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STH320N4F6-6

STMicroelectronics

STH320N4F6-6 by STMicroelectronics

STH320N4F6-6 by STMicroelectronics is a N-CHANNEL FET with 200A max drain current and 300W power dissipation. Ideal for high-power applications, it operates at up to 175 °C and features metal-oxide semiconductor technology for efficient performance in surface mount configurations.

Median Price

$4.674

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 14,000 parts In-Stock

1+ parts

$4.674

100+ parts

$3.080

1k+ parts

$2.920

10k+ parts

-

14,000

$4.674

$3.080

$2.920

-

DigiKey

USA . 909 parts In-Stock

1+ parts

$4.960

100+ parts

$2.345

1k+ parts

$1.813

10k+ parts

-

909

$4.960

$2.345

$1.813

-

Mouser Electronics

USA . 548 parts In-Stock

1+ parts

$4.960

100+ parts

$2.350

1k+ parts

$2.080

10k+ parts

-

548

$4.960

$2.350

$2.080

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Arrow

USA . 14,000 parts In-Stock

1+ parts

-

100+ parts

-

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$1.800

10k+ parts

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14,000

-

-

$1.800

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Verical

USA . 14,000 parts In-Stock

1+ parts

-

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-

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$1.800

10k+ parts

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14,000

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-

$1.800

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 269 parts In-Stock

1+ parts

$2.371

100+ parts

-

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269

$2.371

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Digiode

USA . 1,083 parts In-Stock

1+ parts

$3.616

100+ parts

-

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1,083

$3.616

-

-

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Bristol Electronics

USA . 1,988 parts In-Stock

1+ parts

-

100+ parts

$1.882

1k+ parts

$1.653

10k+ parts

-

1,988

-

$1.882

$1.653

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Dan-Mar Components

USA . 1,988 parts In-Stock

1+ parts

-

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1,988

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ACDS - Activité Composants Distribution Service

France . 988 parts In-Stock

1+ parts

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988

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Anansix

USA . 744 parts In-Stock

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744

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 743 parts In-Stock

1+ parts

$1.191

100+ parts

-

1k+ parts

$1.072

10k+ parts

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743

$1.191

-

$1.072

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MKK Technologies

India . 1,663 parts In-Stock

1+ parts

$2.240

100+ parts

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1,663

$2.240

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DigiPath Technology Company

USA . 1,663 parts In-Stock

1+ parts

$2.240

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1,663

$2.240

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Corphita

USA . 1,612 parts In-Stock

1+ parts

$3.425

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1,612

$3.425

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Microchip USA

USA . 2,620 parts In-Stock

1+ parts

$17.795

100+ parts

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2,620

$17.795

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RC Electronics

USA . 9,362 parts In-Stock

1+ parts

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9,362

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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A-Z Elektronik GmbH

Germany . 5,721 parts In-Stock

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5,721

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Perfect Parts

USA . 3,360 parts In-Stock

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3,360

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Parana Technologies

USA . 2,244 parts In-Stock

1+ parts

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100+ parts

$1.424

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2,244

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$1.424

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iodParts Technologies Inc.

India . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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Overview

Discover the cutting-edge STH320N4F6-6 Power Field Effect Transistor by STMicroelectronics, a leader in semiconductor technology. This N-CHANNEL FET boasts high performance and reliability, making it ideal for a wide range of applications. With a maximum drain current of 200 A and a power dissipation of 300 W, this transistor ensures efficient power management in various electronic systems. Trust STMicroelectronics to deliver top-notch quality and innovation, providing you with the value and benefits you need to stay ahead in today's fast-paced technological world.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs offer faster switching speeds and higher efficiency compared to P-CHANNEL FETs, making them ideal for many power applications.

Configuration: SINGLE

SINGLE configuration simplifies circuit design and enhances reliability by reducing the number of components and potential failure points.

Surface Mount: YES

Surface mount technology allows for compact and efficient layout designs, saving valuable board space and enabling high-density applications.

Maximum Drain Current (ID): 200 A

High maximum drain current capability provides the flexibility to handle demanding power requirements, making it suitable for various high-power applications.

Maximum Power Dissipation: 300 W

High maximum power dissipation ensures reliable operation under heavy load conditions, making it suitable for power-intensive applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency, low heat generation, and improved performance characteristics compared to other FET technologies.

Maximum Operating Temperature: 175 °C

High maximum operating temperature ensures stable performance in harsh thermal environments, making it suitable for industrial and automotive applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring reliable connections and longevity in various operating conditions.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for robust soldering processes, ensuring proper assembly and long-term reliability in manufacturing and assembly operations.

Technical Specifications

Power Field Effect Transistors (FET) STH320N4F6-6 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

200 A

Maximum Drain Current (ID):

200 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Trade Compliance

STH320N4F6-6 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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