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STLVD111BF

STMicroelectronics

STLVD111BF by STMicroelectronics

STLVD111BF by STMicroelectronics is a low-profile clock driver with a 3 ns propagation delay and operates at a nominal voltage of 2.5 V. It features differential mux input conditioning and supports industrial applications with a temp range of -40 °C to 85°C. This compact device has 10 true outputs, making it ideal for high-speed data processing in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,943 parts In-Stock

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2,943

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Digiode

USA . 2,218 parts In-Stock

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2,218

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Anansix

USA . 350 parts In-Stock

1+ parts

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350

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Semi Source

USA . 31 parts In-Stock

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31

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Corel Iberica Componentes, S.L.

Spain . 25 parts In-Stock

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25

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Speed Components Ltd

Israel . 21 parts In-Stock

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21

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 75 parts In-Stock

1+ parts

$7.113

100+ parts

-

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$6.828

10k+ parts

$6.828

75

$7.113

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$6.828

$6.828

IDEA Electronic Components Group

UK . 113 parts In-Stock

1+ parts

$17.039

100+ parts

-

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$15.335

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113

$17.039

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$15.335

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MKK Technologies

India . 663 parts In-Stock

1+ parts

$32.041

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663

$32.041

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DigiPath Technology Company

USA . 663 parts In-Stock

1+ parts

$32.041

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663

$32.041

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Kepictronics

USA . 4,350 parts In-Stock

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4,350

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Corphita

USA . 3,863 parts In-Stock

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3,863

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Parana Technologies

USA . 1,023 parts In-Stock

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$20.373

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1,023

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$20.373

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Assy Fe

Spain . 25 parts In-Stock

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25

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Overview

Unlock the potential of your designs with the STLVD111BF from STMicroelectronics—a trusted leader in innovative solutions. This high-performance clock driver and buffer offers exceptional reliability and precision, perfect for industrial applications demanding robust performance under various conditions. With its low profile, versatile design, and rapid response times, you can elevate your projects while benefiting from ST's commitment to quality and support. Experience seamless integration and enhanced system efficiency today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and resistance to environmental stress, making it suitable for various applications.

Propagation Delay At Nominal Supply: 3 ns

With a fast propagation delay, this product ensures quick signal transmission, which is essential for high-speed applications.

Surface Mount: YES

The surface mount capability allows for efficient use of board space and simplifies the assembly process.

Input Conditioning: DIFFERENTIAL MUX

Differential multiplexing enhances signal integrity by reducing noise and crosstalk, making it ideal for precision applications.

Package Shape: SQUARE

The square shape optimizes layout versatility on PCB designs, allowing for more efficient use of space.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a nominal supply voltage of 2.5V enables compatibility with modern low-voltage digital circuits.

Power Supplies (V): 2.5

The consistency in power supply voltage ensures stable operation across varying conditions.

No. of Terminals: 32

Having 32 terminals provides flexibility for complex circuit designs and additional interfacing options.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design reduces height on PCB, which is advantageous for compact devices and space-constrained applications.

Propagation Delay (tpd): 2.5 ns

A lower propagation delay improves the speed of data transmission, making it a strong candidate for high-performance systems.

Maximum Operating Temperature: 85 °C

Withstanding high temperatures ensures reliable performance in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Operating in extreme low temperatures guarantees functionality in harsh climates and conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances connection reliability and durability, reducing the risk of oxidation.

Terminal Position: QUAD

Quad terminal positioning allows for better signal routing, improving overall performance in multi-channel designs.

Maximum Seated Height: 1.6 mm

The limited seated height contributes to lower-profile designs, which is critical for slim electronics.

Width: 7 mm

A compact width offers better flexibility for tight space constraints on circuit boards.

Minimum Supply Voltage (Vsup): 2.375 V

The ability to operate at a minimum voltage ensures versatility in low-power applications.

Length: 7 mm

Similar to width, the length also allows for efficient PCB layout and compact device configurations.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges guarantees durability and reliability in tough operational conditions.

Terminal Form: GULL WING

Gull-wing terminals facilitate easy soldering processes, ensuring secure mechanical and electrical connections.

Terminal Pitch: 0.8 mm

A smaller terminal pitch allows for denser arrangements on PCBs, useful for complex circuits.

No. of True Outputs: 10

Having 10 true outputs provides ample connectivity options for multi-channel applications, enhancing design flexibility.

Maximum Supply Voltage (Vsup): 2.625 V

The capability to operate at a slightly higher maximum voltage expands its use in a variety of circuits.

Technical Specifications

Clock Drivers & Buffers STLVD111BF attributes and parameters. Explore more Clock Drivers & Buffers devices from STMicroelectronics

Specs

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

7 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

2.5

Propagation Delay At Nominal Supply:

3 ns

Propagation Delay (tpd):

2.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

STLVD111BF Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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