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STB95N4LF3

STMicroelectronics

STB95N4LF3 by STMicroelectronics

STB95N4LF3 by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain current of 80 A, a breakdown voltage of 40 V, and operates at up to 175 °C. Ideal for high-efficiency power management in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,204 parts In-Stock

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1,204

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Anansix

USA . 908 parts In-Stock

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908

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Vyrian

USA . 300 parts In-Stock

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300

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,082 parts In-Stock

1+ parts

$1.608

100+ parts

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$1.447

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2,082

$1.608

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$1.447

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MKK Technologies

India . 424 parts In-Stock

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$3.024

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DigiPath Technology Company

USA . 424 parts In-Stock

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$3.024

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424

$3.024

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Parana Technologies

USA . 1,934 parts In-Stock

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$1.923

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$1.923

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Corphita

USA . 556 parts In-Stock

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556

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Overview

Unlock the power of innovation with the STB95N4LF3 from STMicroelectronics, a leader in semiconductor technology. This N-channel Power FET is designed for efficiency and reliability in demanding applications like automotive and industrial systems. Enjoy superior performance with low on-resistance and high current handling, ensuring your designs run smoother and cooler. Trust STMicroelectronics for quality that drives your projects forward—where precision meets unparalleled value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances the durability and reliability of the product, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer higher efficiency and better performance compared to P-channel types, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design and protects the FET from potential damage during reverse voltage spikes.

Transistor Application: SWITCHING

Optimized for switching applications, this FET provides fast response times and improved efficiency in power management.

Surface Mount: YES

Surface mount capability allows for compact PCB design and automated assembly, contributing to reduced manufacturing costs.

Minimum DS Breakdown Voltage: 40 V

A minimum breakdown voltage of 40 V ensures robust performance in circuits that require high voltage levels.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of PCB space, optimizing layout design for better performance.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide excellent mechanical stability during and after assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation delivers enhanced characteristics over depletion mode, providing better control and performance in applications.

Maximum Pulsed Drain Current (IDM): 320 A

A high pulsed drain current capability allows this FET to handle transient loads effectively, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 400 mJ

The high avalanche energy rating contributes to improved reliability in circuits where energy management during transient conditions is crucial.

Maximum Drain Current (Abs) (ID): 80 A

With a maximum drain current of 80 A, this FET can handle significant loads, making it ideal for high-performance applications.

No. of Terminals: 2

Having only 2 terminals simplifies circuit design and allows for more compact layouts.

Maximum Power Dissipation (Abs): 110 W

A high power dissipation rating enables this FET to manage heat effectively, thereby improving reliability and performance.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for efficient use of board space, supporting designs that require high-density components.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high switching speeds and low on-resistance, providing excellent overall performance.

Maximum Operating Temperature: 175 °C

A high operating temperature rating allows for use in demanding environments, ensuring reliability over a wide temperature range.

Transistor Element Material: SILICON

Silicon material offers good thermal and electrical performance, making the product highly efficient for power applications.

Maximum Drain Current (ID): 80 A

Reiterated maximum drain current indicates consistent performance and suitability for high-current applications.

Maximum Drain-Source On Resistance: 0.009 ohm

Low on-resistance reduces power losses and enhances efficiency, making this FET ideal for energy-sensitive applications.

Terminal Position: SINGLE

Single terminal configuration streamlines designs, reducing complexity and potential points of failure.

Case Connection: DRAIN

DRAIN case connection is standard in FET applications, providing straightforward integration into existing designs.

Technical Specifications

Power Field Effect Transistors (FET) STB95N4LF3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

400 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.009 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB95N4LF3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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