Loading...

STB85NS04Z

STMicroelectronics

STB85NS04Z by STMicroelectronics

STB85NS04Z by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 60 A, a breakdown voltage of 33 V, and low on-resistance of 0.015 Ω. Ideal for high-performance power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,533 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,533

-

-

-

-

Anansix

USA . 2,708 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,708

-

-

-

-

Digiode

USA . 172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

172

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,688 parts In-Stock

1+ parts

$0.625

100+ parts

-

1k+ parts

$0.562

10k+ parts

-

1,688

$0.625

-

$0.562

-

MKK Technologies

India . 343 parts In-Stock

1+ parts

$1.175

100+ parts

-

1k+ parts

-

10k+ parts

-

343

$1.175

-

-

-

DigiPath Technology Company

USA . 343 parts In-Stock

1+ parts

$1.175

100+ parts

-

1k+ parts

-

10k+ parts

-

343

$1.175

-

-

-

AZTECH Wire

Italy . 1,156 parts In-Stock

1+ parts

$13.780

100+ parts

-

1k+ parts

-

10k+ parts

-

1,156

$13.780

-

-

-

Corphita

USA . 4,617 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,617

-

-

-

-

Parana Technologies

USA . 2,190 parts In-Stock

1+ parts

-

100+ parts

$0.747

1k+ parts

-

10k+ parts

-

2,190

-

$0.747

-

-

Alle Elektronik GmbH

Germany . 1,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,400

-

-

-

-

Overview

Elevate your designs with the STB85NS04Z from STMicroelectronics, a powerhouse in power FET technology. Renowned for their reliability and innovation, STMicroelectronics delivers a robust N-channel transistor that excels in switching applications. With superior performance, including up to 320 A pulsed drain current and low on-resistance, this component ensures efficient energy management, enhancing device longevity and performance across various applications. Trust in STMicroelectronics for unmatched quality and value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to harsh environments, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally offer better performance and efficiency in terms of speed and power handling, making them an ideal choice for various switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances circuit robustness and efficiency by preventing reverse current flow, reducing the need for external components.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can effectively control high power loads with minimal energy loss.

Minimum DS Breakdown Voltage: 33 V

With a minimum breakdown voltage of 33 V, this FET can operate safely in applications exposed to high voltages.

Package Shape: RECTANGULAR

The rectangular shape offers efficient space utilization on PCBs, making it easier to incorporate into densely packed designs.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides robust mechanical stability and ease of handling during assembly, ideal for prototyping and permanent installations.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for improved performance and faster switching speeds, making it suitable for modern electronic circuits.

Maximum Pulsed Drain Current (IDM): 320 A

The ability to handle high pulsed currents allows this FET to manage power surges effectively, making it suitable for high-performance applications.

Avalanche Energy Rating (EAS): 550 mJ

A higher avalanche energy rating provides increased reliability during transient conditions, making this product resilient in demanding environments.

No. of Terminals: 3

With three terminals, this FET is designed for simplified circuit integration, aiding in compact designs and efficient signal routing.

Package Style (Meter): FLANGE MOUNT

Flange mount provides ease of installation and heat dissipation, enhancing thermal management in power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high input impedance and low power consumption, making this FET suitable for battery-operated devices.

Transistor Element Material: SILICON

Silicon material ensures good thermal stability and performance reliability, which is critical in high-power applications.

Maximum Drain Current (ID): 60 A

Capable of handling high maximum drain currents, this FET is ideal for power-intensive applications requiring efficient current management.

Maximum Drain-Source On Resistance: 0.015 ohm

A low on-resistance rating translates to higher efficiency and less heat generation during operation, making it a cost-effective solution.

Terminal Position: SINGLE

Single terminal positioning simplifies PCB design and layout, facilitating easier integration into various electronic circuits.

Technical Specifications

Power Field Effect Transistors (FET) STB85NS04Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

550 mJ

Minimum DS Breakdown Voltage:

33 V

Maximum Drain Current (ID):

60 A

Maximum Drain-Source On Resistance:

.015 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB85NS04Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20