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STF15NM60ND

STMicroelectronics

STF15NM60ND by STMicroelectronics

STF15NM60ND by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 600V breakdown voltage, 14A max drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

$10.030

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Master Electronics

USA . 14 parts In-Stock

1+ parts

$10.030

100+ parts

$2.860

1k+ parts

-

10k+ parts

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14

$10.030

$2.860

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-

Distributors (In-Stock)

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Digiode

USA . 2,076 parts In-Stock

1+ parts

$9.528

100+ parts

-

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2,076

$9.528

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Vyrian

USA . 7,950 parts In-Stock

1+ parts

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7,950

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Anansix

USA . 1,078 parts In-Stock

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1,078

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,294 parts In-Stock

1+ parts

$1.353

100+ parts

-

1k+ parts

$1.218

10k+ parts

-

1,294

$1.353

-

$1.218

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MKK Technologies

India . 1,181 parts In-Stock

1+ parts

$2.545

100+ parts

-

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1,181

$2.545

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DigiPath Technology Company

USA . 1,181 parts In-Stock

1+ parts

$2.545

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-

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1,181

$2.545

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Component Stockers USA

USA . 190 parts In-Stock

1+ parts

$5.080

100+ parts

$5.080

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190

$5.080

$5.080

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Corphita

USA . 2,528 parts In-Stock

1+ parts

$9.027

100+ parts

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2,528

$9.027

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AZTECH Wire

Italy . 39 parts In-Stock

1+ parts

$18.750

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39

$18.750

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RC Electronics

USA . 13,242 parts In-Stock

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13,242

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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A-Z Elektronik GmbH

Germany . 6,720 parts In-Stock

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6,720

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Alle Elektronik GmbH

Germany . 4,352 parts In-Stock

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4,352

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Parana Technologies

USA . 1,243 parts In-Stock

1+ parts

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100+ parts

$1.618

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1,243

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$1.618

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Overview

Elevate your projects with the STF15NM60ND from STMicroelectronics, a premier choice in Power FET technology. Renowned for quality and innovation, STMicroelectronics delivers unmatched reliability, ensuring your applications run smoothly and efficiently. This N-channel transistor offers remarkable switching performance, making it ideal for industrial and automotive uses. Benefit from its high voltage tolerance and robust design, empowering you to achieve optimal results with confidence and ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making this FET suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their higher efficiency in switching applications, providing better performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides added functionality and simplifies circuit designs, reducing component count.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for quick on/off performance.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage allows this FET to handle more demanding applications and improves reliability under stress.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient space utilization on circuit boards, making it versatile for various layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and easy soldering, enhancing reliability in assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control of the FET, providing high efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 56 A

The ability to handle pulsed currents up to 56 A means this FET can manage high current spikes, making it ideal for robust applications.

Avalanche Energy Rating (EAS): 300 mJ

A high avalanche energy rating indicates good robustness against transient conditions, enhancing overall reliability.

Maximum Drain Current (Abs) (ID): 14 A

With a maximum drain current of 14 A, this FET is capable of handling significant power loads in various applications.

No. of Terminals: 3

A three-terminal design simplifies the circuit connection and allows for straightforward integration into different systems.

Maximum Power Dissipation (Abs): 30 W

This FET's ability to dissipate up to 30 W of power ensures it remains cool under load, enhancing its durability and performance.

Package Style (Meter): FLANGE MOUNT

Flange mount style ensures secure mounting and better thermal management, which is crucial for high-performance applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and reduces power consumption, making it an excellent choice for efficient circuits.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C allows for reliable operation in high-temperature environments.

Transistor Element Material: SILICON

Silicon as the material offers a good balance between performance and cost, ensuring reliability in various applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish improves solderability and corrosion resistance, enhancing the long-term reliability of the connection.

Maximum Drain Current (ID): 14 A

This repeated specification underscores the FET's capability to drive substantial current loads, ensuring reliability in demanding applications.

Maximum Drain-Source On Resistance: 0.299 ohm

A low on-resistance reduces power loss during operation, improving overall efficiency in electronic circuits.

Terminal Position: SINGLE

Single terminal position allows for easier integration into designs and simplifies the assembly process.

Case Connection: ISOLATED

An isolated case connection enhances safety by preventing unwanted electrical interference and improving overall circuit integrity.

Technical Specifications

Power Field Effect Transistors (FET) STF15NM60ND attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

300 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

14 A

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.299 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

56 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF15NM60ND Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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