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STP08C596M

STMicroelectronics

STP08C596M by STMicroelectronics

STP08C596M from STMicroelectronics is a CMOS LED display driver designed for automotive applications. It operates b/w 4.5V and 5.5V, supports serial data input, and features 8 segments with a max temp of 125 °C. Ideal for compact graphics displays in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,378 parts In-Stock

1+ parts

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8,378

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Digiode

USA . 3,332 parts In-Stock

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3,332

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Anansix

USA . 1,786 parts In-Stock

1+ parts

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1,786

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,671 parts In-Stock

1+ parts

$11.259

100+ parts

-

1k+ parts

$10.133

10k+ parts

-

1,671

$11.259

-

$10.133

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AZTECH Wire

Italy . 413 parts In-Stock

1+ parts

$11.740

100+ parts

-

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10k+ parts

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413

$11.740

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MKK Technologies

India . 2,083 parts In-Stock

1+ parts

$21.172

100+ parts

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2,083

$21.172

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DigiPath Technology Company

USA . 2,083 parts In-Stock

1+ parts

$21.172

100+ parts

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10k+ parts

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2,083

$21.172

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Microchip USA

USA . 201 parts In-Stock

1+ parts

$38.295

100+ parts

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201

$38.295

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Parana Technologies

USA . 158 parts In-Stock

1+ parts

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100+ parts

$13.462

1k+ parts

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158

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$13.462

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Corphita

USA . 92 parts In-Stock

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92

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Overview

Elevate your display projects with the STP08C596M from STMicroelectronics—a trusted leader in innovative technology. This advanced graphics display driver delivers exceptional performance and reliability, ensuring vibrant visuals across a variety of applications, from automotive dashboards to consumer electronics. With its robust design and superior temperature resilience, enjoy seamless integration and enhanced efficiency, empowering you to create stunning displays that captivate audiences while optimizing energy consumption. Upgrade your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection from environmental factors, making the product reliable for various applications.

Display Mode: SEGMENT

Segment display mode allows for clear visibility and easy readability, ideal for applications requiring straightforward numerical or alphanumeric outputs.

Data Input Mode: SERIAL

The serial data input mode simplifies connectivity and allows for efficient data transmission, making integration with microcontrollers easier.

Surface Mount: YES

Surface mount technology saves space on PCBs, facilitating compact designs and promoting modern, streamlined electronic devices.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5 V ensures compatibility with a wide range of power supply systems, enhancing versatility.

Package Shape: RECTANGULAR

The rectangular package shape optimizes layout and design efficiency in modern electronic circuits.

Power Supplies (V): 3.3

Operating at 3.3 V makes the driver suitable for low-power applications, benefiting battery-operated devices.

No. of Terminals: 16

With 16 terminals, the driver can manage multiple segments and additional functionalities, making it versatile for complex displays.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures a compact footprint, suitable for space-constrained designs.

Minimum Supply Voltage: 4.5 V

This range allows for stable performance in various supply conditions, expanding the application scope of the driver.

Maximum Operating Temperature: 125 °C

A high operating temperature tolerance makes this driver suitable for automotive and industrial applications subject to heat.

Minimum Operating Temperature: -40 °C

The capability to operate in extreme cold temperatures ensures reliability in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This premium terminal finish provides excellent corrosion resistance and ensures reliable electrical connections.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility on the PCB, accommodating various design architectures.

Maximum Seated Height: 1.75 mm

A low height profile is beneficial for compact designs where height constraints are a concern.

Width: 3.9 mm

A narrow width allows for effective spacing in circuit layouts, promoting more efficient PCB design.

Length: 9.9 mm

The length supports a compact arrangement of components on the PCB, critical for small electronic applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive-grade applications, this driver ensures performance and reliability under varying conditions.

Technology: CMOS

CMOS technology provides low power consumption, making this driver energy-efficient and ideal for battery-powered systems.

Terminal Form: GULL WING

Gull wing terminals are easy to solder and enable reliable connections, enhancing the manufacturability of the device.

Nominal Supply Voltage: 5 V

Operating at a nominal voltage of 5 V aligns with standard electronic components, facilitating integration into existing systems.

No. of Segments: 8

An 8-segment capability allows for comprehensive display options, making it suitable for a variety of display needs.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch fits well with most modern PCB designs, ensuring compatibility with high-density layouts.

Minimum fmax: 25 MHz

A minimum frequency of 25 MHz supports fast data processing, ensuring smooth and timely display updates.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 allows for sufficient handling and assembly time, reducing the risk of damage during manufacturing.

Interface IC Type: LED DISPLAY DRIVER

As a dedicated LED display driver, this IC optimizes display performance, enhancing visual clarity and efficiency.

Technical Specifications

Graphics Display Drivers STP08C596M attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

8

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Minimum fmax:

25 MHz

Trade Compliance

STP08C596M Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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