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STF8NK85Z

STMicroelectronics

STF8NK85Z by STMicroelectronics

STF8NK85Z by STMicroelectronics is an N-channel FET designed for switching applications, featuring a max drain current of 6.7 A and a breakdown voltage of 850 V. It operates in enhancement mode with a power dissipation of 35 W. Ideal for high-voltage circuits, it ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,134 parts In-Stock

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Digiode

USA . 4,753 parts In-Stock

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Anansix

USA . 2,614 parts In-Stock

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2,614

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 354 parts In-Stock

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$1.323

100+ parts

-

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$1.191

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354

$1.323

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$1.191

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MKK Technologies

India . 597 parts In-Stock

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$2.488

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597

$2.488

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DigiPath Technology Company

USA . 597 parts In-Stock

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$2.488

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597

$2.488

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AZTECH Wire

Italy . 454 parts In-Stock

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$9.960

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454

$9.960

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Component Stockers USA

USA . 744 parts In-Stock

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$99.990

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744

$99.990

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A-Z Elektronik GmbH

Germany . 6,896 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,291 parts In-Stock

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Corphita

USA . 621 parts In-Stock

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Parana Technologies

USA . 331 parts In-Stock

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$1.582

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$1.582

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Overview

Unlock the power of efficiency with the STF8NK85Z from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This robust N-channel Power FET is designed for reliable switching applications, ensuring optimal performance in demanding environments. Benefit from its high voltage capabilities and enhanced thermal management, making it perfect for industrial automation, renewable energy systems, and consumer electronics. Choose STF8NK85Z for unmatched quality and precision in your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good insulation and durability, enhancing the reliability of the FET in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance and efficiency in switching applications, making them a favorable choice for power management.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient protection against back EMF, making it suitable for motor control and inductive load applications.

Transistor Application: SWITCHING

Designed specifically for switching, this FET can handle rapid on/off cycles, making it ideal for power electronics.

Minimum DS Breakdown Voltage: 850 V

A high breakdown voltage ensures reliable operation in high-voltage applications, providing safety margins under extreme conditions.

Package Shape: RECTANGULAR

The rectangular package shape enhances thermal performance and allows for easy integration into PCB layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical stability and are easy to solder, making assembly straightforward.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows the FET to exhibit high input impedance, which is beneficial for improved circuit performance.

Maximum Pulsed Drain Current (IDM): 26.7 A

This high pulsed current capability is advantageous for applications that require short bursts of high current, enhancing versatility.

Avalanche Energy Rating (EAS): 350 mJ

A substantial avalanche energy rating indicates robustness and reliability under transient conditions, which is critical for high-energy applications.

Maximum Drain Current (Abs) (ID): 6.7 A

This maximum current rating allows for effective power control in a variety of applications without risk of overheating.

No. of Terminals: 3

Having three terminals simplifies the circuit design and layout while maintaining necessary connectivity for efficient operation.

Maximum Power Dissipation (Abs): 35 W

A power dissipation rating of 35 W enables the FET to handle significant power loads, enhancing its applicability in demanding environments.

Package Style (Meter): FLANGE MOUNT

Flange mount style simplifies mechanical mounting and thermal management, aiding in maintaining optimal operating conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for greater efficiency and speeds in switching applications, promoting better overall circuit performance.

Maximum Operating Temperature: 150 °C

A high operating temperature rating ensures reliability and performance in challenging thermal environments, suitable for industrial applications.

Transistor Element Material: SILICON

Silicon as a material offers excellent electrical properties and thermal stability, ensuring longevity and effectiveness in various applications.

Terminal Finish: TIN

Tin finish provides excellent corrosion resistance and solderability, ensuring reliable connections in various environments.

Maximum Drain-Source On Resistance: 1.4 ohm

Low on-resistance minimizes energy loss during operation, improving overall system efficiency and reducing heat generation.

Terminal Position: SINGLE

A single terminal position offers a simplified design and layout for efficient circuit integration.

Case Connection: ISOLATED

Isolated case connection enhances safety by preventing unintended circuit interactions, making it ideal for sensitive applications.

Technical Specifications

Power Field Effect Transistors (FET) STF8NK85Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

350 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

850 V

Maximum Drain Current (Abs) (ID):

6.7 A

Maximum Drain Current (ID):

6.7 A

Maximum Drain-Source On Resistance:

1.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

26.7 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF8NK85Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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