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STF9N80K5

STMicroelectronics

STF9N80K5 by STMicroelectronics

STF9N80K5 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain-source voltage of 800V, a pulsed drain current of 28A, and operates from -55 °C to 150 °C. Ideal for power management in various electronic circuits.

Median Price

$1.041

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 995 parts In-Stock

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$1.700

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$1.160

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995

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Arrow

USA . 955 parts In-Stock

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$1.041

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Verical

USA . 955 parts In-Stock

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$1.041

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955

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$1.041

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Distributors (In-Stock)

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Digiode

USA . 3,007 parts In-Stock

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$1.603

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Vyrian

USA . 3,754 parts In-Stock

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Anansix

USA . 1,417 parts In-Stock

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Elcom Components

USA . 991 parts In-Stock

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Corphita

USA . 1,521 parts In-Stock

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$1.518

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$1.518

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IDEA Electronic Components Group

UK . 478 parts In-Stock

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$1.647

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$1.482

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478

$1.647

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$1.482

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$2.063

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$1.877

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$1.692

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450

$2.063

$1.877

$1.692

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MKK Technologies

India . 942 parts In-Stock

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$3.097

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DigiPath Technology Company

USA . 942 parts In-Stock

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$3.097

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AZTECH Wire

Italy . 1,102 parts In-Stock

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$10.150

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$10.150

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Microchip USA

USA . 7,257 parts In-Stock

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$18.590

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iodParts Technologies Inc.

India . 50,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 24,012 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,232 parts In-Stock

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Perfect Parts

USA . 1,288 parts In-Stock

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Parana Technologies

USA . 1,054 parts In-Stock

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$1.969

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Overview

Unleash superior performance with the STF9N80K5 from STMicroelectronics, a trusted leader in power solutions. This robust N-channel FET is engineered for efficient switching, making it ideal for high-voltage applications. With its exceptional reliability and low on-resistance, customers can experience reduced energy loss and enhanced system efficiency. Elevate your projects with a component designed for excellence and versatility—powering innovation across industries.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and environmental resistance, making the product suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer lower on-resistance and higher efficiency, making them a preferable choice for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances reliability by eliminating the need for additional components.

Transistor Application: SWITCHING

Designed for switching applications, this FET is ideal for controlling high-power loads quickly and efficiently.

Minimum DS Breakdown Voltage: 800 V

A high breakdown voltage allows this FET to operate safely in high-voltage environments, expanding its usability across various applications.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient space utilization on PCB layouts, facilitating easier integration into designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical connections, ensuring durability and reliability in demanding conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for greater control of the device, making it efficient for applications requiring precise signal switching.

Maximum Pulsed Drain Current (IDM): 28 A

The capacity to handle high pulsed currents enhances the device's performance in transient conditions, making it suitable for various power applications.

No. of Terminals: 3

A three-terminal configuration offers simplicity and ease of integration into circuit designs.

Maximum Power Dissipation (Abs): 25 W

With a maximum power dissipation of 25 W, this FET can effectively handle heat, ensuring reliability in high-power applications.

Package Style (Meter): FLANGE MOUNT

The flange mount design provides easy installation and robust mounting options, enhancing thermal performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high-speed operation and low power consumption, making it suitable for modern electronic applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature rating ensures reliability and performance in extreme thermal environments.

Transistor Element Material: SILICON

Silicon offers excellent electrical properties, providing a good balance between performance, cost, and thermal stability.

Minimum Operating Temperature: -55 °C

The capability to operate at low temperatures ensures versatility in harsh environments, suitable for aerospace and automotive applications.

Maximum Drain Current (ID): 7 A

With a maximum drain current rating of 7 A, this FET can support substantial loads within various circuits.

Maximum Drain-Source On Resistance: 0.9 ohm

A low on-resistance results in greater efficiency and lower heat generation during operation, which is critical for power management.

Terminal Position: SINGLE

A single terminal position simplifies layout and reduces the potential for errors during PCB design.

Case Connection: ISOLATED

An isolated case connection enhances safety by reducing the risk of electrical shocks and cross-talk in high-voltage applications.

Maximum Feedback Capacitance (Crss): 0.65 pF

Low feedback capacitance (Crss) allows for fast switching speeds, making this FET suitable for high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) STF9N80K5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (ID):

7 A

Maximum Drain-Source On Resistance:

.9 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.65 pF

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

28 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF9N80K5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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