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STB80NE03L-06-1

STMicroelectronics

STB80NE03L-06-1 by STMicroelectronics

STB80NE03L-06-1 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 80 A, a breakdown voltage of 30 V, and operates at up to 175 °C. Ideal for high-power circuits with low on-resistance (0.008Ω).

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,998 parts In-Stock

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Digiode

USA . 1,491 parts In-Stock

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1,491

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Anansix

USA . 732 parts In-Stock

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732

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,489 parts In-Stock

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$1.662

100+ parts

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$1.496

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$1.662

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MKK Technologies

India . 1,384 parts In-Stock

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$3.126

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DigiPath Technology Company

USA . 1,384 parts In-Stock

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$3.126

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Corphita

USA . 4,499 parts In-Stock

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4,499

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Parana Technologies

USA . 2,159 parts In-Stock

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$1.988

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$1.988

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Overview

Unlock exceptional power management with the STB80NE03L-06-1 from STMicroelectronics. Renowned for their industry-leading quality, STMicroelectronics delivers unmatched reliability and performance in every product. This robust N-channel FET is perfect for high-efficiency switching applications, boasting a high current capacity and minimal resistance. Elevate your designs with enhanced durability, optimized thermal performance, and long-lasting value that you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and resistance to environmental factors, increasing the reliability of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are typically more efficient and provide higher performance, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the device's versatility, allowing it to handle flyback in inductive loads effectively.

Transistor Application: SWITCHING

Designed for switching applications, it provides fast operation and low on-resistance, making it suitable for power management tasks.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30V ensures reliable operation in various power applications without the risk of failure.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on circuit boards, facilitating better designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and easy soldering, enhancing assembly durability.

Operating Mode: ENHANCEMENT MODE

Enhancement-mode operation results in lower conduction losses, leading to improved efficiency in switching circuits.

Maximum Pulsed Drain Current (IDM): 320 A

A high pulsed drain current capacity of 320 A allows the transistor to handle significant power demands during brief spikes.

Avalanche Energy Rating (EAS): 600 mJ

A robust avalanche energy rating of 600 mJ ensures the part can withstand energy transients, enhancing its reliability.

Maximum Drain Current (Abs) (ID): 80 A

With a maximum drain current of 80 A, this FET is capable of handling substantial loads, making it suitable for various applications.

No. of Terminals: 3

The 3-terminal configuration ensures ease of integration into electronic circuits while maintaining compactness.

Maximum Power Dissipation (Abs): 150 W

A high maximum power dissipation rating of 150 W enables the transistor to operate efficiently without overheating.

Package Style (Meter): IN-LINE

The in-line package style provides space-saving benefits and easy handling during assembly and installation processes.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology is known for its high efficiency and fast switching capabilities, making it ideal for modern electronic circuits.

Maximum Operating Temperature: 175 °C

An operating temperature of up to 175 °C allows this FET to function reliably in high-temperature environments.

Transistor Element Material: SILICON

Silicon provides excellent performance characteristics for FETs, ensuring reliability and efficient operation across a range of applications.

Terminal Finish: TIN

Tin terminal finish enhances solderability and ensures good electrical connection with other components.

Maximum Drain Current (ID): 80 A

This specification reiterates the FET's capability to handle significant electrical current, essential for various power applications.

Maximum Drain-Source On Resistance: 0.008 ohm

A very low on-resistance of 0.008 ohm minimizes power losses during operation, improving overall circuit efficiency.

Terminal Position: SINGLE

The single terminal position simplifies design integration and provides flexibility in circuit layout.

Technical Specifications

Power Field Effect Transistors (FET) STB80NE03L-06-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

600 mJ

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.008 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB80NE03L-06-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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