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STF17NF25

STMicroelectronics

STF17NF25 by STMicroelectronics

STF17NF25 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 17 A, a breakdown voltage of 250 V, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

$1.204

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3 parts In-Stock

1+ parts

$0.869

100+ parts

-

1k+ parts

-

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3

$0.869

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Chip1Stop

Japan . 3 parts In-Stock

1+ parts

$1.540

100+ parts

-

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-

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3

$1.540

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-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 477 parts In-Stock

1+ parts

$0.817

100+ parts

-

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-

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477

$0.817

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-

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Vyrian

USA . 2,336 parts In-Stock

1+ parts

-

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2,336

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Anansix

USA . 1,157 parts In-Stock

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1,157

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3 parts In-Stock

1+ parts

$0.730

100+ parts

-

1k+ parts

-

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-

3

$0.730

-

-

-

Corphita

USA . 686 parts In-Stock

1+ parts

$0.774

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-

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-

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686

$0.774

-

-

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IDEA Electronic Components Group

UK . 2,172 parts In-Stock

1+ parts

$0.897

100+ parts

-

1k+ parts

$0.807

10k+ parts

-

2,172

$0.897

-

$0.807

-

Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$1.219

100+ parts

$1.109

1k+ parts

$1.000

10k+ parts

-

40

$1.219

$1.109

$1.000

-

MKK Technologies

India . 220 parts In-Stock

1+ parts

$1.687

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220

$1.687

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DigiPath Technology Company

USA . 220 parts In-Stock

1+ parts

$1.687

100+ parts

-

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220

$1.687

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AZTECH Wire

Italy . 1,080 parts In-Stock

1+ parts

$20.950

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1,080

$20.950

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Kepictronics

USA . 15,000 parts In-Stock

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15,000

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A-Z Elektronik GmbH

Germany . 4,911 parts In-Stock

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4,911

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Alle Elektronik GmbH

Germany . 4,515 parts In-Stock

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4,515

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Perfect Parts

USA . 1,730 parts In-Stock

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1,730

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Parana Technologies

USA . 372 parts In-Stock

1+ parts

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100+ parts

$1.072

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372

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$1.072

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Overview

Elevate your designs with the STF17NF25 from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality N-channel power FET excels in switching applications, delivering robust performance and energy efficiency. Its durable plastic packaging ensures reliability, while its compact design makes integration seamless. Trust in STMicroelectronics’ commitment to excellence, and unlock unparalleled advantages for your projects with this versatile transistor that promises enduring value and superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers good insulation and thermal stability, making it suitable for various applications while ensuring reliability.

Polarity or Channel Type: N-CHANNEL

N-channel MOSFETs generally have better performance characteristics than P-channel types, particularly in terms of lower on-resistance and higher efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides intrinsic protection against reverse voltage, enhancing reliability in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, it ensures fast response times and high efficiency in circuits.

Minimum DS Breakdown Voltage: 250 V

A high breakdown voltage of 250V ensures that the transistor can handle high voltage applications, providing more versatility in usage.

Package Shape: RECTANGULAR

Rectangular packaging allows for efficient space utilization on PCBs, making it ideal for compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer robust mechanical strength and are preferred in applications where durability is crucial.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides better control over the conductivity, allowing for minimized power loss.

Maximum Pulsed Drain Current (IDM): 68 A

The ability to handle high pulsed current makes it suitable for applications requiring rapid power switching.

Avalanche Energy Rating (EAS): 100 mJ

A higher avalanche energy rating allows the device to withstand transient spikes, ensuring protection in unstable environments.

Maximum Drain Current (Abs) (ID): 17 A

Absence of current limits the device’s applicability, allowing for safe operation under standard conditions.

No. of Terminals: 3

The three-terminal configuration simplifies integration into circuits while providing versatility in applications.

Maximum Power Dissipation (Abs): 25 W

A power dissipation capacity of 25W ensures the transistor can effectively handle significant power loads without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount design provides ease of mounting and enhances thermal management capabilities.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology enables high-speed operation and efficiency, making it ideal for modern electronic applications.

Maximum Operating Temperature: 150 °C

High operating temperature capability ensures reliability under varied thermal conditions in demanding environments.

Transistor Element Material: SILICON

Silicon technology offers excellent thermal and electrical properties, ensuring longevity and performance.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring durable connections.

Maximum Drain Current (ID): 17 A

Being able to support a maximum drain current of 17A allows this transistor to meet substantial load demands efficiently.

Maximum Drain-Source On Resistance: 0.165 ohm

Low on-resistance minimizes energy loss during operation, improving overall efficiency in power circuits.

Terminal Position: SINGLE

Single terminal positioning simplifies layout designs while maintaining effective connectivity.

Case Connection: ISOLATED

Isolated case connections provide additional safety in circuit designs by preventing unwanted interactions between the device and other components.

Technical Specifications

Power Field Effect Transistors (FET) STF17NF25 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

100 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (Abs) (ID):

17 A

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.165 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

68 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF17NF25 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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