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STF8N65M5

STMicroelectronics

STF8N65M5 by STMicroelectronics

STF8N65M5 by STMicroelectronics is an N-channel FET designed for switching applications, featuring a 650V breakdown voltage and a max drain current of 7A. It operates in enhancement mode with a power dissipation of 25W. Ideal for high-efficiency power management solutions.

Median Price

$3.310

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4 parts In-Stock

1+ parts

$3.310

100+ parts

$1.498

1k+ parts

$1.127

10k+ parts

$1.048

4

$3.310

$1.498

$1.127

$1.048

Avnet

USA . 1,900 parts In-Stock

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-

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1,900

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Distributors (In-Stock)

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Digiode

USA . 4,305 parts In-Stock

1+ parts

$1.615

100+ parts

-

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4,305

$1.615

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TME

Poland . 45 parts In-Stock

1+ parts

$3.130

100+ parts

$2.200

1k+ parts

$1.710

10k+ parts

-

45

$3.130

$2.200

$1.710

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Anansix

USA . 2,763 parts In-Stock

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2,763

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Vyrian

USA . 2,722 parts In-Stock

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2,722

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ComSIT Distribution GmbH

Germany . 500 parts In-Stock

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500

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 261 parts In-Stock

1+ parts

$0.345

100+ parts

-

1k+ parts

$0.310

10k+ parts

-

261

$0.345

-

$0.310

-

MKK Technologies

India . 618 parts In-Stock

1+ parts

$0.649

100+ parts

-

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618

$0.649

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DigiPath Technology Company

USA . 618 parts In-Stock

1+ parts

$0.649

100+ parts

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618

$0.649

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Corphita

USA . 1,875 parts In-Stock

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$1.530

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1,875

$1.530

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Component Stockers USA

USA . 32 parts In-Stock

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$2.850

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32

$2.850

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Microchip USA

USA . 4,230 parts In-Stock

1+ parts

$19.760

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4,230

$19.760

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,674 parts In-Stock

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4,674

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Alle Elektronik GmbH

Germany . 4,011 parts In-Stock

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4,011

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Parana Technologies

USA . 1,983 parts In-Stock

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$0.412

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1,983

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$0.412

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Perfect Parts

USA . 1,809 parts In-Stock

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1,809

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GreenTree Electronics

Israel . 250 parts In-Stock

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250

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Overview

Unlock the power of efficiency with the STF8N65M5 from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel power FET excels in demanding applications, delivering reliability and performance for your switching needs. With its robust 650V breakdown voltage and built-in diode, it ensures durability and enhanced safety. Elevate your projects with ST's commitment to quality, maximizing value and operational excellence. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy packaging provides durability and resistance to environmental factors, making this FET reliable for long-term applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower on-resistance and are more efficient, which enhances performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier integration in circuits, providing built-in protection against back-emf in applications such as motor control.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast switching, making it ideal for power control and signal amplification.

Minimum DS Breakdown Voltage: 650 V

The high breakdown voltage allows this FET to operate safely in high-voltage applications, providing superior reliability in demanding environments.

Package Shape: RECTANGULAR

The rectangular shape of the package optimizes space on a PCB, facilitating efficient layout and organization for compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support, ensuring durable connections, particularly beneficial in high-vibration environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a positive gate voltage to conduct, which increases their efficiency in switching applications and reduces power consumption.

Maximum Pulsed Drain Current (IDM): 28 A

The high pulsed drain current rating allows the FET to handle significant current spikes, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 120 mJ

The avalanche energy rating indicates robust protection against transient voltage spikes, enhancing the reliability of circuits it is used in.

Maximum Drain Current (Abs) (ID): 7 A

This maximum drain current rating indicates the FET's capability to handle substantial loads, making it suitable for a variety of applications.

No. of Terminals: 3

The 3-terminal configuration provides straightforward integration into circuits, allowing for easy circuit design and assembly.

Maximum Power Dissipation (Abs): 25 W

The ability to dissipate up to 25 W of power ensures that this FET will operate efficiently without overheating in most applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style enhances mounting stability and heat dissipation, improving performance in high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology enables high-speed switching and low gate drive power requirements, making this product energy efficient.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows for reliable performance in extreme environments, making it versatile for various applications.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material, ensuring availability and compatibility with a range of electronic components and systems.

Maximum Drain Current (ID): 7 A

The consistency in the drain current rating ensures predictable performance and reliability across various applications.

Maximum Drain-Source On Resistance: 0.6 ohm

Low on-resistance minimizes power loss during operation, enhancing the efficiency of the overall circuit design.

Terminal Position: SINGLE

A single terminal position allows for clear circuit design and minimizes potential complications in layout.

Case Connection: ISOLATED

Isolated case connection offers enhanced safety by preventing unwanted electrical interference and ensuring stable performance.

Technical Specifications

Power Field Effect Transistors (FET) STF8N65M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

120 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Maximum Drain-Source On Resistance:

.6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

28 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF8N65M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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