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STD150NH02L-1

STMicroelectronics

STD150NH02L-1 by STMicroelectronics

STD150NH02L-1 by STMicroelectronics is an N-channel FET ideal for switching applications, featuring a max drain current of 150 A and a breakdown voltage of 24 V. It operates in enhancement mode with low on-resistance of 0.0035 Ω. This robust transistor supports high power dissipation up to 125 W.

Median Price

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6

In-Stock Inventory

1k+

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Digiode

USA . 2,895 parts In-Stock

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2,895

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Vyrian

USA . 2,620 parts In-Stock

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2,620

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Anansix

USA . 940 parts In-Stock

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940

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First Choice Components Inc.

USA . 255 parts In-Stock

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PC Components Company LLC

USA . 75 parts In-Stock

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75

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Bristol Electronics

USA . 75 parts In-Stock

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75

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IDEA Electronic Components Group

UK . 2,262 parts In-Stock

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$0.887

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$0.798

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2,262

$0.887

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$0.798

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MKK Technologies

India . 1,933 parts In-Stock

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$1.668

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$1.668

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DigiPath Technology Company

USA . 1,933 parts In-Stock

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$1.668

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$1.668

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AZTECH Wire

Italy . 551 parts In-Stock

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$19.450

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551

$19.450

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Component Stockers USA

USA . 453 parts In-Stock

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$99.990

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453

$99.990

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Alle Elektronik GmbH

Germany . 4,277 parts In-Stock

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Corphita

USA . 2,089 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,952 parts In-Stock

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Parana Technologies

USA . 597 parts In-Stock

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$1.060

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Perfect Parts

USA . 571 parts In-Stock

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Overview

Elevate your power management solutions with the STD150NH02L-1 from STMicroelectronics, a leader in innovative semiconductor technology. This robust N-channel FET delivers exceptional performance and reliability for switching applications, boasting impressive current handling and thermal capabilities. Ideal for automotive and industrial sectors, its compact design ensures easy integration while maximizing efficiency. Trust STMicroelectronics for quality and innovation that drives your projects forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making this FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and good conductivity, making them ideal for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

This configuration provides added protection against reverse polarity and enhances the reliability of the device in various circuit designs.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently control power and enhance performance in electronic devices.

Minimum DS Breakdown Voltage: 24 V

With a breakdown voltage of 24 V, this FET can operate reliably under higher voltages, making it suitable for robust designs.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space utilization on circuit boards and simplifies integration into modular designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and are easier to solder, enhancing assembly reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode provides a higher performance level for the FET when it's switched on, contributing to efficient operation in circuits.

Maximum Pulsed Drain Current (IDM): 600 A

The high pulsed drain current rating makes this FET suitable for applications requiring short bursts of high current, enhancing its versatility.

Avalanche Energy Rating (EAS): 500 mJ

With a substantial avalanche energy rating, this FET can handle energy spikes without failure, thus increasing reliability under stressful conditions.

Maximum Drain Current (Abs) (ID): 150 A

The ability to handle a maximum drain current of 150 A makes this FET ideal for high-current applications, improving overall system performance.

No. of Terminals: 3

The three-terminal design simplifies connectivity and makes it easy to integrate into a variety of circuit configurations.

Maximum Power Dissipation (Abs): 125 W

With a maximum power dissipation of 125 W, this FET can handle substantial power, making it ideal for high-performance applications.

Package Style (Meter): IN-LINE

The in-line package style allows for easy assembly in various electronic projects and provides a compact solution for circuit design.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Employing metal-oxide semiconductor technology results in lower power consumption, making this FET efficient and environmentally friendly.

Maximum Operating Temperature: 175 °C

A maximum operating temperature of 175 °C allows this FET to be used in high-temperature environments, enhancing its application range.

Transistor Element Material: SILICON

Silicon as the transistor element material ensures good electrical properties and reliability, making it a standard choice in power electronics.

Terminal Finish: MATTE TIN

The matte tin finish improves solderability and corrosion resistance, contributing to the longevity and performance of the device.

Maximum Drain Current (ID): 150 A

Matching the previous specification, the maximum drain current capacity supports high-performance functionality, vital for demanding applications.

Maximum Drain-Source On Resistance: 0.0035 ohm

A very low on-resistance minimizes power losses during operation, enhancing efficiency and overall thermal performance in circuit applications.

Terminal Position: SINGLE

Single terminal position simplifies layout and integration into various circuit designs, making it user-friendly for engineers.

Case Connection: DRAIN

With the case connection on the drain, this design allows for efficient heat dissipation and improved performance in high-load situations.

Technical Specifications

Power Field Effect Transistors (FET) STD150NH02L-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

LOW THRESHOLD

Avalanche Energy Rating (EAS):

500 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (Abs) (ID):

150 A

Maximum Drain Current (ID):

150 A

Maximum Drain-Source On Resistance:

.0035 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

600 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD150NH02L-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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