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STM32MP131FAF7T

STMicroelectronics

STM32MP131FAF7T by STMicroelectronics

STM32MP131FAF7T by STMicroelectronics is a 32-bit microprocessor with integrated cache and 26-bit address bus width. It operates at a max clock frequency of 48 MHz, making it suitable for low power applications in various industries such as IoT, automotive, and consumer electronics. With a package style of grid array and thin profile, this processor offers high performance in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,607 parts In-Stock

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8,607

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Anansix

USA . 2,663 parts In-Stock

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2,663

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Digiode

USA . 1,732 parts In-Stock

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1,732

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 560 parts In-Stock

1+ parts

$7.482

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560

$7.482

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Ampacity Inc.

Singapore . 726 parts In-Stock

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$30.000

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726

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Aranea Global

USA . 2,000 parts In-Stock

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Corphita

USA . 1,125 parts In-Stock

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1,125

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Overview

Discover the cutting-edge STM32MP131FAF7T microprocessor by STMicroelectronics, a powerhouse in the industry known for delivering top-notch quality and reliable products. This versatile chip is ideal for a wide range of applications, offering integrated cache and a high clock frequency. With a focus on low power consumption and innovative technology, this microprocessor provides exceptional performance while maximizing efficiency. Whether you're designing consumer electronics, industrial automation systems, or smart devices, the STM32MP131FAF7T delivers unparalleled value and benefits to meet your unique needs. Elevate your projects with this advanced solution from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portability and long-term use.

Integrated Cache: YES

The integrated cache enhances the processor's performance by storing frequently accessed data, resulting in faster processing speeds.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, making the product suitable for compact electronic devices.

Maximum Supply Voltage: 1.38 V

The maximum supply voltage of 1.38V ensures stable and efficient power delivery, contributing to the reliability of the product.

On Chip Data RAM Width: 8

With an on-chip data RAM width of 8, the processor can handle large amounts of data simultaneously, improving overall performance.

Address Bus Width: 26

The wide address bus width of 26 enables the processor to access a larger memory space, enhancing its capability to process complex tasks.

Package Shape: SQUARE

The square package shape provides a compact design, maximizing space efficiency in electronic systems.

Bit Size: 32

The 32-bit size allows the processor to handle data in larger chunks, increasing processing speed and efficiency.

No. of Terminals: 320

The high number of terminals provides ample connectivity options, making the product versatile and compatible with various devices.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, fine pitch package style offers improved thermal and electrical performance, making the product suitable for high-performance applications.

Minimum Supply Voltage: 1.32 V

The minimum supply voltage of 1.32V ensures energy efficiency and stable operation, prolonging the lifespan of the product.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows the processor to withstand intense usage conditions, ensuring reliability in various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables the processor to function in cold climates or refrigerated environments without compromising performance.

Terminal Position: BOTTOM

The bottom terminal position makes it easy to integrate the processor into circuit boards, simplifying the installation process.

Maximum Seated Height: 1.2 mm

The low maximum seated height allows for a slim and compact design, suitable for applications with space constraints.

RAM Words: 172032

The large number of RAM words provides extensive memory storage capacity, enabling the processor to handle multiple tasks simultaneously.

Width: 11 mm

The 11mm width of the processor enables it to fit into compact devices without sacrificing performance or functionality.

Boundary Scan: YES

The boundary scan feature facilitates testing and debugging during the manufacturing process, ensuring product quality and reliability.

External Data Bus Width: 16

The 16-bit external data bus width allows for fast data transfer between the processor and external devices, enhancing overall efficiency.

Maximum Clock Frequency: 48 MHz

The high maximum clock frequency of 48MHz enables the processor to execute instructions rapidly, improving processing speed and performance.

Length: 11 mm

The 11mm length of the processor provides a balanced form factor, suitable for various electronic applications.

Peripheral IC Type: MICROPROCESSOR, RISC

The microprocessor RISC architecture enhances processing efficiency and speed, making the product ideal for high-performance computing tasks.

Technology: CMOS

The CMOS technology used in the processor offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form ensures secure connections and easy soldering, improving the overall reliability and longevity of the product.

Maximum Supply Current: 268 mA

The maximum supply current of 268mA ensures stable power delivery, reducing the risk of voltage fluctuations and enhancing product performance.

Nominal Supply Voltage: 1.35 V

The nominal supply voltage of 1.35V provides a stable power source for the processor, contributing to its reliability and performance.

No. of DMA Channels: 56

The high number of DMA channels allows for efficient data transfer between peripherals and memory, enhancing overall system performance.

No. of Serial I/Os: 8

The 8 serial I/Os provide versatile connectivity options, making the processor suitable for a wide range of applications.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for a high density of terminals, enabling compact design and efficient use of space.

Format: FIXED POINT

The fixed-point format simplifies mathematical operations, improving computational efficiency and accuracy.

Speed: 1000 rpm

The high speed of 1000rpm enables fast data processing and execution of instructions, enhancing overall system performance.

Low Power Mode: YES

The low power mode feature allows the processor to operate efficiently with minimal power consumption, prolonging battery life and reducing energy costs.

Technical Specifications

Microprocessors STM32MP131FAF7T attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B320

Length:

11 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

8

No. of Terminals:

320

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA320,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.2 mm

Speed:

1000 rpm

Maximum Supply Current:

268 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.32 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

11 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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