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STDP6036-AC

STMicroelectronics

STDP6036-AC by STMicroelectronics

STDP6036-AC by STMicroelectronics is a consumer circuit IC with 128 terminals in a rectangular flatpack package. It features gull wing terminals, plastic/epoxy body material, and is surface mountable. Ideal for various consumer electronic applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,101 parts In-Stock

1+ parts

-

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1k+ parts

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4,101

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Vyrian

USA . 1,861 parts In-Stock

1+ parts

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-

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10k+ parts

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1,861

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Anansix

USA . 749 parts In-Stock

1+ parts

-

100+ parts

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749

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,227 parts In-Stock

1+ parts

$2.028

100+ parts

-

1k+ parts

$1.825

10k+ parts

-

2,227

$2.028

-

$1.825

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Corohmni

South Africa . 178 parts In-Stock

1+ parts

$2.736

100+ parts

-

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178

$2.736

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-

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MKK Technologies

India . 2,281 parts In-Stock

1+ parts

$3.813

100+ parts

-

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2,281

$3.813

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DigiPath Technology Company

USA . 2,281 parts In-Stock

1+ parts

$3.813

100+ parts

-

1k+ parts

-

10k+ parts

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2,281

$3.813

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-

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Ampacity Inc.

Singapore . 458 parts In-Stock

1+ parts

$13.800

100+ parts

-

1k+ parts

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10k+ parts

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458

$13.800

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Argo Parts USA

USA . 4,527 parts In-Stock

1+ parts

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4,527

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Corphita

USA . 2,749 parts In-Stock

1+ parts

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2,749

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A-Z Elektronik GmbH

Germany . 2,553 parts In-Stock

1+ parts

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2,553

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Continental Prestige Electronics

USA . 1,859 parts In-Stock

1+ parts

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1,859

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-

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Parana Technologies

USA . 559 parts In-Stock

1+ parts

-

100+ parts

$2.424

1k+ parts

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559

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$2.424

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Aranea Global

USA . 500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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500

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Overview

Experience the superior quality and reliability of STMicroelectronics with the STDP6036-AC. This cutting-edge consumer IC offers limitless possibilities in various applications, providing unmatched value and performance. With its advanced features and innovative design, this product delivers exceptional benefits to customers seeking top-notch solutions for their electronic needs. Trust in STMicroelectronics to elevate your projects to the next level with the STDP6036-AC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY is a common, durable, and cost-effective material for IC packages, ensuring reliability and longevity of the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost during manufacturing.

Package Shape: RECTANGULAR

Rectangular packages are space-efficient and easy to handle, making the product suitable for various applications.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer electronics applications, this IC offers tailored features and performance for consumer devices.

No. of Terminals: 128

Having a high number of terminals allows for complex circuit designs and connectivity options, expanding the functionality of the IC.

Package Style (Meter): FLATPACK

Flatpack packages offer better thermal performance and electrical characteristics, ensuring stable operation of the IC.

Terminal Position: QUAD

Quad terminal position provides good mechanical stability and ease of soldering, improving the overall reliability of the product.

Terminal Form: GULL WING

Gull wing terminals enable easy inspection and maintenance of the IC, enhancing serviceability and repairability of the product.

Technical Specifications

Other Function Consumer ICs STDP6036-AC attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PQFP-G128

No. of Functions:

1

No. of Terminals:

128

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Surface Mount:

YES

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

STDP6036-AC General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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