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STF8NM60N

STMicroelectronics

STF8NM60N by STMicroelectronics

STF8NM60N by STMicroelectronics is an N-channel MOSFET ideal for switching applications. It features a 600V breakdown voltage, 28A pulsed drain current, and operates at up to 150 °C. This versatile FET is suitable for high-efficiency power management solutions.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,755 parts In-Stock

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2,755

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Anansix

USA . 2,384 parts In-Stock

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2,384

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Digiode

USA . 115 parts In-Stock

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115

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IDEA Electronic Components Group

UK . 1,453 parts In-Stock

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$0.973

100+ parts

-

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$0.876

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1,453

$0.973

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$0.876

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MKK Technologies

India . 2,180 parts In-Stock

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$1.830

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$1.830

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DigiPath Technology Company

USA . 2,180 parts In-Stock

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$1.830

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2,180

$1.830

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AZTECH Wire

Italy . 244 parts In-Stock

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$18.520

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244

$18.520

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Kepictronics

USA . 13,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,268 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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RC Electronics

USA . 2,925 parts In-Stock

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Corphita

USA . 2,476 parts In-Stock

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Parana Technologies

USA . 2,210 parts In-Stock

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$1.164

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$1.164

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Overview

Unlock the potential of your projects with the STF8NM60N from STMicroelectronics, a leader in semiconductor solutions. This high-quality power FET delivers superior performance for switching applications, ensuring reliability in demanding environments. With its robust construction and built-in diode, it excels in efficiency and versatility, making it ideal for industrial automation, renewable energy systems, and consumer electronics. Experience enhanced durability and peace of mind with every use!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making this transistor suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally provide higher efficiency and better performance in switching applications, making this device ideal for power management.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for additional protection against reverse polarity, enhancing reliability in circuit designs.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor can efficiently handle rapid on-off cycling, making it perfect for power distribution and control.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage indicates robustness in high-voltage applications, which expands its usability in demanding environments.

Package Shape: RECTANGULAR

The rectangular package shape allows for more efficient PCB layout and easier handling during assembly compared to other shapes.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical stability and ease of soldering, making installation straightforward.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors allow for better control over switching characteristics, thereby improving efficiency in electronic designs.

Maximum Pulsed Drain Current (IDM): 28 A

This high pulsed drain current rating allows the transistor to handle transient loads safely, making it suitable for dynamic applications.

Avalanche Energy Rating (EAS): 200 mJ

The 200 mJ energy rating offers excellent performance under avalanche conditions, adding a layer of safety in power applications.

Maximum Drain Current (Abs) (ID): 7 A

With a maximum drain current of 7 A, this FET is capable of handling substantial loads, making it suitable for various high-power applications.

No. of Terminals: 3

The three-terminal design simplifies circuit layouts while offering all necessary functionality for a single FET configuration.

Maximum Power Dissipation (Abs): 25 W

A high power dissipation capability ensures effective heat management, allowing for reliable performance even under substantial load.

Package Style (Meter): FLANGE MOUNT

Flange mount style aids in better heat dissipation and provides a stable mounting option in various applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology contributes to lower on-resistance and better switching speeds, improving overall efficiency.

Maximum Operating Temperature: 150 °C

A high operating temperature rating offers flexibility in high-temperature applications, making this FET robust in extreme environments.

Transistor Element Material: SILICON

Silicon as a material ensures good thermal conductivity and performance reliability, which is crucial in power electronics.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance, enhancing the longevity of the device.

Maximum Drain Current (ID): 7 A

Reiterated maximum drain current reinforces its capability in handling significant electrical loads in practical applications.

Maximum Drain-Source On Resistance: 0.65 ohm

Low on-resistance results in lower power losses during operation, improving energy efficiency in applications.

Terminal Position: SINGLE

A single terminal position simplifies design and layout, making it easier to integrate into various systems.

Case Connection: ISOLATED

An isolated case connection ensures minimal interference with other electronic components, enhancing overall circuit reliability.

Technical Specifications

Power Field Effect Transistors (FET) STF8NM60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Maximum Drain-Source On Resistance:

.65 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

28 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF8NM60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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