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STP04CM596XTTR

STMicroelectronics

STP04CM596XTTR by STMicroelectronics

STP04CM596XTTR from STMicroelectronics is a CMOS LED display driver designed for automotive applications. It operates b/w 3.3V and 5.5V, supports serial data input, and features a compact 16-terminal package. With a max temp of 125 °C, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,472 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,472

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Vyrian

USA . 2,508 parts In-Stock

1+ parts

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2,508

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Anansix

USA . 1,240 parts In-Stock

1+ parts

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1,240

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 564 parts In-Stock

1+ parts

$4.403

100+ parts

-

1k+ parts

$3.963

10k+ parts

-

564

$4.403

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$3.963

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MKK Technologies

India . 1,970 parts In-Stock

1+ parts

$8.280

100+ parts

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1,970

$8.280

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DigiPath Technology Company

USA . 1,970 parts In-Stock

1+ parts

$8.280

100+ parts

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1,970

$8.280

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AZTECH Wire

Italy . 704 parts In-Stock

1+ parts

$12.270

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-

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704

$12.270

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Component Stockers USA

USA . 682 parts In-Stock

1+ parts

$99.990

100+ parts

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682

$99.990

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A-Z Elektronik GmbH

Germany . 5,097 parts In-Stock

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5,097

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Microchip USA

USA . 2,246 parts In-Stock

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2,246

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Corphita

USA . 1,930 parts In-Stock

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1,930

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Parana Technologies

USA . 1,262 parts In-Stock

1+ parts

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100+ parts

$5.265

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1,262

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$5.265

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Overview

Elevate your designs with the STMicroelectronics STP04CM596XTTR, a top-tier graphics display driver that delivers unmatched reliability and performance. Designed for automotive applications, this compact powerhouse excels in delivering vibrant visuals while ensuring longevity under challenging conditions. With seamless serial data input and an impressive temperature range, it effortlessly integrates into your projects, offering versatility and efficiency that enhances your product's value and appeal. Trust in STMicroelectronics' legacy of quality to power your next innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Display Mode: SEGMENT

Segment display mode offers clear and easy-to-read visual output, ideal for applications such as instrumentation and consumer electronics.

Data Input Mode: SERIAL

Serial data input reduces the number of required connections, simplifying design and enhancing reliability in communication.

Surface Mount: YES

Surface mount technology allows for a compact design, making it easier to integrate into densely populated circuit boards.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of power supplies commonly used in electronics.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient layout and design, optimizing space utilization on the PCB.

Power Supplies (V): 5

Operating at a 5V supply is standard for many digital circuits, making it easy to integrate into existing systems.

No. of Terminals: 16

With 16 terminals, it offers sufficient connectivity options for various signal and power requirements in applications.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

This package style provides a balance between size and heat dissipation, making it suitable for high-performance applications.

Minimum Supply Voltage: 3.3 V

The ability to operate down to 3.3 V enhances compatibility with low-voltage systems, improving energy efficiency.

Maximum Operating Temperature: 125 °C

A high operating temperature rating is crucial for automotive and industrial applications, ensuring reliability under harsh conditions.

Minimum Operating Temperature: -40 °C

The capability to function in extreme low temperatures makes this driver suitable for harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish enhances solderability and provides excellent corrosion resistance, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options, simplifying circuit board design and assembly.

Maximum Seated Height: 1.2 mm

A low seated height contributes to a slimmer profile, making it more suitable for space-constrained designs.

Width: 4.4 mm

A compact width allows for more efficient use of board space, making it ideal for miniaturized applications.

Maximum Time At Peak Reflow Temperature: 40 s

A maximum reflow time of 40 seconds helps prevent thermal damage during the soldering process, ensuring device reliability.

Peak Reflow Temperature: 260 °C

High peak reflow temperature capability is essential for robust solder connections in modern surface mount technology.

Length: 5 mm

The small length makes it convenient for integration into compact designs without consuming excessive board space.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliability and performance in automotive applications subjected to temperature extremes.

Technology: CMOS

CMOS technology delivers low power consumption and high speed, making it a suitable choice for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals offer good mechanical strength and ease of soldering, enhancing manufacturing efficiency.

Nominal Supply Voltage: 5 V

Operating at a nominal voltage of 5 V aligns with standard logic levels, ensuring easy integration into existing designs.

No. of Segments: 4

Having 4 segments allows for versatile display options, suitable for various applications requiring multi-digit displays.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm helps in achieving a smaller footprint while still allowing for reliable connections.

Minimum fmax: 25 MHz

With a minimum frequency of 25 MHz, the driver supports fast data rates essential for high-speed applications.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 means it can withstand moderate moisture exposure during transportation and assembly, reducing the risk of damage.

Interface IC Type: LED DISPLAY DRIVER

Designed specifically as an LED display driver, it ensures optimized performance for driving LED segments with efficiency.

Technical Specifications

Graphics Display Drivers STP04CM596XTTR attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Minimum fmax:

25 MHz

Trade Compliance

STP04CM596XTTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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