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STM32MP135FAG7T

STMicroelectronics

STM32MP135FAG7T by STMicroelectronics

STM32MP135FAG7T by STMicroelectronics is a 32-bit microprocessor with integrated cache and 172032 RAM words. It operates at a max clock frequency of 48 MHz, suitable for low power applications like IoT devices due to its min supply voltage of 1.32 V and max operating temperature of 105°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,220 parts In-Stock

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5,220

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Digiode

USA . 4,235 parts In-Stock

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4,235

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Anansix

USA . 1,110 parts In-Stock

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1,110

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,273 parts In-Stock

1+ parts

$5.000

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1,273

$5.000

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AZTECH Wire

Italy . 845 parts In-Stock

1+ parts

$13.960

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845

$13.960

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Corphita

USA . 2,465 parts In-Stock

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2,465

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Eastek

USA . 1,750 parts In-Stock

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1,750

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Overview

Unlock the full potential of your projects with the STM32MP135FAG7T microprocessor by STMicroelectronics. Designed with precision and reliability in mind, this high-quality product offers integrated cache, a wide range of applications, and exceptional performance. Whether you're working on IoT devices, consumer electronics, or industrial automation, this microprocessor delivers unparalleled value, benefits, and advantages to meet your needs. Trust in STMicroelectronics to provide top-of-the-line technology for all your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is durable and lightweight, making it ideal for electronic components that need to be compact and reliable.

Integrated Cache: YES

Having an integrated cache helps improve the performance of the microprocessor by reducing the time it takes to access frequently used data.

Maximum Supply Voltage: 1.38 V

The maximum supply voltage of 1.38 V ensures that the microprocessor operates within safe voltage levels, protecting it from damage.

On Chip Data RAM Width: 8

The 8-bit on-chip data RAM width allows for efficient data processing and storage within the microprocessor.

Address Bus Width: 26

With a wide address bus width of 26 bits, the microprocessor can access a large memory space efficiently, enabling faster data retrieval.

Package Shape: SQUARE

The square package shape allows for easy integration and placement of the microprocessor onto circuit boards, saving space and ensuring compatibility with standard layouts.

Bit Size: 32

The 32-bit architecture of the microprocessor enables it to handle complex calculations and processes with high precision and speed.

No. of Terminals: 289

The high number of terminals provides flexibility in connecting the microprocessor to other components, allowing for versatile and customizable electronic designs.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array package style with a thin profile and fine pitch design enhances the overall performance and reliability of the microprocessor while facilitating easy installation and maintenance.

Minimum Supply Voltage: 1.32 V

The minimum supply voltage of 1.32 V ensures that the microprocessor can operate efficiently even under low-power conditions, optimizing energy consumption.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C allows the microprocessor to function reliably in various environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the microprocessor remains operational even in extremely cold environments, making it suitable for a wide range of applications.

Terminal Position: BOTTOM

The bottom terminal position simplifies the installation process and ensures proper alignment of the microprocessor during assembly, reducing the risk of connectivity issues.

Maximum Seated Height: 1.2 mm

The maximum seated height of 1.2 mm allows for a compact and slim design, making the microprocessor suitable for space-constrained applications.

RAM Words: 172032

With a large RAM capacity of 172032 words, the microprocessor can store and process a significant amount of data efficiently, enhancing its overall performance.

Width: 9 mm

The compact width of 9 mm makes the microprocessor easy to integrate into various electronic devices without taking up too much space.

Boundary Scan: YES

The boundary scan feature allows for efficient testing and debugging of the microprocessor during production, ensuring high quality and reliability.

External Data Bus Width: 16

The wide external data bus width of 16 bits enables fast data transfer between the microprocessor and external memory or peripherals, improving overall system performance.

Maximum Clock Frequency: 48 MHz

The high maximum clock frequency of 48 MHz allows the microprocessor to execute instructions quickly and efficiently, resulting in high-speed data processing.

Length: 9 mm

The compact length of 9 mm makes the microprocessor suitable for applications where space is limited, without compromising on performance and functionality.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor, it is optimized for high performance and efficiency in handling a large number of instructions, making it ideal for complex computing tasks.

Technology: CMOS

The CMOS technology used in the microprocessor ensures low power consumption, high speed, and reliability, making it an excellent choice for battery-powered devices and portable electronics.

Terminal Form: BALL

The ball terminal form simplifies the soldering process during assembly and provides a reliable connection between the microprocessor and the circuit board, ensuring stability and durability.

Maximum Supply Current: 268 mA

The maximum supply current of 268 mA allows the microprocessor to operate efficiently without drawing excessive power, leading to energy savings and improved performance.

Nominal Supply Voltage: 1.35 V

The nominal supply voltage of 1.35 V provides a stable power source for the microprocessor, ensuring consistent and reliable operation under various operating conditions.

No. of DMA Channels: 56

Having 56 DMA channels allows for efficient data transfer between the microprocessor and peripherals, enabling high-speed communication and data processing in complex systems.

No. of Serial I/Os: 10

With 10 serial I/Os, the microprocessor can communicate with multiple external devices simultaneously, enhancing connectivity and data exchange capabilities.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density mounting of the microprocessor on the circuit board, saving space and improving overall system reliability.

Format: FIXED POINT

The fixed-point format allows for efficient numerical calculations and data processing, making the microprocessor well-suited for applications that require high computational accuracy.

Speed: 1000 rpm

With a speed of 1000 rpm, the microprocessor can execute instructions quickly and efficiently, catering to demanding computing tasks and real-time processing requirements.

Low Power Mode: YES

The low power mode feature allows the microprocessor to operate in a power-efficient state when not in use, extending battery life and reducing energy consumption in portable devices.

Technical Specifications

Microprocessors STM32MP135FAG7T attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B289

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

10

No. of Terminals:

289

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.2 mm

Speed:

1000 rpm

Maximum Supply Current:

268 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.32 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

9 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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