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STF9NK80Z

STMicroelectronics

STF9NK80Z by STMicroelectronics

STF9NK80Z by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain-source voltage of 800V, a pulsed drain current of 30A, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,498 parts In-Stock

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4,498

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Digiode

USA . 2,477 parts In-Stock

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2,477

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Anansix

USA . 2,288 parts In-Stock

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2,288

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 981 parts In-Stock

1+ parts

$1.234

100+ parts

-

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$1.110

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981

$1.234

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$1.110

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Advanced Electronics

New Zealand . 67 parts In-Stock

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$1.704

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$1.687

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$1.619

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67

$1.704

$1.687

$1.619

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MKK Technologies

India . 1,031 parts In-Stock

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$2.320

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$2.320

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DigiPath Technology Company

USA . 1,031 parts In-Stock

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$2.320

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1,031

$2.320

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AZTECH Wire

Italy . 721 parts In-Stock

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$8.840

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721

$8.840

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Component Stockers USA

USA . 411 parts In-Stock

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$99.990

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411

$99.990

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Alle Elektronik GmbH

Germany . 3,477 parts In-Stock

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Corphita

USA . 2,478 parts In-Stock

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Parana Technologies

USA . 1,174 parts In-Stock

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$1.475

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$1.475

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Kepictronics

USA . 1,000 parts In-Stock

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Overview

Elevate your designs with the STF9NK80Z from STMicroelectronics, a leader in innovation and quality. This robust N-channel power FET ensures reliable switching performance across diverse applications, offering unparalleled efficiency and durability. With its high breakdown voltage and impressive energy ratings, it’s perfect for demanding environments. Trust STMicroelectronics for cutting-edge solutions that deliver exceptional value, empowering you to achieve excellence in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package offers excellent durability and is suitable for a wide range of applications, ensuring reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are typically more efficient than P-channel devices, allowing for better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

This configuration provides added protection and allows for more flexible circuit designs, making it suitable for various applications.

Transistor Application: SWITCHING

Designed for switching applications, this FET is optimized for fast operation, making it ideal for power control in electronics.

Minimum DS Breakdown Voltage: 800 V

A high breakdown voltage ensures reliability in high-voltage applications, safeguarding circuits from voltage spikes.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space in circuit design, making it easier to integrate into compact layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and are ideal for applications requiring high reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption and higher efficiency during normal operation, enhancing overall performance.

Maximum Pulsed Drain Current (IDM): 30 A

This high pulsed current rating enables the FET to handle transient loads effectively, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 350 mJ

A high avalanche energy rating indicates better reliability under fault conditions, providing peace of mind during operation.

Maximum Drain Current (Abs) (ID): 7.5 A

The assured maximum drain current makes it suitable for applications that require stable operation under continuous load.

No. of Terminals: 3

Having three terminals simplifies the design and connectivity options, enhancing versatility in circuit designs.

Maximum Power Dissipation (Abs): 35 W

A high power dissipation rating allows for effective heat management, making it reliable for high-power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount design ensures secure attachment and better thermal management in electronic assemblies, improving stability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and low power consumption, making it an excellent choice for modern electronic circuits.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, it can perform reliably in harsh environments without the risk of thermal failure.

Transistor Element Material: SILICON

Silicon is known for its excellent electronic properties, ensuring high performance and efficiency in power applications.

Terminal Finish: TIN

Tin finish provides good solderability and ensures long-lasting connections in assembled circuits.

Maximum Drain Current (ID): 7.5 A

The consistent maximum drain current rating ensures dependable performance across various applications.

Maximum Drain-Source On Resistance: 1.2 ohm

A low on-resistance means reduced power loss and heat generation during operation, enhancing overall efficiency.

Terminal Position: SINGLE

Single terminal configuration simplifies the design process and reduces potential points of failure.

Case Connection: ISOLATED

Isolated case connections improve safety and reduce the risk of electrical shorts, contributing to overall system reliability.

Technical Specifications

Power Field Effect Transistors (FET) STF9NK80Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

350 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

7.5 A

Maximum Drain Current (ID):

7.5 A

Maximum Drain-Source On Resistance:

1.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

30 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF9NK80Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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