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STC5DNF30V

STMicroelectronics

STC5DNF30V by STMicroelectronics

STC5DNF30V by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 4.5 A, a breakdown voltage of 30 V, and operates at up to 150 °C. Its compact surface mount design ensures versatility in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,720 parts In-Stock

1+ parts

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6,720

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Digiode

USA . 4,667 parts In-Stock

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4,667

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Anansix

USA . 2,717 parts In-Stock

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2,717

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,185 parts In-Stock

1+ parts

$1.095

100+ parts

-

1k+ parts

$0.985

10k+ parts

-

1,185

$1.095

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$0.985

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MKK Technologies

India . 2,339 parts In-Stock

1+ parts

$2.059

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-

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2,339

$2.059

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DigiPath Technology Company

USA . 2,339 parts In-Stock

1+ parts

$2.059

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-

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2,339

$2.059

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AZTECH Wire

Italy . 1,208 parts In-Stock

1+ parts

$15.210

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1,208

$15.210

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Kepictronics

USA . 4,498 parts In-Stock

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4,498

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A-Z Elektronik GmbH

Germany . 1,832 parts In-Stock

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1,832

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Parana Technologies

USA . 1,696 parts In-Stock

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$1.309

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1,696

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$1.309

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Corphita

USA . 1,140 parts In-Stock

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1,140

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Overview

Unlock the power of efficiency with STMicroelectronics' STC5DNF30V N-Channel FET, designed for seamless switching applications. Renowned for its exceptional quality and reliability, STMicroelectronics offers unmatched performance that meets the demands of modern electronics. With a compact design and robust features, this transistor ensures optimal energy management in your projects, maximizing output while minimizing footprint. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material enhances durability and provides effective insulation, making it suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer lower on-resistance and higher electron mobility, making them ideal for high-efficiency switching applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

The separate configuration with built-in diode provides added control and protection in switching applications, enhancing circuit reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET excels in reducing power loss and improving circuit efficiency.

Surface Mount: YES

The surface-mount capability allows for compact design and simplified assembly in modern electronic circuits.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30 V ensures reliability in environments with varying voltage levels, protecting the circuit from damage.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCBs, allowing for more compact designs.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide strong mechanical stability, ensuring robust connections.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for faster switching speeds, enhancing the performance of high-frequency applications.

No. of Elements: 2

Having two elements enables the handling of higher loads and provides redundancy, ensuring reliability in operations.

Maximum Pulsed Drain Current (IDM): 18 A

A high pulsed drain current rating enables the FET to handle transient loads effectively, making it suitable for automotive and industrial applications.

Maximum Drain Current (Abs) (ID): 4.5 A

An absolute maximum drain current of 4.5 A allows for flexible design options across a range of applications without compromising performance.

No. of Terminals: 8

With 8 terminals, this FET provides multiple connection options, facilitating various circuit design configurations.

Maximum Power Dissipation (Abs): 1.3 W

A maximum power dissipation of 1.3 W indicates efficient power management, reducing heat generation during operation.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for space-efficient layouts, fitting easily into compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, enhancing overall circuit efficiency.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C guarantees reliability and performance in high-temperature environments.

Transistor Element Material: SILICON

Silicon as the element material offers excellent thermal stability and performance, making it a versatile choice for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances solderability and corrosion resistance, ensuring long-term reliability of electrical connections.

Maximum Drain Current (ID): 4.5 A

This specification reaffirms the FET's capability to manage substantial loads effectively without compromising performance.

Maximum Drain-Source On Resistance: 0.04 ohm

A low on-resistance of 0.04 ohm minimizes conduction losses, leading to improved efficiency and thermal performance.

Terminal Position: DUAL

The dual terminal position provides flexible mounting and connection options, adaptable to various PCB layouts.

Technical Specifications

Power Field Effect Transistors (FET) STC5DNF30V attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

4.5 A

Maximum Drain Current (ID):

4.5 A

Maximum Drain-Source On Resistance:

.04 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

18 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STC5DNF30V Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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