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STL5NK65Z

STMicroelectronics

STL5NK65Z by STMicroelectronics

STL5NK65Z by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 650V breakdown voltage, 5A max drain current, and operates at up to 150 °C. Ideal for power management in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,890 parts In-Stock

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4,890

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Chip Stock

USA . 4,450 parts In-Stock

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4,450

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Anansix

USA . 2,450 parts In-Stock

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2,450

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Vyrian

USA . 1,924 parts In-Stock

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1,924

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,299 parts In-Stock

1+ parts

$0.845

100+ parts

-

1k+ parts

$0.760

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1,299

$0.845

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$0.760

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MKK Technologies

India . 1,725 parts In-Stock

1+ parts

$1.588

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1,725

$1.588

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DigiPath Technology Company

USA . 1,725 parts In-Stock

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$1.588

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1,725

$1.588

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Kepictronics

USA . 25,958 parts In-Stock

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25,958

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A-Z Elektronik GmbH

Germany . 6,536 parts In-Stock

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6,536

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Corphita

USA . 764 parts In-Stock

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764

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Parana Technologies

USA . 244 parts In-Stock

1+ parts

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100+ parts

$1.010

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244

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$1.010

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Overview

Unlock the power of innovation with the STL5NK65Z from STMicroelectronics, a leader in semiconductor solutions. This N-channel FET delivers exceptional efficiency and reliability for your switching applications, ensuring peak performance even under demanding conditions. Designed to withstand high voltages and temperatures, it enhances your designs while minimizing energy loss. Experience unmatched quality and support, empowering your projects with cutting-edge technology that drives success.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance in terms of speed and efficiency, making this product a suitable choice for various switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances versatility for applications requiring reverse protection, simplifying circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for quick on-off operations.

Surface Mount: YES

Surface mount technology enables compact designs, making it ideal for high-density circuit boards.

Minimum DS Breakdown Voltage: 650 V

A high breakdown voltage provides robustness in demanding environments, ensuring reliability and longevity.

Package Shape: SQUARE

The square package shape optimizes heat dissipation and PCB layout, facilitating effective thermal management.

Terminal Form: NO LEAD

No lead design minimizes inductance and resistance, enhancing the performance for high-frequency applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for low power consumption and efficient switching capabilities in this device.

Maximum Pulsed Drain Current (IDM): 3 A

Capable of handling up to 3 A pulsed current, this FET is suitable for applications requiring high instantaneous current delivery.

Avalanche Energy Rating (EAS): 190 mJ

A high avalanche energy rating adds reliability under transient conditions, protecting the device from damage.

Maximum Drain Current (Abs) (ID): 5 A

With a maximum absolute drain current of 5 A, this FET can handle significant loads, enhancing its applicability.

No. of Terminals: 5

Five terminals provide the necessary connections for various configurations, improving flexibility in application.

Maximum Power Dissipation (Abs): 75 W

A high maximum power dissipation ensures the device can operate reliably under substantial thermal stress.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging enables efficient thermal performance and electrical connectivity in compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology lends itself to high efficiency and fast switching speeds, making this product suitable for modern applications.

Maximum Operating Temperature: 150 °C

A max operating temperature of 150 °C allows for use in high-temperature environments, expanding its application range.

Transistor Element Material: SILICON

Silicon as the material ensures good thermal and electrical properties, contributing to the overall performance.

Maximum Drain Current (ID): 0.76 A

While the ID is lower compared to the absolute maximum, it indicates suitability for lower power applications.

Maximum Drain-Source On Resistance: 1.8 ohm

Low on-resistance improves efficiency by minimizing power loss during operation, ensuring better overall performance.

Terminal Position: QUAD

Quad terminal positioning facilitates easier integration into various circuit layouts, enhancing design flexibility.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, suggesting appropriate handling and storage practices for reliability.

Case Connection: DRAIN

Direct drain connection simplifies the design and allows for efficient current handling in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) STL5NK65Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Avalanche Energy Rating (EAS):

190 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

.76 A

Maximum Drain-Source On Resistance:

1.8 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-XQCC-N5

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

SQUARE

Package Style (Meter):

CHIP CARRIER

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

3 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL5NK65Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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