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STP08CDC596M

STMicroelectronics

STP08CDC596M by STMicroelectronics

STP08CDC596M from STMicroelectronics is a CMOS LED display driver designed for automotive applications. It operates b/w 3.3V and 5.5V, supports serial data input, and features an 8-segment display mode. With a compact SO package and high-temp tolerance (-40 °C to 125 °C), it's ideal for reliable graphics displays.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,633 parts In-Stock

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6,633

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Digiode

USA . 3,880 parts In-Stock

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3,880

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Anansix

USA . 195 parts In-Stock

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195

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 925 parts In-Stock

1+ parts

$8.366

100+ parts

-

1k+ parts

$7.530

10k+ parts

-

925

$8.366

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$7.530

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Microchip USA

USA . 412 parts In-Stock

1+ parts

$10.609

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-

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412

$10.609

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AZTECH Wire

Italy . 269 parts In-Stock

1+ parts

$13.260

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269

$13.260

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MKK Technologies

India . 907 parts In-Stock

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$15.733

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907

$15.733

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DigiPath Technology Company

USA . 907 parts In-Stock

1+ parts

$15.733

100+ parts

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907

$15.733

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Corphita

USA . 4,927 parts In-Stock

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4,927

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Parana Technologies

USA . 460 parts In-Stock

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$10.003

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460

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$10.003

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Overview

Elevate your display solutions with the STP08CDC596M from STMicroelectronics, a trusted leader in semiconductor innovation. This high-performance graphics display driver delivers exceptional reliability and efficiency, ideal for automotive applications and beyond. With its robust design and versatile features, you can effortlessly create stunning visual experiences while benefiting from low power consumption and seamless integration. Transform your projects with unmatched quality and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials enhances the product's reliability and longevity, making it suitable for various applications.

Display Mode: SEGMENT

Segment display mode allows for clear visibility in various lighting conditions, ideal for applications requiring clear visual outputs.

Data Input Mode: SERIAL

Serial data input mode enables efficient communication with microcontrollers, simplifying integration with existing systems.

Surface Mount: YES

Surface mount technology reduces the footprint of the device, supporting compact designs and advanced PCB layouts.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5V provides flexibility in sourcing power without causing damage to the components.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on circuit boards, favorable for dense electronic designs.

Power Supplies (V): 3.3/5

Support for both 3.3V and 5V supplies increases compatibility with a variety of modern and legacy systems.

No. of Terminals: 16

The 16 terminals provide sufficient connectivity options for complex designs and multi-segment displays.

Package Style (Meter): SMALL OUTLINE

Small outline packages save space on PCBs, essential for compact electronic applications.

Minimum Supply Voltage: 3.3 V

A minimum supply voltage of 3.3V ensures broad compatibility with low-power applications, enhancing energy efficiency.

Maximum Operating Temperature: 125 °C

A high operating temperature limit makes the driver suitable for demanding environments, including automotive applications.

Minimum Operating Temperature: -40 °C

This low-temperature threshold ensures reliable operation in harsh conditions, appropriate for outdoor or industrial uses.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Premium terminal finish provides excellent corrosion resistance and improves solderability, enhancing device reliability.

Terminal Position: DUAL

Dual terminal positioning allows for versatile mounting options and better PCB layout flexibility.

Maximum Seated Height: 1.75 mm

A low seated height is advantageous for flat PCB designs, supporting slim product profiles.

Width: 3.9 mm

Compact width helps to minimize the overall size of the device, facilitating integration into smaller devices.

Maximum Time At Peak Reflow Temperature (s): 30

The specified peak reflow time ensures compatibility with advanced soldering processes, safeguarding component integrity.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C accommodates modern solder materials, enhancing manufacturing efficiency.

Length: 9.9 mm

The compact length contributes to a streamlined design, reducing space on PCBs used for various applications.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive standards, this driver ensures high durability and performance under extreme conditions.

Technology: CMOS

CMOS technology offers low power consumption while maintaining high performance, making this driver efficient for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easier and more reliable soldering, contributing to improved manufacturing outcomes.

Nominal Supply Voltage: 5 V

The nominal supply voltage ensures optimal performance and compatibility across a wide range of devices.

No. of Segments: 8

Eight segments allow for versatile display configurations, enabling complex graphical representations.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is commonly used, enhancing compatibility with standard board layouts and design practices.

Minimum fmax: 25 MHz

A minimum frequency of 25 MHz ensures fast response times for high-speed applications, improving overall performance.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, allowing for reasonable handling and storage without special precautions.

Interface IC Type: LED DISPLAY DRIVER

As an LED display driver interface, this product is specifically optimized for driving LED segments effectively and efficiently.

Technical Specifications

Graphics Display Drivers STP08CDC596M attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

8

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

25 MHz

Trade Compliance

STP08CDC596M Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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