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STB90NF3LL

STMicroelectronics

STB90NF3LL by STMicroelectronics

STB90NF3LL by STMicroelectronics is a powerful N-channel MOSFET designed for efficient switching applications. It features a max drain current of 80 A, a breakdown voltage of 30 V, and operates at up to 175 °C. Ideal for high-performance power management in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,544 parts In-Stock

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4,544

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Digiode

USA . 2,441 parts In-Stock

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2,441

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Anansix

USA . 1,034 parts In-Stock

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1,034

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,671 parts In-Stock

1+ parts

$0.852

100+ parts

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$0.767

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1,671

$0.852

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$0.767

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MKK Technologies

India . 613 parts In-Stock

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$1.602

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613

$1.602

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DigiPath Technology Company

USA . 613 parts In-Stock

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$1.602

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613

$1.602

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Corphita

USA . 1,821 parts In-Stock

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Parana Technologies

USA . 151 parts In-Stock

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$1.019

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151

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$1.019

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Overview

Unlock unparalleled efficiency with the STB90NF3LL from STMicroelectronics—a powerhouse in the world of N-channel Power FETs. Designed for seamless switching applications, this robust transistor delivers exceptional performance and reliability, making it ideal for automotive, industrial, and consumer electronics. With a commitment to quality and innovation, STMicroelectronics ensures each unit provides unmatched durability and low resistance, empowering your designs to achieve greater energy savings and enhanced functionality. Experience the difference with a trusted leader in semiconductor technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy in the package enhances the reliability and longevity of the component, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for higher efficiency and performance in switching applications, making them an excellent choice for fast switching circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design while providing additional protection against reverse current, improving system protection.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast response times and reliability, crucial for modern electronic systems.

Surface Mount: YES

Surface mount technology allows for compact circuit designs and efficient automated assembly, ideal for high-density PCB layouts.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30V ensures reliability during operation, allowing it to handle voltages typical in various applications.

Package Shape: RECTANGULAR

The rectangular shape enables efficient use of space on printed circuit boards, optimizing layout and design.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and a secure connection in surface mount applications, reducing the risk of failure.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides higher gain and improved performance characteristics, making it suitable for precise control applications.

Maximum Pulsed Drain Current (IDM): 320 A

The capability to handle pulsed currents of up to 320 A opens up applications in power management and high-performance switching scenarios.

Maximum Drain Current (Abs) (ID): 80 A

With a maximum absorption current of 80 A, this FET can effectively handle substantial loads, making it ideal for high-power applications.

No. of Terminals: 2

A two-terminal design allows for straightforward integration into circuits, simplifying PCB layout and minimizing complexity.

Maximum Power Dissipation (Abs): 200 W

The ability to dissipate up to 200W makes this FET capable of managing substantial power without compromising performance.

Package Style (Meter): SMALL OUTLINE

The small outline package style is perfect for applications where space is a premium, enhancing design flexibility.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and lower power consumption, contributing to overall system efficiency.

Maximum Operating Temperature: 175 °C

A high operating temperature of 175 °C ensures reliable performance in demanding environments and applications.

Transistor Element Material: SILICON

Silicon as the base material offers excellent thermal stability and a well-established performance profile in electronic devices.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and durability, ensuring reliable connections during circuit assembly.

Maximum Drain Current (ID): 80 A

This specification reiterates the robust capabilities of the FET to handle significant currents, crucial for many demanding applications.

Maximum Drain-Source On Resistance: 0.009 ohm

A low on-resistance of 0.009 ohms minimizes power loss and heat generation during operation, enhancing overall system efficiency.

Terminal Position: SINGLE

The single terminal position simplifies connections, making installation and integration straightforward, especially in compact designs.

Case Connection: DRAIN

Connecting the case to the drain helps in heat dissipation, improving the thermal management of the transistor during operation.

Technical Specifications

Power Field Effect Transistors (FET) STB90NF3LL attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.009 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB90NF3LL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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