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STM32MP133CAF3

STMicroelectronics

STM32MP133CAF3 by STMicroelectronics

STM32MP133CAF3 by STMicroelectronics is a 32-bit microprocessor with a max clock frequency of 48 MHz and operates b/w -40 °C to 125 °C. It features integrated cache, 320 terminals, and supports low power modes. Ideal for industrial applications requiring robust performance in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Avnet

USA . 160 parts In-Stock

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Vyrian

USA . 10,128 parts In-Stock

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Digiode

USA . 1,763 parts In-Stock

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Anansix

USA . 929 parts In-Stock

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AZTECH Wire

Italy . 565 parts In-Stock

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$10.090

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Corphita

USA . 1,657 parts In-Stock

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Eastek

USA . 800 parts In-Stock

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$7.540

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GreenTree Electronics

Israel . 800 parts In-Stock

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Overview

Elevate your designs with the STM32MP133CAF3 microprocessor from STMicroelectronics—a trusted leader in innovation. Offering exceptional performance and reliability, this advanced microprocessor shines in diverse applications, from industrial automation to smart home devices. Enjoy low power consumption without compromising speed, ensuring your projects are both efficient and high-quality. Choose STM32MP133CAF3 for a future-ready solution that empowers your creativity and maximizes value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, plastic/epoxy materials offer good protection and reliability for microprocessors.

Integrated Cache: YES

The presence of integrated cache improves processing speed and overall system performance by reducing access latency.

Surface Mount: YES

Surface mount technology reduces the size of the microprocessor, making it easier to integrate into compact designs.

Maximum Supply Voltage: 1.38 V

A lower maximum supply voltage enhances energy efficiency and cooling requirements for embedded systems.

On Chip Data RAM Width: 8

With an 8-bit data RAM width, the microprocessor can handle a wide range of applications with moderate data requirements.

Address Bus Width: 26

A 26-bit address bus allows for access to a large memory space, improving the range of applications for the processor.

Package Shape: SQUARE

A square package shape facilitates efficient heat dissipation, which is crucial for high-performance applications.

Bit Size: 32

The 32-bit architecture allows for more sophisticated processing capabilities, enabling the microprocessor to handle advanced tasks.

No. of Terminals: 320

A higher number of terminals provides increased connectivity options, allowing integration with various peripherals.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This package style supports higher density designs and is ideal for space-constrained applications.

Minimum Supply Voltage: 1.21 V

The low minimum supply voltage further enhances power efficiency, making it suitable for battery-operated devices.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this microprocessor can function reliably in demanding environments.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme cold conditions makes this microprocessor ideal for automotive and industrial applications.

Terminal Position: BOTTOM

Bottom terminal positioning allows for more compact designs while maintaining a stable connection.

Maximum Seated Height: 1.2 mm

A low seated height allows for efficient airflow and reduces cooling requirements in compact devices.

RAM Words: 172032

A substantial amount of RAM words supports complex applications, allowing the microprocessor to execute more simultaneous tasks.

Width: 11 mm

The compact width is suitable for space-constrained designs, making it versatile for a wide range of applications.

Boundary Scan: YES

Boundary scan capability facilitates easier testing and debugging of the microprocessor within the system.

External Data Bus Width: 16

A 16-bit external data bus allows for efficient data transfer between the microprocessor and other components.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz provides sufficient processing speed for a variety of applications such as embedded systems.

Peripheral IC Type: MICROPROCESSOR, RISC

As a RISC microprocessor, it offers a streamlined instruction set for improved performance and energy efficiency.

Technology: CMOS

CMOS technology allows for lower power consumption and increased chip density, making it effective for modern applications.

Terminal Form: BALL

Ball terminal form provides better surface contact and reliability in electronic assembly.

Maximum Supply Current: 239 mA

A manageable supply current level indicates compatibility with standard power supply designs, enhancing integration flexibility.

Nominal Supply Voltage: 1.25 V

This nominal supply voltage strikes a balance between performance and power efficiency, ideal for low-power applications.

No. of DMA Channels: 56

A high number of DMA channels allows for advanced data handling and improves overall system throughput.

No. of Serial I/Os: 10

With ten serial I/O ports, the microprocessor can connect to multiple peripherals simultaneously, enhancing flexibility.

Terminal Pitch: 0.5 mm

A small terminal pitch enables a higher packing density for more complex circuit designs.

Format: FIXED POINT

Fixed-point format supports fast arithmetic operations, making it suitable for control applications in embedded systems.

Speed: 650 rpm

Capable of 650 rpm, this processor is efficient in performance, suitable for a range of applications with varying speed requirements.

Low Power Mode: YES

Low power mode significantly improves energy efficiency, prolonging battery life in portable applications.

Technical Specifications

Microprocessors STM32MP133CAF3 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B320

Length:

11 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

10

No. of Terminals:

320

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA320,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.2 mm

Speed:

650 rpm

Maximum Supply Current:

239 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

11 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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