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STF8NM60ND

STMicroelectronics

STF8NM60ND by STMicroelectronics

STF8NM60ND by STMicroelectronics is an N-channel FET designed for switching applications, featuring a 600V breakdown voltage and a max drain current of 7A. It operates in enhancement mode with a power dissipation of 25W. Ideal for high-efficiency power management solutions.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,781 parts In-Stock

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6,781

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ComSIT Distribution GmbH

Germany . 2,997 parts In-Stock

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2,997

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Digiode

USA . 1,289 parts In-Stock

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1,289

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Cyclops Electronics Ltd

UK . 700 parts In-Stock

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700

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Anansix

USA . 660 parts In-Stock

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660

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 622 parts In-Stock

1+ parts

$1.812

100+ parts

-

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$1.631

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622

$1.812

-

$1.631

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Component Stockers USA

USA . 6,650 parts In-Stock

1+ parts

$1.860

100+ parts

$1.770

1k+ parts

$1.710

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6,650

$1.860

$1.770

$1.710

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Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$1.908

100+ parts

$1.736

1k+ parts

$1.565

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-

15

$1.908

$1.736

$1.565

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MKK Technologies

India . 323 parts In-Stock

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$3.408

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323

$3.408

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DigiPath Technology Company

USA . 323 parts In-Stock

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$3.408

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323

$3.408

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AZTECH Wire

Italy . 157 parts In-Stock

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$10.270

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157

$10.270

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Kepictronics

USA . 8,000 parts In-Stock

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8,000

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Alle Elektronik GmbH

Germany . 4,754 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,680 parts In-Stock

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4,680

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Corphita

USA . 1,414 parts In-Stock

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Perfect Parts

USA . 1,344 parts In-Stock

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Epart123

USA . 700 parts In-Stock

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$2.200

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$2.000

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$2.000

700

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$2.200

$2.000

$2.000

GreenTree Electronics

Israel . 700 parts In-Stock

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700

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Parana Technologies

USA . 687 parts In-Stock

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$2.167

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687

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$2.167

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Overview

Elevate your designs with the STF8NM60ND from STMicroelectronics, a leader in semiconductor innovation. This high-quality N-channel power FET ensures reliable performance in switching applications, offering exceptional energy efficiency and robust durability. With a breakdown voltage of 600V and built-in diode, it's perfect for demanding environments. Trust STMicroelectronics for unparalleled quality and engineering excellence that drives your projects to success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer lower on-resistance and higher efficiency compared to P-channel devices, enhancing performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode protects against reverse voltage, increasing reliability in applications where reverse current is a concern.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast response times and effective performance in various circuits.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage allows this FET to operate in demanding environments, providing safety margin in circuit design.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient layout and integration into a compact design, making it easier to incorporate into existing systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical connections, making the FET suitable for high-reliability applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers higher efficiency and greater control over the drain current compared to depletion-mode devices.

Maximum Pulsed Drain Current (IDM): 28 A

Ability to handle high pulsed currents makes this FET ideal for applications with transient conditions, enhancing versatility.

Avalanche Energy Rating (EAS): 200 mJ

The avalanche energy rating indicates high reliability during transient voltage events, protecting the circuit integrity.

Maximum Drain Current (Abs) (ID): 7 A

Suitable for various applications requiring moderate current handling, ensuring dependable performance.

No. of Terminals: 3

The three-terminal configuration simplifies circuit designs while ensuring effective control and operation.

Maximum Power Dissipation (Abs): 25 W

The high power dissipation capability allows for efficient thermal management, important for reliable long-term operation.

Package Style (Meter): FLANGE MOUNT

Flange mount style facilitates easy installation and improved heat dissipation, which is critical for maintaining performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, making this FET suitable for battery-operated devices.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows this FET to function reliably in extreme environments.

Transistor Element Material: SILICON

Silicon material ensures reliability and availability, plus excellent switching characteristics for various applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring long-lasting connections.

Maximum Drain Current (ID): 7 A

Capable of handling moderate currents, this FET is versatile for various electronic applications.

Maximum Drain-Source On Resistance: 0.7 ohm

Low on-resistance translates to lower power loss during operation, enhancing the overall efficiency of the circuit.

Terminal Position: SINGLE

Single terminal position simplifies circuit design and layout, ensuring easier integration into electronic designs.

Case Connection: ISOLATED

An isolated case connection enhances safety by preventing unintended shorts, making it a reliable choice for various applications.

Technical Specifications

Power Field Effect Transistors (FET) STF8NM60ND attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Maximum Drain-Source On Resistance:

.7 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

28 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF8NM60ND Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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