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STF9NM50N

STMicroelectronics

STF9NM50N by STMicroelectronics

STF9NM50N by STMicroelectronics is an N-channel FET designed for switching applications, featuring a 500V breakdown voltage and a max drain current of 7.5A. It operates in enhancement mode with a low on-resistance of 0.56Ω. Ideal for high-efficiency power management solutions.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,154 parts In-Stock

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Digiode

USA . 2,425 parts In-Stock

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Anansix

USA . 832 parts In-Stock

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Lakeland Logistics Inc

USA . 820 parts In-Stock

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820

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Bristol Electronics

USA . 820 parts In-Stock

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820

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 394 parts In-Stock

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$1.369

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$1.232

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394

$1.369

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$1.232

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MKK Technologies

India . 2,309 parts In-Stock

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$2.574

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DigiPath Technology Company

USA . 2,309 parts In-Stock

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$2.574

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$2.574

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AZTECH Wire

Italy . 967 parts In-Stock

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$11.350

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Kepictronics

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,991 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 1,057 parts In-Stock

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Perfect Parts

USA . 736 parts In-Stock

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Parana Technologies

USA . 663 parts In-Stock

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$1.637

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Overview

Elevate your projects with the STF9NM50N from STMicroelectronics, a leader in innovative semiconductor solutions. This robust power FET delivers exceptional performance and reliability, ensuring efficient switching for a variety of applications, from industrial equipment to consumer electronics. With its built-in diode and high breakdown voltage, enjoy enhanced durability and peace of mind. Choose STF9NM50N for quality you can trust, empowering your designs with unparalleled efficiency and longevity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the transistor suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer higher efficiency and better performance in switching applications, making this product ideal for power management.

Configuration: SINGLE WITH BUILT-IN DIODE

The single configuration with a built-in diode simplifies circuit design and enhances reliability by protecting against reverse voltage transients.

Transistor Application: SWITCHING

Optimized for switching applications, this transistor excels in high-speed operational circuits, improving overall energy efficiency.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage allows this FET to operate safely in high-voltage applications, making it versatile for various power applications.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easier mounting options and effective heat dissipation, crucial for high-power applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enhances stability and mechanical strength in circuit assemblies, ensuring reliable connectivity.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for lower off-state current and higher efficiency in switching operations, crucial for modern electronic devices.

Maximum Pulsed Drain Current (IDM): 30 A

The high pulsed drain current capability enables the transistor to handle transient loads effectively, making it suitable for varied applications.

Avalanche Energy Rating (EAS): 150 mJ

A robust avalanche energy rating indicates the ability to withstand energy spikes, enhancing reliability in unpredictable conditions.

Maximum Drain Current (Abs) (ID): 7.5 A

The maximum current rating allows for substantial power handling, making it effective in multiple application scenarios.

No. of Terminals: 3

The simple 3-terminal design allows for easy integration and connections within circuit designs, reducing complexity.

Maximum Power Dissipation (Abs): 25 W

The capability to dissipate up to 25 W makes this transistor suitable for high-performance applications where managing heat is critical.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides added stability and easier installation in heat sinks, ensuring efficient heat management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enhances performance characteristics like speed and power consumption, making this FET ideal for modern electronic applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows this FET to perform reliably in extreme conditions, expanding its application range.

Transistor Element Material: SILICON

Silicon as the material ensures good electrical performance and temperature stability, making it a standard choice for power transistors.

Maximum Drain Current (ID): 7.5 A

This repeated specification confirms the device's capacity for consistent current handling, making it reliable for continuous applications.

Maximum Drain-Source On Resistance: 0.56 ohm

The low on-resistance minimizes power loss during operation, enhancing efficiency and thermal performance in circuit designs.

Terminal Position: SINGLE

Having a single terminal position simplifies design and ensures straightforward integration into varied circuit layouts.

Case Connection: ISOLATED

Isolated case connections improve safety and reduce noise in circuits, ensuring clean operation in sensitive applications.

Technical Specifications

Power Field Effect Transistors (FET) STF9NM50N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

150 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

7.5 A

Maximum Drain Current (ID):

7.5 A

Maximum Drain-Source On Resistance:

.56 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

30 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF9NM50N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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