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STL23NS3LLH7

STMicroelectronics

STL23NS3LLH7 by STMicroelectronics

STL23NS3LLH7 by STMicroelectronics is a N-CHANNEL FET with 30V DS Breakdown Voltage, 368A IDM, and 0.005 ohm RDS(on). Ideal for SWITCHING applications due to ENHANCEMENT MODE operation. RECTANGULAR package style with DUAL terminals and built-in DIODE.

Median Price

$1.522

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 49 parts In-Stock

1+ parts

$1.430

100+ parts

-

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49

$1.430

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Verical

USA . 49 parts In-Stock

1+ parts

-

100+ parts

$1.613

1k+ parts

$1.613

10k+ parts

$1.613

49

-

$1.613

$1.613

$1.613

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 570 parts In-Stock

1+ parts

$1.358

100+ parts

-

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570

$1.358

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Vyrian

USA . 3,003 parts In-Stock

1+ parts

-

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3,003

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Anansix

USA . 2,510 parts In-Stock

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2,510

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,654 parts In-Stock

1+ parts

$1.036

100+ parts

-

1k+ parts

$0.932

10k+ parts

-

1,654

$1.036

-

$0.932

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Corphita

USA . 2,510 parts In-Stock

1+ parts

$1.287

100+ parts

-

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2,510

$1.287

-

-

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$1.424

100+ parts

$1.296

1k+ parts

$1.168

10k+ parts

-

450

$1.424

$1.296

$1.168

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MKK Technologies

India . 740 parts In-Stock

1+ parts

$1.948

100+ parts

-

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740

$1.948

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DigiPath Technology Company

USA . 740 parts In-Stock

1+ parts

$1.948

100+ parts

-

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740

$1.948

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AZTECH Wire

Italy . 694 parts In-Stock

1+ parts

$9.640

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694

$9.640

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S.R.D Solutions

India . 20,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,372 parts In-Stock

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4,372

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Kepictronics

USA . 3,608 parts In-Stock

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3,608

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RC Electronics

USA . 3,099 parts In-Stock

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3,099

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Parana Technologies

USA . 530 parts In-Stock

1+ parts

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$1.239

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530

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$1.239

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Overview

Discover the STL23NS3LLH7 by STMicroelectronics, a high-quality N-CHANNEL Power FET with a built-in diode that offers incredible value and benefits. Perfect for switching applications, this transistor boasts a maximum pulsed drain current of 368A and a low on-resistance of 0.005 ohm. With a durable plastic/epoxy package body and dual terminal position, this transistor is ideal for a wide range of projects. Trust STMicroelectronics for reliable, cutting-edge technology that delivers exceptional performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

Allows for efficient electron flow and low on-resistance, making it suitable for high current applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse voltage protection, which is important in certain circuit applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast switching speeds and low power dissipation.

Surface Mount: YES

Easy to mount on circuit boards, saving space and enabling automated assembly processes.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this transistor can handle high voltage applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on the circuit board, maximizing space utilization.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer higher input impedance and easier control compared to depletion mode transistors.

Maximum Pulsed Drain Current (IDM): 368 A

Capable of handling high current pulses, making it suitable for power switching applications.

No. of Terminals: 5

Provides multiple connection points for flexibility in circuit design and connectivity.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board and allows for high density mounting.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency, low power consumption, and high reliability.

Transistor Element Material: SILICON

Silicon material provides high thermal conductivity and low on-resistance, ensuring efficient operation.

Maximum Drain Current (ID): 92 A

Capable of handling high continuous current, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.005 ohm

Low on-resistance minimizes power loss and ensures efficient power switching performance.

Terminal Position: DUAL

Dual terminal position allows for easy and flexible connection options in circuit design.

Case Connection: DRAIN

Drain connection simplifies circuit design and ensures proper functionality in power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) STL23NS3LLH7 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

92 A

Maximum Drain-Source On Resistance:

.005 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

368 A

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL23NS3LLH7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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