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STD3NM60-1

STMicroelectronics

STD3NM60-1 by STMicroelectronics

STD3NM60-1 by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 600V breakdown voltage, 12A max pulsed drain current, and operates at up to 150 °C. Ideal for efficient power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,173 parts In-Stock

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3,173

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Digiode

USA . 2,106 parts In-Stock

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2,106

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ComSIT Distribution GmbH

Germany . 450 parts In-Stock

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450

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Anansix

USA . 268 parts In-Stock

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268

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,175 parts In-Stock

1+ parts

$1.779

100+ parts

-

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$1.601

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2,175

$1.779

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$1.601

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MKK Technologies

India . 596 parts In-Stock

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$3.346

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596

$3.346

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DigiPath Technology Company

USA . 596 parts In-Stock

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$3.346

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596

$3.346

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AZTECH Wire

Italy . 99 parts In-Stock

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$8.630

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99

$8.630

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Component Stockers USA

USA . 648 parts In-Stock

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$99.990

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648

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Kepictronics

USA . 28,480 parts In-Stock

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28,480

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Alle Elektronik GmbH

Germany . 4,289 parts In-Stock

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Corphita

USA . 2,302 parts In-Stock

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2,302

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Parana Technologies

USA . 856 parts In-Stock

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$2.127

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856

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$2.127

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Overview

Elevate your designs with the STD3NM60-1 from STMicroelectronics, a trusted leader in semiconductor innovation. This N-channel power FET combines exceptional reliability and performance, making it perfect for high-voltage switching applications. Enjoy the benefits of enhanced efficiency and robust thermal management, ensuring your projects deliver optimal results. Trust in STMicroelectronics for quality that powers your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is lightweight and provides good insulation, making the transistor reliable in various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics in terms of switching speed and efficiency, making them ideal for high-speed applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional protection and allows for better performance in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching, this FET is highly efficient in controlling power and can be used in various power management applications.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage ensures that the transistor can handle significant voltage levels, making it suitable for high-voltage applications.

Package Shape: RECTANGULAR

The rectangular package optimizes space usage on the PCB, allowing for compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust connections, making installation easier and enhancing reliability in permanent applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs typically have faster switching speeds and higher efficiency, making them ideal for power management and control applications.

Maximum Pulsed Drain Current (IDM): 12 A

This high pulsed drain current capability allows the transistor to handle transient conditions in applications, increasing versatility.

Avalanche Energy Rating (EAS): 200 mJ

The significant avalanche energy rating enhances the reliability of the device in over-voltage conditions, offering protection from electrical stress.

Maximum Drain Current (Abs) (ID): 3 A

A maximum drain current of 3 A is sufficient for many applications, ensuring good performance without overheating.

No. of Terminals: 3

The 3-terminal configuration simplifies the design and integrates well with various circuit designs.

Maximum Power Dissipation (Abs): 50 W

A high power dissipation rating means this FET can handle large amounts of power, making it suitable for demanding applications.

Package Style (Meter): IN-LINE

The in-line package style allows for easy integration into various circuits, enhancing usability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, making it ideal for low-power applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C ensures reliability in high-temperature environments and enhances long-term durability.

Transistor Element Material: SILICON

Silicon is a proven material for FETs, offering good electrical performance and stability.

Terminal Finish: MATTE TIN

Matte tin finishing improves solderability and reliability of connections, ensuring better performance in assembly processes.

Maximum Drain Current (ID): 3 A

This dual value reinforces the FET's capability, ensuring consistency in performance across various operating conditions.

Maximum Drain-Source On Resistance: 1.5 ohm

A low on-resistance value minimizes power losses during operation, leading to improved efficiency in switching applications.

Terminal Position: SINGLE

A single terminal position simplifies layout design in PCB applications, promoting ease of integration.

Technical Specifications

Power Field Effect Transistors (FET) STD3NM60-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

200 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

3 A

Maximum Drain Current (ID):

3 A

Maximum Drain-Source On Resistance:

1.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

12 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD3NM60-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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