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STH8N80FI

STMicroelectronics

STH8N80FI by STMicroelectronics

STH8N80FI by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a min breakdown voltage of 800V, a max drain current of 5.1A, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,077 parts In-Stock

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2,077

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Vyrian

USA . 1,414 parts In-Stock

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1,414

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Anansix

USA . 1,295 parts In-Stock

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1,295

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 296 parts In-Stock

1+ parts

$0.338

100+ parts

-

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$0.304

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296

$0.338

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$0.304

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MKK Technologies

India . 900 parts In-Stock

1+ parts

$0.635

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900

$0.635

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DigiPath Technology Company

USA . 900 parts In-Stock

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$0.635

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900

$0.635

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Kepictronics

USA . 27,860 parts In-Stock

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27,860

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Parana Technologies

USA . 666 parts In-Stock

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$0.404

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666

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$0.404

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Corphita

USA . 521 parts In-Stock

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521

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Overview

Unlock the power of efficiency with the STH8N80FI from STMicroelectronics, a trusted leader in semiconductor technology. This high-performance N-channel power FET excels in switching applications, delivering reliable operation with minimal energy loss. Designed for durability and precision, it’s ideal for everything from industrial controls to consumer electronics. Elevate your projects with this robust component, ensuring quality and performance you can count on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures good durability and protection against environmental factors, making this FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency in switching applications, making this transistor ideal for power management.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode enhances circuit design flexibility and minimizes component count, simplifying system integration.

Transistor Application: SWITCHING

Specifically designed for switching applications, this FET provides fast and efficient operation in various control circuits.

Minimum DS Breakdown Voltage: 800 V

A high breakdown voltage allows this FET to operate in high-voltage environments, making it suitable for industrial and power supply applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs, aiding in compact circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections and can withstand higher stress, making this FET robust for various applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for high-speed switching and improved efficiency, suitable for modern electronic applications.

Maximum Pulsed Drain Current (IDM): 35 A

The capability to handle high pulsed currents makes this FET versatile for demanding applications such as motor control and power supplies.

Avalanche Energy Rating (EAS): 800 mJ

A high avalanche energy rating allows safe operation under fault conditions, enhancing reliability in power applications.

Maximum Drain Current (Abs) (ID): 5.1 A

The maximum drain current supports a wide range of load applications, making this FET adaptable for various circuit designs.

No. of Terminals: 3

Three terminals simplify configuration and integration into circuit designs while maintaining effective functionality.

Maximum Power Dissipation (Abs): 70 W

A high power dissipation rating allows for efficient thermal management, making this FET suitable for high-power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style facilitates easy installation and enhances thermal management, ideal for heavy-duty applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables fast switching speeds and high efficiency, making this FET suitable for a variety of power applications.

Maximum Operating Temperature: 150 °C

The ability to function at elevated temperatures makes this FET reliable in high-temperature environments, enhancing its application range.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material that provides effective performance in switching and amplification applications.

Maximum Turn On Time (ton): 135 ns

Fast turn-on time allows for high-speed switching applications, crucial for efficient power management in electronic devices.

Maximum Drain Current (ID): 5.1 A

The ability to handle 5.1 A continuously suits this FET for a variety of circuit applications, including power management and signal switching.

Maximum Drain-Source On Resistance: 1.2 ohm

Low on-resistance supports lower power losses during operation, enhancing overall efficiency and thermal performance.

Terminal Position: SINGLE

Single terminal positioning simplifies circuit design and layout, providing ease of integration into existing boards.

Case Connection: ISOLATED

An isolated case connection improves safety by preventing unintentional shorts, making this FET suitable for sensitive applications.

Maximum Feedback Capacitance (Crss): 150 pF

Low feedback capacitance ensures stable operation in high-speed applications, enhancing performance in dynamic scenarios.

Technical Specifications

Power Field Effect Transistors (FET) STH8N80FI attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

800 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

5.1 A

Maximum Drain Current (ID):

5.1 A

Maximum Drain-Source On Resistance:

1.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

150 pF

JEDEC-95 Code:

TO-218

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

70 W

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

35 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn On Time (ton):

135 ns

Trade Compliance

STH8N80FI Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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