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STL50NH3LL

STMicroelectronics

STL50NH3LL by STMicroelectronics

STL50NH3LL by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max pulsed drain current of 108 A, a breakdown voltage of 30 V, and operates at up to 150 °C. Ideal for compact power management in modern electronics.

Median Price

$0.630

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,441 parts In-Stock

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-

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$0.630

1,441

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$0.630

Distributors (In-Stock)

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Component Electronics Inc.

Canada . 100 parts In-Stock

1+ parts

$0.770

100+ parts

$0.580

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$0.500

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-

100

$0.770

$0.580

$0.500

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Digiode

USA . 3,359 parts In-Stock

1+ parts

$2.166

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3,359

$2.166

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Vyrian

USA . 3,061 parts In-Stock

1+ parts

$2.280

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3,061

$2.280

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Sogenti Electronics

Canada . 5,600 parts In-Stock

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5,600

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Anansix

USA . 687 parts In-Stock

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687

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Connector Distribution Corp

USA . 650 parts In-Stock

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650

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Right Parts Inc.

USA . 650 parts In-Stock

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650

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 4,206 parts In-Stock

1+ parts

$0.390

100+ parts

$0.370

1k+ parts

$0.360

10k+ parts

-

4,206

$0.390

$0.370

$0.360

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IDEA Electronic Components Group

UK . 1,690 parts In-Stock

1+ parts

$0.778

100+ parts

-

1k+ parts

$0.700

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1,690

$0.778

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$0.700

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MKK Technologies

India . 516 parts In-Stock

1+ parts

$1.464

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516

$1.464

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DigiPath Technology Company

USA . 516 parts In-Stock

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$1.464

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516

$1.464

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Corphita

USA . 1,959 parts In-Stock

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$2.052

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1,959

$2.052

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Kepictronics

USA . 4,255 parts In-Stock

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Perfect Parts

USA . 2,737 parts In-Stock

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2,737

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A-Z Elektronik GmbH

Germany . 2,679 parts In-Stock

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2,679

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Parana Technologies

USA . 2,286 parts In-Stock

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$0.931

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2,286

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$0.931

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Alle Elektronik GmbH

Germany . 1,457 parts In-Stock

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1,457

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Overview

Unlock the power of efficiency with the STL50NH3LL from STMicroelectronics, a trusted leader in semiconductor innovation. This N-channel Power FET is designed for seamless switching applications, delivering unmatched reliability and performance. Its compact surface-mount design saves space while handling high currents with remarkable durability. Ideal for various industrial and consumer electronics, it ensures energy savings and enhanced system performance—maximizing value for your projects!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher performance in switching applications, making this a reliable choice for efficient circuit designs.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode enhances protection against reverse voltage, increasing reliability in various applications.

Transistor Application: SWITCHING

Optimized for switching applications, this transistor delivers fast response times, making it ideal for power management and control circuits.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into automated assembly processes, saving space and reducing costs.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30 V ensures safe operation in a variety of environments, providing robust performance for power applications.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient heat dissipation and optimal layout design on PCBs.

Terminal Form: NO LEAD

No lead design minimizes footprint and enhances electrical performance, which is particularly beneficial for space-constrained applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides higher flexibility and efficiency in switching scenarios, making it suitable for various applications.

Maximum Pulsed Drain Current (IDM): 108 A

The ability to handle high pulsed drain currents makes this FET ideal for applications requiring substantial transient loads.

Avalanche Energy Rating (EAS): 150 mJ

A high avalanche energy rating increases the reliability and durability of this component under fault conditions.

Maximum Drain Current (Abs) (ID): 27 A

With an absolute maximum drain current of 27 A, this FET can efficiently handle significant loads without failure.

No. of Terminals: 5

The five terminals provide multiple connection options, enhancing design flexibility and functionality in circuits.

Maximum Power Dissipation (Abs): 60 W

The capability to dissipate up to 60 W of power allows this FET to operate efficiently without thermal issues in demanding applications.

Package Style (Meter): SMALL OUTLINE

A small outline package style is ideal for compact designs without sacrificing performance, making it suitable for modern electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures lower power consumption and high-speed operation, making this FET suitable for high-performance applications.

Maximum Operating Temperature: 150 °C

A high operating temperature threshold enhances reliability in extreme conditions, broadening application possibilities.

Transistor Element Material: SILICON

Silicon materials are known for their reliability and effectiveness in power applications, ensuring long-lasting performance.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish ensures good solderability and consistent connectivity in high-volume manufacturing.

Maximum Drain Current (ID): 13 A

With a maximum continuous drain current of 13 A, this FET is suitable for a variety of mid-power applications.

Maximum Drain-Source On Resistance: 0.015 ohm

A low on-resistance minimizes power losses and enhances efficiency, making this FET a great choice for energy-sensitive applications.

Terminal Position: DUAL

Dual terminal positioning provides design versatility and can aid in simplifying PCB layouts.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates moderate sensitivity, which ensures adequate handling requirements during production.

Case Connection: DRAIN

Drain case connection configuration allows for efficient heat distribution and improved performance in applications.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds allows for effective soldering without risking damage to the component, ensuring reliable assembly.

Peak Reflow Temperature °C: 260

The high reflow temperature capability demonstrates durability and robustness during the assembly process, enhancing product reliability.

Technical Specifications

Power Field Effect Transistors (FET) STL50NH3LL attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

LOW THRESHOLD

Avalanche Energy Rating (EAS):

150 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

27 A

Maximum Drain Current (ID):

13 A

Maximum Drain-Source On Resistance:

.015 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-N5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

108 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL50NH3LL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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