mm

Short length contributes to a small form factor, making it ideal for compact devices.

Temperature Grade: AUTOMOTIVE

Automotive-grade components are designed to meet rigorous automotive standards for reliability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and mechanical strength.

Nominal Supply Voltage: 5 V

Nominal voltage of 5V ensures compatibility with most standard electronic devices.

No. of Segments: 8

Supports 8 segments, allowing versatility in display designs.

Terminal Pitch: 0.65 mm

Narrow terminal pitch supports dense PCB layout which is advantageous for modern electronic designs.

Minimum fmax: 25 MHz

Minimum frequency of 25 MHz ensures fast response times suitable for dynamic displays.

Interface IC Type: LED DISPLAY DRIVER

Designed specifically as an LED display driver, it streamlines the process of driving LEDs efficiently.

Technical Specifications

Graphics Display Drivers STP08C596TTR attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

8

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Minimum fmax:

25 MHz

Trade Compliance

STP08C596TTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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