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STLVD210BF

STMicroelectronics

STLVD210BF by STMicroelectronics

STLVD210BF by STMicroelectronics is a low-profile clock driver with a 2.5 ns propagation delay, designed for industrial applications. It operates within a supply voltage range of 2.375-2.625 V and features 5 true outputs in a compact 7x7 mm package. Ideal for differential input conditioning, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,425 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,425

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-

-

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Digiode

USA . 2,661 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,661

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Anansix

USA . 2,170 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,170

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,513 parts In-Stock

1+ parts

$4.720

100+ parts

-

1k+ parts

$4.531

10k+ parts

$4.531

1,513

$4.720

-

$4.531

$4.531

IDEA Electronic Components Group

UK . 761 parts In-Stock

1+ parts

$29.019

100+ parts

-

1k+ parts

$26.117

10k+ parts

-

761

$29.019

-

$26.117

-

MKK Technologies

India . 407 parts In-Stock

1+ parts

$54.568

100+ parts

-

1k+ parts

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10k+ parts

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407

$54.568

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DigiPath Technology Company

USA . 407 parts In-Stock

1+ parts

$54.568

100+ parts

-

1k+ parts

-

10k+ parts

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407

$54.568

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-

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Corphita

USA . 1,531 parts In-Stock

1+ parts

-

100+ parts

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1,531

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Parana Technologies

USA . 342 parts In-Stock

1+ parts

-

100+ parts

$34.696

1k+ parts

-

10k+ parts

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342

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$34.696

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Overview

Unlock exceptional performance with the STLVD210BF from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality clock driver and buffer is designed for reliability across diverse applications, ensuring precise signal integrity even in challenging environments. Its compact, low-profile design offers immense space-saving advantages, making it ideal for modern electronics. Experience unmatched efficiency and durability tailored to elevate your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures long-term reliability and protection against environmental factors.

Surface Mount: YES

The surface mount design allows for compact circuit board layouts, saving space and enhancing design flexibility.

Input Conditioning: DIFFERENTIAL

Differential input conditioning enhances noise immunity and signal integrity, making it ideal for high-speed applications.

No. of Functions: 2

Having two functions in one device can simplify designs and reduce component count, ultimately saving costs.

Package Shape: SQUARE

The square package shape facilitates efficient use of PCB space and aids in thermal management.

Nominal Supply Voltage / Vsup: 2.5 V

Operating at a nominal supply voltage of 2.5 V allows for energy-efficient performance while maintaining functionality.

No. of Terminals: 32

A higher number of terminals offers greater flexibility for connections and integration into complex systems.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design ensures a slimmer form factor, which is ideal for compact applications.

Propagation Delay (tpd): 2.5 ns

A low propagation delay of 2.5 ns is critical for applications that require high-speed signal processing.

Maximum Operating Temperature: 85 °C

Designed to withstand high temperatures up to 85 °C, this product is reliable for industrial settings.

Minimum Operating Temperature: -40 °C

Operating in a wide temperature range (-40 °C) ensures performance in extreme environments, suitable for various applications.

Terminal Finish: TIN LEAD

Tin lead terminal finish offers good solderability and reliable connections in electronic assemblies.

Terminal Position: QUAD

Quad terminal positioning provides effective heat dissipation and connection options across different board layouts.

Maximum Seated Height: 1.6 mm

The low seated height enhances fit in space-constrained designs while maintaining performance.

Width: 7 mm

A width of 7 mm makes it suitable for dense PCB layouts and various application types.

Minimum Supply Voltage (Vsup): 2.375 V

Having a minimum supply voltage of 2.375 V allows for flexibility in power supply design.

Length: 7 mm

The equivalent length of 7 mm complements the width for a compact package, suitable for modern electronics.

Temperature Grade: INDUSTRIAL

This temperature grade indicates durability and suitability for demanding industrial applications.

Terminal Form: GULL WING

The gull wing terminal form offers ease of soldering and enhances connection reliability.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch is excellent for high-density mounting, allowing for more components in a smaller area.

No. of True Outputs: 5

Having five true outputs allows for simultaneous outputs, enhancing versatility in circuit applications.

Maximum Supply Voltage (Vsup): 2.625 V

The maximum supply voltage of 2.625 V provides a margin for power supply variations while maintaining performance.

Technical Specifications

Clock Drivers & Buffers STLVD210BF attributes and parameters. Explore more Clock Drivers & Buffers devices from STMicroelectronics

Specs

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e0

Length:

7 mm

Logic IC Type:

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Propagation Delay (tpd):

2.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

STLVD210BF Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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