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STDP2600-AC

STMicroelectronics

STDP2600-AC by STMicroelectronics

STDP2600-AC by STMicroelectronics is a consumer circuit IC featuring a 81-terminal grid array in a square shape. It utilizes plastic/epoxy for its package material and supports surface mount technology. Ideal for various consumer applications, it ensures efficient performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,831 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,831

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-

-

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Digiode

USA . 2,963 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,963

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-

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Anansix

USA . 328 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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328

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,743 parts In-Stock

1+ parts

$1.350

100+ parts

-

1k+ parts

$1.215

10k+ parts

-

1,743

$1.350

-

$1.215

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MKK Technologies

India . 1,020 parts In-Stock

1+ parts

$2.538

100+ parts

-

1k+ parts

-

10k+ parts

-

1,020

$2.538

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-

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DigiPath Technology Company

USA . 1,020 parts In-Stock

1+ parts

$2.538

100+ parts

-

1k+ parts

-

10k+ parts

-

1,020

$2.538

-

-

-

A-Z Elektronik GmbH

Germany . 6,537 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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6,537

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-

-

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Corphita

USA . 2,833 parts In-Stock

1+ parts

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100+ parts

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2,833

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-

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Parana Technologies

USA . 2,108 parts In-Stock

1+ parts

-

100+ parts

$1.614

1k+ parts

-

10k+ parts

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2,108

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$1.614

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Kepictronics

USA . 1,047 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,047

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1,000

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-

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Overview

Elevate your designs with the STDP2600-AC from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile consumer IC combines quality and reliability, ensuring seamless integration into a range of applications—from home entertainment systems to smart appliances. With its advanced technology and user-friendly design, the STDP2600-AC offers exceptional performance, empowering you to create cutting-edge products that stand out in today's competitive market. Experience the benefits of superior engineering and unmatched support, making it the ideal choice for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection against environmental factors, making the IC suitable for a wide range of consumer applications.

Surface Mount: YES

Surface mount technology allows for easier integration into compact circuit designs, improving overall space efficiency in electronic devices.

Package Shape: SQUARE

The square package shape helps optimize space on the PCB and can easily fit into various layouts, enhancing versatility in design.

General IC Type: CONSUMER CIRCUIT

Being a consumer circuit IC, it is specifically tailored for consumer electronics, ensuring high performance and compatibility with everyday devices.

No. of Terminals: 81

A high number of terminals allows for more connections and functionalities, facilitating complex circuit designs and feature-rich applications.

Package Style (Meter): GRID ARRAY

The grid array style enables efficient heat dissipation and connection stability, making it ideal for high-performance consumer applications.

Terminal Position: BOTTOM

Bottom terminal positioning improves solder joint reliability and can elevate signal integrity, making it a solid choice for high-frequency applications.

Terminal Form: BALL

Ball terminal form enables a reliable soldering process and better mechanical stability, contributing to the overall durability of the component.

Technical Specifications

Other Function Consumer ICs STDP2600-AC attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B81

No. of Functions:

1

No. of Terminals:

81

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Surface Mount:

YES

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

STDP2600-AC General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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