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STL55NH3LL

STMicroelectronics

STL55NH3LL by STMicroelectronics

STL55NH3LL by STMicroelectronics is a N-CHANNEL FET with 30V DS Breakdown Voltage, 60A IDM, and 0.0115 ohm RDS(on). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 4W.

Median Price

$0.635

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 5,892 parts In-Stock

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$0.635

5,892

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$0.635

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.072

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10

$0.072

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Vyrian

USA . 5,754 parts In-Stock

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5,754

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Digiode

USA . 3,337 parts In-Stock

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3,337

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Bristol Electronics

USA . 2,221 parts In-Stock

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2,221

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Dan-Mar Components

USA . 2,221 parts In-Stock

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Anansix

USA . 1,381 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,537 parts In-Stock

1+ parts

$0.072

100+ parts

-

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$0.071

5,537

$0.072

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$0.071

Argo Parts USA

USA . 4,604 parts In-Stock

1+ parts

$0.072

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-

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$0.070

4,604

$0.072

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$0.070

Netroflash

USA . 50 parts In-Stock

1+ parts

$0.072

100+ parts

-

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$0.068

10k+ parts

$0.067

50

$0.072

-

$0.068

$0.067

Ampacity Inc.

Singapore . 5,775 parts In-Stock

1+ parts

$0.540

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5,775

$0.540

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IDEA Electronic Components Group

UK . 754 parts In-Stock

1+ parts

$0.880

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$0.792

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754

$0.880

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$0.792

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Aztec Data Supply Inc.

USA . 2,302 parts In-Stock

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$0.966

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$0.966

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MKK Technologies

India . 1,785 parts In-Stock

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$1.654

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$1.654

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DigiPath Technology Company

USA . 1,785 parts In-Stock

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$1.654

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$1.654

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Corohmni

South Africa . 113 parts In-Stock

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$1.715

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113

$1.715

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Microchip USA

USA . 258 parts In-Stock

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$4.458

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258

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Kepictronics

USA . 18,000 parts In-Stock

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Lixinc

USA . 9,047 parts In-Stock

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Alle Elektronik GmbH

Germany . 5,892 parts In-Stock

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Corphita

USA . 1,596 parts In-Stock

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1,596

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Parana Technologies

USA . 110 parts In-Stock

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$1.052

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110

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$1.052

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Overview

Unlock the power of innovation with the STL55NH3LL by STMicroelectronics, a high-quality Power FET designed for switching applications. With a single configuration and built-in diode, this N-channel transistor offers superior performance and reliability. Ideal for a wide range of industrial and consumer electronics, this surface-mount device delivers unmatched efficiency and durability. Experience the value and benefits of cutting-edge technology with the STL55NH3LL, setting new standards in power management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher efficiency compared to P-channel FETs, making them suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps protect the circuit from voltage spikes and reverse current flow, enhancing overall reliability.

Transistor Application: SWITCHING

Ideal for applications where fast switching speeds are required, making it suitable for power control and regulation.

Surface Mount: YES

Allows for easy and compact integration onto circuit boards, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 30 V

With a high breakdown voltage, this FET can handle higher voltages safely, offering protection against voltage spikes.

Maximum Pulsed Drain Current (IDM): 60 A

Capable of handling high current spikes efficiently, making it suitable for applications with varying load requirements.

Maximum Operating Temperature: 150 °C

Can operate in high-temperature environments without compromising performance, ensuring reliability under challenging conditions.

Technical Specifications

Power Field Effect Transistors (FET) STL55NH3LL attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

LOW THRESHOLD

Avalanche Energy Rating (EAS):

150 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

55 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.0115 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-N5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

4 W

Maximum Pulsed Drain Current (IDM):

60 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL55NH3LL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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