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STH315N10F7-2

STMicroelectronics

STH315N10F7-2 by STMicroelectronics

STH315N10F7-2 by STMicroelectronics is a power FET with N-channel configuration and a built-in diode. It is used for switching applications, has a min DS breakdown voltage of 100V, and can handle a max pulsed drain current of 720A.

Median Price

$5.170

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,523 parts In-Stock

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$5.170

100+ parts

$2.490

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-

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1,523

$5.170

$2.490

-

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DigiKey

USA . 875 parts In-Stock

1+ parts

$5.550

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$2.635

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$2.353

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875

$5.550

$2.635

$2.353

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Mouser Electronics

USA . 434 parts In-Stock

1+ parts

$5.550

100+ parts

$2.640

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$2.150

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434

$5.550

$2.640

$2.150

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Verical

USA . 5,000 parts In-Stock

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$1.485

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5,000

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$1.485

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Arrow

USA . 5,000 parts In-Stock

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$1.485

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5,000

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$1.485

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Avnet

USA . 1,000 parts In-Stock

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1,000

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Digiode

USA . 594 parts In-Stock

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$4.836

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594

$4.836

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Chip Stock

USA . 2,800 parts In-Stock

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2,800

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ComSIT Distribution GmbH

Germany . 2,650 parts In-Stock

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2,650

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Vyrian

USA . 1,949 parts In-Stock

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Anansix

USA . 1,517 parts In-Stock

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Nova Conductors

Japan . 30 parts In-Stock

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30

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Corohmni

South Africa . 495 parts In-Stock

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$0.631

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495

$0.631

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Aztec Data Supply Inc.

USA . 959 parts In-Stock

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$0.740

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959

$0.740

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Advanced Electronics

New Zealand . 16 parts In-Stock

1+ parts

$0.971

100+ parts

$0.923

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$0.923

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16

$0.971

$0.923

$0.923

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IDEA Electronic Components Group

UK . 750 parts In-Stock

1+ parts

$1.518

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$1.366

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750

$1.518

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$1.366

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Ampacity Inc.

Singapore . 1,867 parts In-Stock

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$2.160

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1,867

$2.160

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Semicontronic

India . 1,777 parts In-Stock

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$2.160

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$2.106

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$2.095

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1,777

$2.160

$2.106

$2.095

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MKK Technologies

India . 2,131 parts In-Stock

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$2.854

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2,131

$2.854

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DigiPath Technology Company

USA . 2,131 parts In-Stock

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$2.854

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2,131

$2.854

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Corphita

USA . 825 parts In-Stock

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$4.581

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825

$4.581

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Microchip USA

USA . 3,031 parts In-Stock

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$20.956

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3,031

$20.956

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iodParts Technologies Inc.

India . 267,000 parts In-Stock

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GreenTree Electronics

Israel . 267,000 parts In-Stock

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Lixinc

USA . 16,190 parts In-Stock

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Infinite Electronics LLP (Excess)

. 15,893 parts In-Stock

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Continental Prestige Electronics

USA . 6,561 parts In-Stock

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RC Electronics

USA . 5,125 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,701 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,669 parts In-Stock

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Argo Parts USA

USA . 4,477 parts In-Stock

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Futuretech Components

Singapore . 1,557 parts In-Stock

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1,557

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Parana Technologies

USA . 1,362 parts In-Stock

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$1.815

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1,362

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$1.815

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Overview

Discover the power of the STH315N10F7-2, a high-quality N-channel Power Field Effect Transistor (FET) manufactured by STMicroelectronics. With its single configuration and built-in diode, this transistor is perfect for switching applications. Its small outline package, gull wing terminals, and surface mount capability make installation a breeze. Boasting a minimum DS breakdown voltage of 100V and a maximum pulsed drain current of 720A, this transistor delivers exceptional performance and reliability. Whether you're designing industrial equipment or automotive systems, the STH315N10F7-2 provides the value, benefits, and advantages you need to succeed. Trust STMicroelectronics, the leader in semiconductor technology, to deliver the highest quality products for your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made with a robust plastic/epoxy package body material, ensuring durability and resistance to external elements.

Polarity or Channel Type: N-CHANNEL

With its N-channel type, this power field effect transistor offers improved conductivity and enhanced performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in this transistor allows for convenient circuit design, reducing the need for additional components and simplifying the overall system.

Transistor Application: SWITCHING

Designed specifically for switching purposes, this power FET delivers high efficiency and reliability in various electronic devices and circuits.

Surface Mount: YES

Featuring surface mount capability, this transistor enables easy installation and board assembly, optimizing production processes and reducing manufacturing costs.

Minimum DS Breakdown Voltage: 100 V

With a minimum drain-source breakdown voltage of 100 V, this power FET can handle high voltage requirements, making it suitable for demanding applications.

Package Shape: RECTANGULAR

The rectangular package shape of this transistor offers compatibility with standardized mounting and assembly techniques, ensuring seamless integration into electronic systems.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, promoting stable electrical transmission and maximizing overall performance.

Operating Mode: ENHANCEMENT MODE

Operating in the enhancement mode, this FET facilitates precise control and enables lower power consumption in various switching scenarios.

Maximum Pulsed Drain Current (IDM): 720 A

With a maximum pulsed drain current of 720 A, this power FET can reliably handle high current surges, making it ideal for demanding transient applications.

Avalanche Energy Rating (EAS): 1000 mJ

The high avalanche energy rating of 1000 mJ ensures excellent robustness and protection against voltage spikes and surges, enhancing the overall reliability of the transistor.

No. of Terminals: 2

Featuring only two terminals, this power field effect transistor simplifies circuit connections, reducing complexity and facilitating ease of use.

Package Style (Meter): SMALL OUTLINE

With its small outline package style, this power FET offers a compact design, saving valuable board space and enabling more efficient system layouts.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Built on metal-oxide semiconductor technology, this transistor provides excellent electrical properties, high switching speeds, and improved thermal stability.

Transistor Element Material: SILICON

Utilizing silicon as its transistor element material, this power FET offers high performance, reliability, and compatibility within various electronic systems.

Minimum Operating Temperature: -55 °C

Designed to operate reliably even in extreme temperature conditions, this FET has a minimum operating temperature of -55°C, ensuring versatility and durability.

Maximum Drain Current (ID): 180 A

With a maximum drain current of 180 A, this power FET is capable of handling high current loads, making it suitable for applications that require substantial power delivery.

Maximum Drain-Source On Resistance: 0.0023 ohm

With a maximum drain-source on resistance of 0.0023 ohm, this transistor minimizes power loss and improves efficiency, contributing to energy-saving designs.

Terminal Position: SINGLE

Featuring a single terminal position, this power field effect transistor offers ease of installation and simplified circuit connections, enhancing overall usability.

Case Connection: DRAIN

With its case connection on the drain terminal, this transistor simplifies thermal management by allowing direct heat dissipation, ensuring reliable and efficient operation.

Reference Standard: AEC-Q101

Compliant with the AEC-Q101 industry standard, this power FET meets stringent automotive requirements, guaranteeing high quality and reliability for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) STH315N10F7-2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA LOW RESISTANCE

Avalanche Energy Rating (EAS):

1000 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

180 A

Maximum Drain-Source On Resistance:

.0023 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

720 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STH315N10F7-2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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