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STDP2600-ACT

STMicroelectronics

STDP2600-ACT by STMicroelectronics

STDP2600-ACT by STMicroelectronics is a consumer circuit IC featuring a 81-terminal grid array in a square plastic/epoxy package. It supports surface mount technology and has bottom ball terminals for efficient connectivity. Ideal for various consumer applications, it enhances device performance and reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,513 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,513

-

-

-

-

Anansix

USA . 2,341 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,341

-

-

-

-

Vyrian

USA . 323 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

323

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 721 parts In-Stock

1+ parts

$1.050

100+ parts

-

1k+ parts

$0.945

10k+ parts

-

721

$1.050

-

$0.945

-

MKK Technologies

India . 1,629 parts In-Stock

1+ parts

$1.974

100+ parts

-

1k+ parts

-

10k+ parts

-

1,629

$1.974

-

-

-

DigiPath Technology Company

USA . 1,629 parts In-Stock

1+ parts

$1.974

100+ parts

-

1k+ parts

-

10k+ parts

-

1,629

$1.974

-

-

-

Corphita

USA . 3,631 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

3,631

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-

-

-

Parana Technologies

USA . 1,151 parts In-Stock

1+ parts

-

100+ parts

$1.255

1k+ parts

-

10k+ parts

-

1,151

-

$1.255

-

-

Overview

Elevate your designs with the STDP2600-ACT from STMicroelectronics, a leader in semiconductor innovation. This versatile consumer IC combines reliability and performance in a compact square package, perfect for diverse applications ranging from audio systems to gaming devices. With its robust construction and advanced features, the STDP2600-ACT ensures exceptional quality and efficiency, providing you with the edge needed to create cutting-edge solutions that captivate users and drive success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making the product reliable for various applications.

Surface Mount: YES

Being surface mount compatible allows for easier and more efficient assembly processes, reducing manufacturing costs and enabling compact designs.

Package Shape: SQUARE

The square shape of the package optimizes space on printed circuit boards (PCBs), allowing for better layout flexibility and improved performance in densely packed designs.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer circuit applications, this IC is tailored to meet the performance and requirements of everyday electronic devices, ensuring effective functionality.

No. of Terminals: 81

With 81 terminals, this IC provides ample connectivity options, supporting complex circuit designs and enhancing the overall performance of consumer electronics.

Package Style (Meter): GRID ARRAY

The grid array style allows for efficient thermal management and excellent electrical performance, making it ideal for high-performance applications in consumer electronics.

Terminal Position: BOTTOM

Bottom-positioned terminals facilitate direct mounting on PCBs, allowing for better electrical connections and improving signal integrity in consumer applications.

Terminal Form: BALL

Ball terminals provide a reliable mechanical connection and excellent solderability, ensuring a secure interface that enhances the longevity and performance of the IC.

Technical Specifications

Other Function Consumer ICs STDP2600-ACT attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B81

No. of Functions:

1

No. of Terminals:

81

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Surface Mount:

YES

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

STDP2600-ACT General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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