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STLVD111BFR

STMicroelectronics

STLVD111BFR by STMicroelectronics

STLVD111BFR by STMicroelectronics is a low-profile clock driver with a 3 ns propagation delay and operates at a nominal voltage of 2.5V. It features differential MUX input conditioning and supports industrial applications in compact designs. With 10 true outputs, it’s ideal for high-speed data transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,871 parts In-Stock

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2,871

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Anansix

USA . 1,554 parts In-Stock

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1,554

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Digiode

USA . 1,044 parts In-Stock

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1,044

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Sensible Micro Corp

USA . 950 parts In-Stock

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950

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Mil-Aero Solutions, Inc.

USA . 84 parts In-Stock

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84

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Legend Electronics Inc.

USA . 60 parts In-Stock

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60

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LWI Electronics Inc

India . 11 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 2,130 parts In-Stock

1+ parts

$3.186

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-

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$3.058

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$3.058

2,130

$3.186

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$3.058

$3.058

AZTECH Wire

Italy . 181 parts In-Stock

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$8.550

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181

$8.550

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IDEA Electronic Components Group

UK . 708 parts In-Stock

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$14.934

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$13.441

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708

$14.934

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$13.441

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Microchip USA

USA . 493 parts In-Stock

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$16.046

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493

$16.046

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MKK Technologies

India . 1,371 parts In-Stock

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$28.083

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1,371

$28.083

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DigiPath Technology Company

USA . 1,371 parts In-Stock

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$28.083

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$28.083

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Perfect Parts

USA . 9,330 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,771 parts In-Stock

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Vigor

Singapore . 3,830 parts In-Stock

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S.R.D Solutions

India . 3,690 parts In-Stock

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Corphita

USA . 3,164 parts In-Stock

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Parana Technologies

USA . 170 parts In-Stock

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$17.856

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Eliminating Global Boundries, Inc

USA . 100 parts In-Stock

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Overview

Elevate your designs with the STLVD111BFR from STMicroelectronics, a leader in innovative semiconductor solutions. This state-of-the-art clock driver and buffer ensures unparalleled performance with minimal propagation delay, making it perfect for high-speed applications. Its robust industrial-grade design withstands extreme conditions, providing reliability you can trust. Experience enhanced efficiency, lower power consumption, and seamless integration—unlocking the full potential of your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors.

Propagation Delay At Nominal Supply: 3 ns

A low propagation delay allows for faster signal processing, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount capability facilitates easier integration into compact designs, saving space on PCBs.

Input Conditioning: DIFFERENTIAL MUX

Differential multiplexing enhances signal integrity and reduces noise susceptibility.

Package Shape: SQUARE

The square package allows for efficient layout and placement on circuit boards.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a nominal 2.5V is ideal for low-power applications, extending battery life in portable devices.

Power Supplies (V): 2.5

A fixed power supply voltage simplifies design considerations and ensures stable performance.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options for diverse applications and functions.

Package Style (Meter): FLATPACK, LOW PROFILE

A low-profile flatpack design minimizes height, aiding in space-constrained applications.

Propagation Delay (tpd): 2.5 ns

An even lower propagation delay indicates exceptional speed for high-frequency applications.

Maximum Operating Temperature: 85 °C

The ability to operate at higher temperatures makes this component reliable in industrial environments.

Minimum Operating Temperature: -40 °C

Operation at -40 °C ensures reliability in extreme cold environments, suitable for outdoor or harsh applications.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides good solderability and enhances long-term reliability.

Terminal Position: QUAD

Quad terminal positioning allows for good routing possibilities on the PCB, enhancing design flexibility.

Maximum Seated Height: 1.6 mm

A low seated height allows for compatibility with tight spaces and helps minimize overall device thickness.

Width: 7 mm

The compact width enables efficient layout and contributes to smaller overall device dimensions.

Minimum Supply Voltage (Vsup): 2.375 V

A minimum supply voltage of 2.375V allows for versatility in power source selection.

Maximum Time At Peak Reflow Temperature (s): 30

The specification for peak reflow time ensures reliable soldering during manufacturing.

Peak Reflow Temperature °C: 235

A high peak reflow temperature capability broadens compatibility with various soldering processes.

Length: 7 mm

A compact length contributes to space efficiency in circuit board designs.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability and performance in demanding environments.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and facilitate automatic assembly.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch allows for higher density designs while maintaining manufacturability.

No. of True Outputs: 10

Ten true outputs enable versatile signal distribution for multiple applications.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates the need for standard handling precautions, ensuring long-term reliability.

Maximum Supply Voltage (Vsup): 2.625 V

A maximum supply voltage of 2.625V allows for a broader range of power supply applications.

Technical Specifications

Clock Drivers & Buffers STLVD111BFR attributes and parameters. Explore more Clock Drivers & Buffers devices from STMicroelectronics

Specs

Family:

111

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

2.5

Propagation Delay At Nominal Supply:

3 ns

Propagation Delay (tpd):

2.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

STLVD111BFR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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